• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.213-216
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• 2004

폐슬러지 실리콘과 흑연의 혼합물에 물을 주입하고 열처리하여, 마이크론 크기의 이산화 실리콘 구형입자를 제조하였다. 제조된 이산화 실리콘의 직경은 균일하고 약 $1.7\mu\textrm{m}$이다. 탄화 실리콘이 이산화 실리콘 구형입자와 함께 존재하였으며, 그 모양은 휘스커와 다면체였다. 폐슬러지 실리콘과 탄소의 혼합물을 고온에서 열처리하면 일산화 실리콘 기체가 생성된다. 물이 산소의 공급원으로 주입되면 일산화 실리콘 기체는 산소와 반응하여 이산화 실리콘 고체가 형성될 수 있다. 실리콘 공급원으로 일산화 실리콘이 반응기 내에 균일하게 분포하고 물을 주입하여 이산화 실리콘이 형성되는 메커니즘은 액상에서 수산화 실리콘 구형입자를 형성하는 메커니즘과 유사하다.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.05a
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• pp.147-151
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• 2005

실리콘 잉곳의 절단공정에서 발생하는 폐실리콘 슬러지는 실리콘과 실리콘카바이드 등의 유가자원이 함유되어 있는데, 본 연구에서는 폐실리콘 슬러지 중의 실리콘 분말을 효과적으로 분리, 회수하는 방법에 대해 검토하였다. 폐실리콘 슬러지는 상당량의 절삭유와 소량의 철분말이 포함되어 있는데 절삭유는 유기 용매에 용해시켜 효과적으로 분리하였고, 철분말은 자력선별에 의해 제거하였다. 절삭유와 철성분이 제거된 잔사인 실리콘과 실리콘 카바이드의 혼합 분말로부터 초음파 분산 선별법을 사용하여 실리콘 분말을 효율적으로 분리회수 하였다.

• Resources Recycling
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• v.17 no.4
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• pp.66-76
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• 2008

Silicon wafer is used in making semiconductor device of various forms in the semiconductor industry. Silicon wafer is produced by cutting silicon ingot and sludge containing silicon results from cutting process. The amount of silicon sludge is increasing owing to the usage of semiconductor device in many industry sectors. These days the recycling technologies of the waste silicon sludge has been widely studied from view point of economy and efficiency. In this study, patents on the recycling technologies of the waste silicon sludge were analyzed. The range of search was limited in the open patents of USA, European Union, Japan, and Korea up to september, 2007. Patents were collected using key-words and filtered by filtering criteria. The trend of the patents was analyzed by the years, countries, companies, and technologies.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2004.05a
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• pp.186-190
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• 2004

실리콘 잉곳의 절단공정에서 발생하는 폐슬러지는 실리콘과 실리콘카바이드 등의 유가자원이 함유되어 있으며, 이를 효과적으로 분리, 회수하는 방법에 대해 검토하였다. 폐슬러지에 함유된 오일은 유기 용매에 의해 용해되어 효과적으로 분리되었고, 불순물인 철분은 자력선별에 의해 제거할 수가 있었다. 또한 실리콘과 실리콘카바이드의 혼합 분말은 중액선별을 통하여 고순도의 실리콘과 실리콘카바이드로 분리할 수가 있었다.

• Resources Recycling
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• v.21 no.4
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• pp.60-68
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• 2012

Silicon wafer for making semiconductor devices and solar cell is used in the semiconductor and solar industry, respectively. Silicon wafer is produced by cutting with silicon ingot and sludge contains silicon occurs from cutting process. Generation of silicon sludge is increasing on developing all industry sectors which have need of semiconductor device. These days it has been widely studied for the recycling technologies of the silicon sludge from view points of economy and efficiency. In this paper, patents and paper on the recycling technologies of the silicon sludge were analyzed. The range of search was limited in the open patents of USA (US), European Union (EU), Japan (JP), Korea (KR) and SCI journals from 1982 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2004.05a
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• pp.98-102
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• 2004

반도체 산업용 실리콘 잉곳의 절단공정에서 발생하는 폐슬러지 중에는 고순도의 실리콘이 함유되어 있으며, 이 슬러지로부터 분리, 회수한 Si로부터 실리콘화합물 합성하였다. 고비점의 potasium alkoxide 촉매 존재하에서 금속 실리콘과 에탄을 혹은 메탄올과 같은 알코올과의 고액반응에 의해 알콕시 실란을 합성할 수가 있었다 알콕시 실란을 합성반응속도는 반응온도에 크게 의존하였고 최적반응 온도는 $180^{\circ}C{\sim}195^{\circ}C$ 정도이었다. 촉매 첨가량에 따라 알콕시 실란의 반응율이 달라졌으며, 알콕시 실란의 반응율은 최고 90%로 높은 값을 나타내었다.

• Resources Recycling
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• v.25 no.3
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• pp.11-19
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• 2016

A fundamental study to recycle a Si-Sludge and waste copper nitrate solution acid solution generated by domestic electronic industries was carried out. The waste copper nitrate solution was used as the lixiviant to leach the metals like Cu, Ca, Fe, etc. from the sludge leaving Si in the residues. The effect of reaction temperature, time and pup density on the metals leaching from the sludge was investigated. To enhance the extractability of Fe, the effect of HCl, $HNO_3$ and $H_2O_2$ introduced additionally during the leaching was also examined. Considering the leaching efficiency of Fe along with Cu, the leaching conditions comprising of 200 ~ 225 g/L pulp density and $90^{\circ}C$ temperature for 30 min were optimized. Under this condition, 98.27 ~ 99.17% Cu could be dissolved in the leach liquor with the obtained purity of Si in the residues as 98.69 ~ 98.86 %. The study revealed that the leaching of Cu contained in the Si-Sludge with the waste copper nitrate solution is a plausible approach by which the obtained leach liquor can further be treated suitably to recover Cu as the high pure value-added products.

• Resources Recycling
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• v.22 no.2
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• pp.37-43
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• 2013

Unlike the conventional slurry type wire sawing, the diamond wire sawing method adopts diamond plated wire as sawing media instead of slurry consisted of both silicon carbide and oil. Wafering with diamond plated wire leaves solid element of the sludge mostly made up of silicon, and it is not difficult to recover 95% or more of silicon by a simple separation process of oil from the sludge. In this study, silicon was recovered from the sludge by drying process and organic and metal impurities were removed by sintering process. As result 3N grade silica was obtained successfully by thermal processing utilized the fact that the recovered silicon readily combines with oxygen due to fine particle size.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.67-71
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• 2003

Sawing silicon ingot with abrasive slurry generates sludge that includes abrasive powders, cutting oil, and silicon powders. The abrasive powders and cutting oil are being separated and reused. Mixing the remained stodged silicon powders with carbon powders and subsequent heat-treatment are conducted to produce silicon carbide. The size of SiC whiskers and powders was smaller than the conventionally grown silicon carbide whiskers that were synthesized by adding micron-size metal impurities. Impurity related mechanism is attributed to the formation of the silicon carbide whiskers, as metal impurities are contained in the stodged silicon powders.

• Resources Recycling
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• v.19 no.4
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• pp.51-57
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• 2010

As a recycling of Si sludge from Si wafer process, a Si-SiC-CuO-C composite material was synthesized and investigated as an anode material for lithium batteries. The Si sludge consisted of Si, SiC, machine oil, and metallic impurities. The oil and metal impurities was removed by organic washing, magnetic separation, and acid washing. The Si-SiC-CuO-C composite from the recovered Si-SiC mixture was prepared by high-energy mechanical milling. According to the electrochemical tests such as charge-discharge capacity and cycling behavior, it showed the improved cycle performance. The SiC and CuO-related phases were presumed to restrain the volume expansion of the anode and Fe, however, should be removed below 10 ppm prior to synthesis of the composite because it caused the capacity loss of the active material itself.