• Title/Summary/Keyword: 스페클 패턴

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Optical switching by use of a multimode waveguide and hologram filters (다중모드 도파로와 홀로그램 필터를 이용한 광신호 교환)

  • Shin, Dong-Hak
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.1
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    • pp.199-203
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    • 2005
  • We present a method to implement a $M{\times}N$ switching system by use of an $M{\times}1$ multimode waveguide and N hologram filters. The pass of optical signals is provided by an $M{\times}1$ multimode waveguide. The complex speckle patterns generated from the multimode waveguide are recorded into the N hologram filters and used as the code for destination. The feasibility of our method is experimentally demonstrated.

A Study on the Vibration Characteristics Analysis of Composite Materials by Using Electronic Speckle PatternInterferometry Method (전자처리 스페클 패턴 간섭법을 이용한 복합재료의 진동 특성 해석에 관한 연구)

  • 김형택;정현철;양승필
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.388-392
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    • 1995
  • The Electronic Speckle Pattern Interferometry(ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. Composite materials have various complicated characteristics depending on the ply materials,ply orientations,ply stacking sequences and boundary conditions. Therefore, it is difficult to analyze composite material. For efficient use of composit materials in engineering applications, the dynamic behavior such as, natural frequencies and modal patterns should be identified. This studying presents FEM results for the free vibration of symmetrically laminated composite as [30/-30/90] $_{s}$. The natural frequencies of laminated composite rectangular plates having the boundary condition(:2-edge clamped) are experimentally obtained. In order to demonstrate the validity of the experiment,FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculated by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.t.

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Ideal Phase map Extraction Method and Filtering of Electronic Speckle Pattern Interferometry (ESPI 에서의 이상적인 위상도 추출과 필터링 방법)

  • 유원재;이주성;강영준;채희창
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.235-238
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    • 2001
  • Deformation phase can be obtained by using Least-Square Fitting. In extraction of phase values, Least-Square Fitting is superior to usual method like as 2, 3, 4-Bucket Algorithm. That can extract almost noise-free phase and retain 2$\pi$discontinuities. But more fringe in phase map, 2$\pi$ discontinuities is destroyed when that is filtered and reconstruction of deformation is not reliable. So, we adapted Least-Square Fitting using an isotropic window in dense fringe. using Sine-Cosine filter give us perfect 2$\pi$discontinuities information. We showed the process and result of extraction of phase map and filtering in this paper.

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Development Non-contact Laser Measuring System for Vibration Analysis of Structures (구조물의 진동 해석을 위한 비접촉 레이저 계측 시스템 개발)

  • 정현철;김경석;최정석;김성식;강기수;정승택;최태호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.911-914
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    • 2003
  • The non-contact laser measurement system what can be used for the vibration analysis of structures is discussed. There are few systems using laser speckle interferometer for vibration analysis. One of these systems is the Electronic Speckle Pattern Interferometer (ESPI). With ESPI system, one can obtain the vibration mode shape qualitatively and the maximum vibration amplitude quantitatively of the structure at each resonance frequency. In this paper, the phase-shifting ESPI system with stroboscopic illumination for measuring vibration mode shapes is constructed and the operating software is programmed. The results are compared with that of commercial ESPI system.

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Measurement of Tensile Properties of Copper foil using ESPI technique (ESPI 기법을 이용한 동 박막의 인장 특성 측정)

  • 권동일;허용학;김동진;박준협;기창두
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1059-1062
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    • 2003
  • Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

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Determination of Elastic Modulus by Time Average ESPI and Euler-Bernoulli Equation (Time Average ESPI와 Euler-Bernoulli 방정식에 의한 탄성계수 측정)

  • Kim, Koung-Suk;Lee, Hang-Seo;Kang, Young-June;Kang, Ki-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.7 s.196
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    • pp.69-74
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    • 2007
  • The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

A Study on the Inner Defect Inspection for Semiconductor Package by ESPI (ESPI를 이용한 반도체 패키지 내부결함 검사에 관한 연구)

  • Jung, Seung-Tack;Kim, Koung-Suk;Yang, Seung-Pil;Jung, Hyun-Chul;Lee, You-Hwang
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1442-1447
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    • 2003
  • Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

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A Study on the Rotating Displacement Measurement of Rigid Body by ESPI Method (ESPI법에 의한 강체 회전 변위 측정에 관한 연구)

  • 김경석;홍명석
    • Transactions of the Korean Society of Automotive Engineers
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    • v.1 no.2
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    • pp.125-133
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    • 1993
  • Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

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A Study on Measurement and Analysis of In-Plane Deformations by Using Laser Speckle Interferometry (I) (레이저 스페클 간섭법을 이용한 면내 변형 측정 및 해석에 대한 연구 (I))

  • 강영준;노경완;강형수
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.11
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    • pp.121-129
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    • 1998
  • In-plane ESPI(Electronic Speckle Pattern Interferometry) was devised to measure in-plane deformations and rotation of a specimen with laser in this study. ESPI is a optical measuring method to be able to measure the deformations of engineering components and materials in industrial fields. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. And the 4-frame phase shifting method was used for the quantitative analysis. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between the experiment results and those of the FEA(Finite Element Analysis).

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Deformation Characteristics Analysis of 3-Unit Fixed Partial Dentures by Using Electronic Speckle Pattern Interferometry (전자처리 스페클 패턴 간섭법(ESPI)을 이용한 3-유닛 고정성 국소의치의 변형특성 분석)

  • Kang, Hoo-Won;Lee, Chul-Min;Yang, Seung-Pil;Kim, Hee-Jin
    • Journal of Technologic Dentistry
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    • v.35 no.1
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    • pp.49-56
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    • 2013
  • Purpose: The deformation characteristics induced by non-destructive stresses using piezoelectric transducer(PZT) were analyzed for 3-unit fixed partial dentures manufactured PFM, Everest(CAD/CAM) and Zirkonzahn(copy milling, MAD/MAM) by electron speckle pattern interferometery(ESPI). Methods: The ESPI analysis after loading the restoration with PZT by applying electric voltage of 900mV at the points of 10 mm above the base of the prostheses. Results: PFM and All-Ceramic Everest prostheses showed about 0.1 ${\mu}m$ while that of All- Ceramic Zirkonzahn prostheses showed 0.085 ${\mu}m$, demonstrating that Zirkonzahn displaced less. For PFM and All-Ceramic Zirkonzahn prostheses, the displacements were large at just below the loading point, while generalize displacement was shown over the loading point and weak connector areas for All-Ceramic Everest prostheses. Conclusion: We could find that the deformation characteristics induced by non-destructive stresses using PZT analyzed by ESPI were similar to the fracture strengths evaluated using universal testing machine.