Numerical Study on Package Warpage as Structure Modeling Method of Materials for a PCB of Semiconductor Package (반도체 패키지용 PCB의 구조 모델링 방법에 따른 패키지의 warpage 수치적 연구)
-
- Journal of the Microelectronics and Packaging Society
- /
- v.25 no.4
- /
- pp.59-66
- /
- 2018