Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)
- Volume 2 Issue 2
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- Pages.14-21
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- 2003
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- 1598-6721(pISSN)
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- 2288-0771(eISSN)
Development of Build-up Printed Circuit Board Manufacturing Process Using Functional Prototype Fabrication Technology
기능성 시작품 제작기술을 이용한 빌드업인쇄회로기판의 제조 공정기술 개발
- Published : 2003.06.30
Abstract
Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.
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