• Title/Summary/Keyword: 신뢰성 성장(reliability growth)

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The Comparative Study for NHPP Software Reliability Growth Model Based on Non-linear Intensity Function (비선형 강도함수를 가진 NHPP 소프트웨어 신뢰성장 모형에 관한 비교 연구)

  • Kim, Hee-Cheul
    • Convergence Security Journal
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    • v.7 no.2
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    • pp.1-8
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    • 2007
  • Finite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault (intensity function). In this paper, intensity function of Goel-Okumoto model was reviewed, proposes Kappa (2) and the Burr distribution, which maked out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method. For model determination and selection, explored goodness of fit (the error sum of squares) The methodology developed in this paper is exemplified with a software reliability real data set introduced by NTDS (Naval Tactical Data System)

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A Study on the Factors affecting the Export Performance of Ventures (벤처기업의 수출성과 영향요인에 관한 연구)

  • Park, Woo-Sik;Kim, Dae-Ho
    • Asia-Pacific Journal of Business Venturing and Entrepreneurship
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    • v.2 no.1
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    • pp.15-36
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    • 2007
  • This study attempts to investigate about the factor affecting the export performance of Korean venture companies. The ways of data collection for this study depend on documentary records, opinion investigation of experts, and the cases. The samples for this study are investigated from the Korea Chamber of Commerce and Industry and he Ministry of Commerce about the nation's 700 the small and medium export venture companies' the business showings in December 2005. The survey executed May 10th, 2006 to May 31st, 2006, for about 22 days. The survey collected total 518 copies which included telephone request and interview researched about 269 copies, direct visits 162 copies, mail survey 87 copies. This study used 500 copies except 18 copies which don't have reliability or can handle easy. The statistical analysis techniques, which are used in survey analysis, areas follows. First, it divided 2 categories which are an export strategy and other factors, then it executed factor analysis and reliability analysis. Second, it executed multiple regression analysis which can search effect export strategy and growth in each categories.

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On the Application Plan Study of International Standard Tendency in Software Quality Testing (소프트웨어 품질 평가 국제 표준 적용 방안에 대한 연구)

  • Jung Hye-Jung
    • Journal of Internet Computing and Services
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    • v.7 no.4
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    • pp.1-10
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    • 2006
  • We are studying international standard about the software quality evaluation. The software quality has been more important on users and developers. In this paper, first, we study international tendency of the inside and outside of the country in software quality evaluation for evaluating the software quality objectively and quantitatively, Second, we notify a new direction for software quality standard of inside and outside of country. Third, we study on the testing method of software reliability for making use of the software reliability growth model. Fourth, we spread method about standard of the software quality evaluation, fifth, we research into the international standard ISO/IEC 9126 and ISO/IEC 25000 series for evaluation of software quality testing, and we propose to the application plan of software quality testing.

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The Study for NHPP Software Reliability Growth Model based on Exponentiated Exponential Distribution (지수화 지수 분포에 의존한 NHPP 소프트웨어 신뢰성장 모형에 관한 연구)

  • Kim, Hee-Cheul
    • Journal of the Korea Society of Computer and Information
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    • v.11 no.5 s.43
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    • pp.9-18
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    • 2006
  • Finite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, Goel-Okumoto and Yamada-Ohba-Osaki model was reviewed, proposes the exponentiated exponential distribution reliability model, which maked out efficiency substituted for gamma and Weibull model(2 parameter shape illustrated by Gupta and Kundu(2001) Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE, AIC statistics and Kolmogorov distance, for the sake of efficient model, was employed. Analysis of failure using NTDS data set for the sake of proposing shape parameter of the exponentiated exponential distribution was employed. This analysis of failure data compared with the exponentiated exponential distribution model and the existing model (using arithmetic and Laplace trend tests, bias tests) is presented.

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A Study of Infinite Failure NHPP Software Reliability Growth Model base on Record Value Statistics with Gamma Family of Lifetime Distribution (수명분포가 감마족인 기록값 통계량에 기초한 무한고장 NHPP 소프트웨어 신뢰성장 모형에 관한 비교 연구)

  • Kim, Hee-Cheul;Sin, Hyun-Cheul
    • Convergence Security Journal
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    • v.6 no.3
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    • pp.145-153
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    • 2006
  • Infinite failure NHPP models for a record value satisfies mode proposed in the literature exhibit either monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, propose comparative study of software reliability model using Erlang distribution, Rayleigh and Gumbel distribution. Equations to estimate the parameters using maximum likelihood estimation of infinite failure NHPP model based on failure data collected in the form of interfailure times are developed. For the sake of proposing distribution, we used to the special pattern. Analysis of failure data set using arithmetic and Laplace trend tests, goodness-of-fit test, bias tests is presented.

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Characterization of various crystal planes of beta-phase gallium oxide single crystal grown by the EFG method using multi-slit structure (다중 슬릿 구조를 이용한 EFG 법으로 성장시킨 β-Ga2O3 단결정의 다양한 결정면에 따른 특성 분석)

  • Hui-Yeon Jang;Su-Min Choi;Mi-Seon Park;Gwang-Hee Jung;Jin-Ki Kang;Tae-Kyung Lee;Hyoung-Jae Kim;Won-Jae Lee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.34 no.1
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    • pp.1-7
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    • 2024
  • β-Ga2O3 is a material with a wide band gap of ~4.8 eV and a high breakdown-voltage of 8 MV/cm, and is attracting much attention in the field of power device applications. In addition, compared to representative WBG semiconductor materials such as SiC, GaN and Diamond, it has the advantage of enabling single crystal growth with high growth rate and low manufacturing cost [1-4]. In this study, we succeeded in growing a 10 mm thick β-Ga2O3 single crystal doped with 0.3 mol% SnO2 through the EFG (Edge-defined Film-fed Growth) method using multi-slit structure. The growth direction and growth plane were set to [010]/(010), respectively, and the growth speed was about 12 mm/h. The grown β-Ga2O3 single crystal was cut into various crystal planes (010, 001, 100, ${\bar{2}}01$) and surface processed. The processed samples were compared for characteristics according to crystal plane through analysis such as XRD, UV/VIS/NIR/Spec., Mercury Probe, AFM and Etching. This research is expected to contribute to the development of power semiconductor technology in high-voltage and high-temperature applications, and selecting a substrate with better characteristics will play an important role in improving device performance and reliability.

Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder (그래핀 산화 분말을 첨가한 플렉시블 기판 솔더 접합부의 반복 굽힘 신뢰성 향상)

  • Ko, Yong-Ho;Yu, Dong-Yurl;Son, Junhyuk;Bang, Junghwan;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.43-49
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    • 2019
  • In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

A Study on the Stochastic Reliability Growth of Software (소프트웨어의 확률적 신뢰도 성장법에 관한 연구)

  • Che, Gyu-Shik;Kim, Jong-Ki
    • Proceedings of the KIEE Conference
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    • 2001.07d
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    • pp.2753-2755
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    • 2001
  • 소프트웨어 신뢰도에서 지금까지 여러 연구자들이 적용한 가정사항은 프로그램의 고장율이 잔여결함의 미지수에 대한 일정한 배수라고 한 것이다. 이는 모든 결함이 프로그램의 고장율에 동일한 양으로 기여한다는 것을 의미한다. 우리는 이 가정에 대해서 대안을 제시한다. 제안된 모델은 잔여결함을 중시하는 전의 것에 비하여 고장수정을 조기에 수행할 수 있게 함으로써 신뢰성 향상에 커다란 효과가 있다. 이 결함들이 전체적인 고장율에 가장 큰 공헌을 하기 때문에 그들 자신이 일찍이 나타나서 곧 수정될 수 있다는 장점이 있다. 모델은 취급하기가 쉬워서 다양한 신뢰도 척도를 계산할 수 있다. 목표 신뢰도를 얻기 위한 전체 수행시간과 목표 신뢰도를 얻기 위한 총 결함의 수를 예측할 수 있다.

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The Study for ENHPP Software Reliability Growth Model based on Burr Coverage Function (Burr 커버리지 함수에 기초한 ENHPP소프트웨어 신뢰성장모형에 관한 연구)

  • Kim, Hee-Cheul
    • Journal of the Korea Society of Computer and Information
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    • v.12 no.4
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    • pp.33-42
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    • 2007
  • Accurate predictions of software release times, and estimation of the reliability and availability of a software product require quantification of a critical element of the software testing process : test coverage. This model called Enhanced non-homogeneous poission process(ENHPP). In this paper, exponential coverage and S-shaped model was reviewed, proposes the Kappa coverage model, which maked out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE statistics and Kolmogorov distance, for the sake of efficient model, was employed. From the analysis of mission time, the result of this comparative study shows the excellent performance of Burr coverage model rather than exponential coverage and S-shaped model using NTDS data. This analysis of failure data compared with the Kappa coverage model and the existing model(using arithmetic and Laplace trend tests, bias tests) is presented.

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The Study for ENHPP Software Reliability Growth Model Based on Kappa(2) Coverage Function (Kappa(2) 커버리지 함수를 이용한 ENHPP 소프트웨어 신뢰성장모형에 관한 연구)

  • Kim, Hee-Cheul
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.12
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    • pp.2311-2318
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    • 2007
  • Finite failure NHPP models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. Accurate predictions of software release times, and estimation of the reliability and availability of a software product require Release times of a critical element of the software testing process : test coverage. This model called Enhanced non-homogeneous Poission process(ENHPP). In this paper, exponential coverage and S-shaped model was reviewed, proposes the Kappa coverage model, which make out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on SSE statistics and Kolmogorov distance, for the sake of efficient model, was employed. Numerical examples using real data set for the sake of proposing Kappa coverage model was employed. This analysis of failure data compared with the Kappaa coverage model and the existing model(using arithmetic and Laplace trend tests, bias tests) is presented.