• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.7
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• pp.1-6
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• 2000

In this study, the effects of the addition of $N_2$ gas into the $Cl_2$ (90)/Ar(10) gas mixture, which has been proposed as the optimized etching gas combination, for etching of platinum was performed. The selectivity of platinum film to $SiO_2$ film etch mask increased with the addition of $N_2$ gas, and etch profile over 75 $^{\circ}$ could be obtained when 20 % additive $N_2$ gas was added. These phenomena were interpreted as the results of a formation of blocking layer such as Si-N or Si-O-N on the $SiO_2$ mask. The maximum etch rate of Pt film and selectivity of Pt to $SiO_2$ are 1425 ${\AA}$/min and 1.71, respectively. These improvements were considered to be due to the formation of more volatile compounds such as Pt-N or Pt-N-Cl.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.55-56
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• 1992

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.05a
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• pp.45-45
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• 1993

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.10a
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• pp.73-73
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• 2006

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.74-76
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 2006.08a
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• pp.124-124
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• 2006

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.1
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• pp.19-24
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• 2005

In this paper, the fabrication process of Si pressure sensors utilizing piezoresistive effect was optimized. The efficiency(yield) of the fabrication process for Si piezoresistive pressure sensors was improved by conducting Si anisotrophic etching process after processes of piezoresistors and AI circuit patterns. The position and process parameters for piezoresistors were determined by ANSYS and SUPREM simulators, respectively. The measured thickness of p-type Si piezoresistors from the boron depth-profile measurement was in good agreement with the simulated one from SUPREM simulation. The Si anisotrohic etching process for diaphragm was optimized by adding ammonium persulfate(AP) to tetramethyl ammonium hydroxide (TMAH) solution.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.177-180
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• 2005

본 연구에서는 염료 감응형 태양전지의 효율 향상을 위한 유리 기판 및 전극 패턴에 따른 특성 변화와 대면적화 모듈을 위한 금속 그리드의 특성을 보여준다. 단위 셀 단위의 기본적인 재료와 기존의 제조 방법에 의해 제조된 염료 감응형 태양전지(DSC)는 높은 내부 저항으로 인하여 대면적 셀의 변환 효율은 치명적으로 저하된다. 또한 증가하는 내부 저항 감소를 위해서 외부적인 제조 공정이 추가되지 않고서는 불가능하다. 따라서 본 논문에서는 TCO(ITO) 식각, $TiO_2$ 식각, $50mm{\times}50mm$ 셀과 $100mm{\times}30mm$ 셀의 특성 비교 실험을 통해서 변환 효율 상승효과를 얻었고 광전류 포집 향상을 기대하기 위해 Pt 그리드를 이용해 current correcting line을 증착시켰다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.448-451
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• 2003

This study describes a new maskless nano-fabrication technique of Si (100) using the combination of nanometer-scale mechanical forming by nano-indenter XP and KOH wet etching. First the surface of a Si (100) specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact, some sample structures were fabricated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.628-631
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• 2003

This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.