• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.3
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• pp.1002-1007
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• 2012

The manufacturing method of the pillar is one of the main process where it is used in vacuum glazing and semi-conductor display field. Pillar can be arranged by screen printing method. However it may unable to spread all pattern of metal mask according to the ingredient of the mixture. In addition, spreaded mixture doesn't maintain the original shape according to the viscosity. In this research, the pillar tried to be arranged through the screen printing by using the inorganic compound of the alumina and silica base. This study suggested a method in which it can decrease the test frequency and design the composition of the vacuum glass pillar by using the mixture design.

• Clean Technology
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• v.14 no.1
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• pp.14-20
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• 2008

In this study we have manufactured and characterized the low temperature calcined phosphor paste that can be used as a flat light source for LCD BLU. For the phosphor paste, the low temperature calcined acryl resin was used as the binder. From the result of thermal decomposition measurement, residual carbonaceous materials was found to be less than 0.1 wt% at $400^{\circ}C$. A flat light source device that was made by screen printing using the manufactured paste showed a near 100% luminous efficiency compared to the luminance of the phosphor.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.263-272
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• 2013

Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.14-21
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• 2003

Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.76-77
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• 2013

스마트폰 화면의 대형화와 테블릿 PC 비중 확대와 더불어 모바일용 터치스크린의 평균 면적이 확대됨에 따라 휴대폰 터치 글라스상의 ITO의 단락을 방지하기 위하여 carbon black을 이용한 스퍼터링 공법을 진행하였으며, 최적 증착 조건 도출 및 기존 인쇄 방식과 대등한 투과도 수치를 확보하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.413-413
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• 2008

최근 잉크젯, 스크린, 그라비아 등 기존의 인쇄 방식과 인쇄 기술을 이용하여 저가의 전자회로 혹은 전자 소자를 제조하고자 프린팅 소재 및 공정 개발에 대한 산업계의 관심이 증가하고 있다. 특히 PCB, RFID, 디스플레이, 태양전지 분야의 전극재료의 개발에 많은 연구가 진행 중에 있으며, 다양한 인쇄 방법 중 미세회로의 구현이 가능한 잉크젯 프린팅을 통한 전극 형성방법에 주목하고 있다. 본 연구는 잉크젯 프린팅 방식을 통해 배선을 형성하고자 이에 적합한 다양한 농도의 잉크를 배합하여 평가하였으며, 첨가제 및 소결, 건조 조건의 변화를 통해 기재와의 부착력, 배선의 크랙을 조절하였다.

• Journal of the Korean Graphic Arts Communication Society
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• v.28 no.1
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• pp.65-75
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• 2010

Environmentally friendly, stencil and screen printing for cost-effective for maskless. In this study, UV -LED light source for the dispersion characteristics and high competence photoresist coating was prepared. Wavelength of 365nm UV-LED exposure device using the maskless lithography, 1.7kgf/$cm^2$ $2600mmH_2O$ the injection pressure and the suction pressure by using a dry photoconductor symptoms were dry emulsion on the market as a result, curing properties and adhesion, hardness, solvent resistance and excellent reproduction of fine patterns and ecological stencil technology was available and could be confirmed as a possibility.

• Journal of the Korean Graphic Arts Communication Society
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• v.26 no.1
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• pp.73-85
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• 2008

We have manufactured a photoresist which has excellent dispersity and good applying property due to 330cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with CRT light source. Then it was developed by air spray with $1.7kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were worse than those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making was 0.5 mm since the exposure system for maskless plate making has weak light intensity and the diffusion of light. But we could obtain maskless screen plate which has sharp edges of line image and confirm a possibility of dry development process by air spray method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.42-43
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• 2006

LTCC 후막공정에서 일반적으로 사용되고 있는 스크린 프린팅 방법은 낮은 정밀도와 100um 이하의 선폭을 구현하는 데 한계를 보이고 있다. 이에 따라서 보다 미세한 라인을 형성 할 수 있는 반도체 미세라인 공정기술을 후막 공정에 응용한 후막 리소그라피 기술 (thick-film lithography technology)이 전자부품의 소형화에 대한 방안으로 연구 되고 있다. 본 연구에서는 후막 리소그라피 기술에 사용되는 감광성 Silver 페이스트에 영향을 미치는 각기 다른 크기와 형상의 Silver 파우더들과 인쇄 후 표면의 roughness 개선을 위한 여러 종류의 첨가제들을 첨가하여 최적의 조성을 연구 하였으며, 그린시트와 페이스트의 매칭성을 해결하기 위해서 Tg가 다른 글라스 파우더를 첨가하였다. 또한 전면 인쇄 한 후에 건조, 노광, 현상, 적층, 소성 과정을 걸치는 후막 리소그라피 기술을 이용하여 소성 후 20um이하의 선폭을 가지는 내장형 패턴 구현하였으며 투과엑스레이와 O/S 테스트 통하여 우수한 특성을 확인 할 수 있었다.

• Clean Technology
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• v.14 no.1
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• pp.21-28
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• 2008

The properties of the dispersion of the red, green, and blue pigments were investigated for the manufacture of the millbase of LCD color filters. Their physical properties and viscosity were controlled to apply to the screen printing in order to substitute the existing photolithography method. The best dispersion properties were obtained with dispersant BYK-2000 and monomer EB-140. The millbase was pre-mixed at 500 rpm for 30 min, and dispersed at 4000 rpm for 5 - 6 hour by Torus Mill. The resulting particle sizes were $100{\sim}110\;nm$ for red, $50{\sim}70\;nm$ for green, and $60{\sim}80\;nm$ for blue. When the millbase viscosity was 200-300 cps in the low viscosity formulation, an efficient impact of the beads on pigments was achieved. The dispersion properties were confirmed from the rheological behavior and color characteristics.