• Title/Summary/Keyword: 세정액

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Recycling Technique of Nano $TiO_2$-Coated Silica-bead for Waste Water Treatment (나노광촉매가 코팅된 실리카 비드의 재생 연구)

  • Do, Young-Woong;Ha, Jin-Wook
    • Proceedings of the KAIS Fall Conference
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    • 2009.05a
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    • pp.874-877
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    • 2009
  • 본 연구에서는 수용액 내의 오염물질 분해를 위하여 개발한 광촉매가 코팅된 실리카 비드의 광분 해반응 사용에 따른 활성저하 문제를 해결하기 위하여 반응에 사용한 비드의 활성을 향상시킬 수 있는 재생 방법에 관한 실험을 수행하였다. 비드의 재생방법으로 표면 세정법을 선택하였으며, 세정액으로는 물(증류수), 계면활성제, 아세톤 등 세정력이 서로 다른 3종의 용액을 사용하였다. 재생 과정은 서로 다른 3종의 세정액으로 반응에 사용하여 활성이 떨어진 비드를 세정한 후, 소성온도를 $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$로 달리하여 30분간 처리하였다. 재생 처리과정은 각 1~3회 반복 수행하였으며, 서로 다른 조건에서 재생된 비드의 활성은 수용액 내의 methylene blue 광분해율로 측정하였다. 연구결과, 재생한 비드의 활성은 아세톤으로 세정한 후, $100^{\circ}C$에서 30분간 소성하였을 때 가장 우수한 것으로 나타났으며, 이러한 기초 연구결과를 토대로 현재보다 효율적인 재생 기술에 관한 연구를 수행 중에 있다.

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The study about accelerating Photoresist strip under plasma (플라즈마 약액 활성화 방법을 이용한 Photoresist strip 가속화 연구)

  • Kim, Soo-In;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.17 no.2
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    • pp.113-116
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    • 2008
  • As the integration in semiconductor display develops, semiconductor process becomes multilayer. In order to form several layer patterns, etching process which uses photoresistor (PR) must be performed in multilayer process. Repeated etching processes which take long time and PR residue cause mortal problems in semiconductor. To overcome such problems, we studied about the solution which eliminates PR effectively by using normal dry and wet etching method using plasma activated PR strip solvent in liquid condition. At first, we simulate the device which activates the plasma and make sure whether gas flow in device is uniform or not. Under activated plasma, etching effect is elevated. This improvement reduces etching time as well as display production time of semiconductor process. Generally, increasing etching process increases environmental hazards. Reducing etching process can save the etchant and protect environment as well.

Study on Coagulant Application for Calcium Ammonium Nitrate Extraction of Denitrification Scrubber Waste Cleaning Solution (탈질 스크러버 폐 세정액에 포함된 질안석회 추출을 위한 응집제 적용 연구)

  • Lee, Hyun Suk;Song, Woon Ho
    • Journal of the Korean Applied Science and Technology
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    • v.34 no.2
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    • pp.289-295
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    • 2017
  • The International Maritime Organization (IMO) in accordance with the regulations with respect to the combustion gases, such as NOx, SOx generated by the marine engine. The combustion gases must be equipped with a device to reduce emissions from all ships passing through the Baltic SECAs. In Korea, the International Maritime Organization (IMO) and the development of a device for NOx, SOx reduction. Scrubber is used in the ammonia water and the Urea solution in the waste water. The waste water containing ammonium nitrate and ammonium sulfate, react of the NOx and SOx gas. In this study, the recovery of by-product, which contains the waste water was used as an organic solvent extraction method of salting out. Ammonium nitrate and ammonium sulfate, the recovery process. A qualitative analysis of the collected by-product FT-IR analysis. Through the elemental analysis and SEM-EDS, characteristic evaluation was performed with an impurity.

Cleaning Behavior of Aqueous Solution Containing Amine or Carboxylic Acid in Cu-interconnection Process (아민과 카르복실산이 함유된 수계용액의 구리 배선 공정의 세정특성)

  • Ko, Cheonkwang;Lee, Won Gyu
    • Korean Chemical Engineering Research
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    • v.59 no.4
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    • pp.632-638
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    • 2021
  • With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH2) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

Development of a Bioscrubber for Treatment of VOC Emissions from Contaminated Soil with Hydrocarbons (유류오염토양으로부터 발생하는 VOC가스처리를 위한 바이오스크러버 개발)

  • 장윤영;황경엽;곽재호;최대기
    • Journal of Korea Soil Environment Society
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    • v.2 no.1
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    • pp.83-90
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    • 1997
  • Aiming at the treatment of large volumes of gas with a low concentration of poorly water soluble VOC(Volatile Organic Compound), a new system is proposed: the combination absorption tower/bioreactor. In the scrubber part of the bioscrubbing system, the contaminating compounds are absorbed in a aqueous phase. The contaminated scrubbing liquid is transported to the bioreactor, where the compounds are biodegraded by aerobic microorganisms (mainly to carbon dioxide, water, and biomass). In this study, separation of a volatile organic compound(VOC) out of a waste gas stream has been carried out using a re-cyclable high boiling point extrant(HBE). The liquid stream containing a high boiling point entrant(HBE) scrubs the gas stream in a direct gas-liquid countercurrent contacting operation in a packed tower for the removal of said component from the gaseous stream. A packed-bed column using Pall Ring was set up in order to simulate practical conditions for the scrubbing tower. The liquid stream transported to the bioreactor is recovered and recycled to the scrubber. The model gas, which contained 400 mg/$\textrm{m}^3$ of toluene, at a rate of 100 L/min, flowed into the packed column where the scrubbing liquid trickled over the packing in countercurrent to the rising gas at 10~15L/min. The bioscrubber designed for large volume air streams containing VOCs showed removal efficiency up to 80% in an optimum operating conditions during the tests fer removing toluene from an air stream by scrubbing the air stream with HBE.

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레이저 유기 충격파를 이용한 나노 Trench 에서의 나노입자제거

  • Kim, Jin-Su;Lee, Seung-Ho;Park, Jin-Gu
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.25.1-25.1
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    • 2009
  • Pattern 웨이퍼 상의 오염입자 제거는 반도체 산업의 주된 과제 중 하나이다. Pattern의 선폭이 좁아짐에 따라 Pattern에 손상을 가하지 않고 오염입자를 제거 하는 것은 더욱 어려워지고 있다. 그뿐만 아니라 기존 습식세정 공정에서의 화학액에 의한 환경오염 및 박막의 손실도 문제가 되기 시작했다. 이러한 문제를 해결하기 위해 기존 세정공정에서 화학액의 농도를 낮추고 Megasonic 등을 이용하여 세정력을 보완하는 방법들이 연구되고 있다. 하지만 습식세정의 경우 강한 화학작용으로 인한 표면 손상 및 물 반점의 문제는 여전히 이슈가 되고 있다. 이러한 단점을 극복하기 위하여 건식 세정법이 제시되고 있으며 이 중 레이저 충격파는 레이저를 집속시켜 발생된 충격파를 이용하여 입자를 제거하기 때문에 국부적인 세정이 가능하며 세정력 조절이 가능하여 손상이 세정을 할 수 있다. 그러나 Pattern의 구조에 의해 전되는 세정력의 차이가 발생하고 Trench 내부의 오염입자제거 문제점이 발생할 수 있다. 시편은 Si STI Pattern을 100 nm PSL Particle (Red Fluorescence, Duke Scientific, USA) 을 50ppm 농도로 희석시킨 IPA에 dipping 하여 오염시킨 후 N2 Gas를 이용하여 건조하여 준비하였다. 그리고 레이저 충격파 세정 시스템은 최대 에너지 1.8 J까지 가능한 레이저를 발생하는 1,064 nm Nd:YAG 레이저를 이용하여 실험하였다. 레이져 충격파 실험은 충격파와 시편사이의 거리, gap distance와 에너지를 변환하여 세정효율을 관찰하였다. 세정효율은 세정 전후의 입자 감소량을 현광현미경 (LV-150, Nikon, Japan)를 이용하여 측정하였다. 그 결과, Trench 내부의 오염입자의 경우 Trench 밖의 오염입자에 비해 세정효율이 떨어지는 것으로 나타났으나 시편과 레이저 초점과의 거리가 가까워짐에 따라 Trench 내부의 오염입자에 대한 세정 효율을 증가시킬 수 있었다.

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Fabrication and Characterization of Gas-liquid Hybrid Reactor Equipped with Atmospheric Pressure Plasma (기-액 하이브리드 대기압 플라즈마 반응기 제작 및 특성 분석)

  • Kwon, Heoung Su;Lee, Won Gyu
    • Korean Chemical Engineering Research
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    • v.60 no.3
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    • pp.452-458
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    • 2022
  • Three types of gas-liquid hybrid horizontal, vertical and needle-to-cylinder plasma reactors were fabricated. Through these reactors, a high-efficiency, eco-friendly cleaning concept that generates reactive active species generated in atmospheric plasma discharge and gas-liquid activation reaction of cleaning components through the potential difference within the electrode was presented. As a result of comparing the efficiency for cleaning performance, the needle-to-cylinder type reactor had the best characteristics. Through this study, it was confirmed that the gas-liquid hybrid atmospheric pressure plasma reactor has the potential to be applied to ultra-precision cleaning processes such as semiconductor processes.