• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Applied Chemistry for Engineering
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• v.22 no.5
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• pp.501-507
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• 2011

To develop environmental-friendly insulating composite materials, natural cellulose and porous ceramic balls were used as core materials and activated Hwangtoh was used as a binder. Various specimens were prepared with different water/binder ratios and core material/binder ratios. The physical properties of these specimens were then investigated through compressive strengths, flexural strengths, absorption test, hot water resistance test, pore analysis, thermal conductivity, and observation of micro-structures using scanning electron microscope. Results showed that the maximum compressive strength varied appreciably with the water/binder ratios and core material/binder ratios, but the flexural strength increased with the core material/binder ratios regardless of water/binder ratios. The compressive strength and the flexural strength measured after the hot water resistance test decreased remarkably compared to those measured before test. The pore analysis measured after the hot water resistance test showed that total pore volume, porosity and average pore diameter decreased, while bulk density increased by the acceleration of hydration reaction of binder in the hot water. The thermal conductivity decreased gradually with an increase of core material/binder ratios. It can be evaluated that the composite insulation materials having good insulating properties and mechanical strengths can be used in the field.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.91-96
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• 2021

The enhancement of thermoelectric figure of merit was achieved by the simple processes of sieving and high energy ball milling, respectively, which are enable to reduce the grain size of n-type Bi₂Te₃ thermoelectric materials. By optimizing the grain size, the electrical conductivities and thermal conductivities were controlled. In this study, spark plasma sintering was employed for hindering the grain growth during the sintering process. The thermoelectric figure of merit was measured to be 0.78 in the samples with 30 min high energy ball milling process. Notably, this value was 40 % higher than that of pristine Bi₂Te₃ sample. This result shows the properties of thermoelectric materials can be readily controlled by optimization of grain size via simple ball milling process.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.80-80
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• 2009

패키징 구조의 발전이 점차 중요한 문제로 대두되어, 칩의 집적 기술의 발전에 따라 실장기술에서도 고속화, 소형화, 미세피치화, 고정밀화, 고밀도화가 요구되고있다. 최근 선진국을 중심으로 전자 전기기기 및 부품의 실장기술에서도 환경 친화적인 기술을 요구함에 따라, 저에너지 공정 및 무연 실장 기술에 대한 연구가 활발하게 진행되고 있다. 기존의 SOP(Small Out-line Package), QFP(Quad Flat Package) 등은 소형화, 다핀화, 고속화, 실장성에 한계가 있기 때문에, SMT(Surface Mount Technology) 형식으로 된 BGA(Ball Grid Array)가 휴대형 전화를 비롯한 기타 전자 부품 실장에 널리 사용되고 있다. BGA ball shear 법은 BGA 모듈의 생산 및 취급 중에 발생할지도 모르는 기판에 수평으로 작용하는 기계적인 전단력에 BGA solder ball이 견딜 수 있는 정도를 측정하기 위해 사용되는 시험법이다. 전단 시험에 의한 전단 강도의 측정 외에 전기전도도 측정, 파면 관찰, 이동거리(displacement), 유한요소 해석법 등을 병행하여 시험법의 신뢰성 향상에 대한 연구가 이루어지고 있다. 본 실험에서는 지름이 $500{\mu}m$인 Sn-3.5Ag 솔더볼을 이용하여 세라믹 기판을 접합하여 BGA 패키지를 완성하였다. 상부 기판에 솔더볼을 정렬시켜 리플로우 방법으로 접합 한 후 솔더볼이 접합된 상부 기판과 하부 기판을 접합 하여 시편을 제작하였다. 접합된 시편들은 $150^{\circ}C$에서 0~800시간 열처리를 실시하였고, 열처리를 하면서 각각 $3{\times}10^2A/cm^2,\;5{\times}10^3A/cm^2$의 전류를 인가하였다. 시편들을 전단 시험기를 이용하여 솔더볼의 기계적 특성 평가를 하였으며, 계면 반응을 관찰하였다.

• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.45-50
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• 2004

Hydroxyapatite (HA) ceramics with the Ca/P ratios of 1.62, 1.67 and 1.72 were prepared and their dissolution behaviors in distilled water at $37^{\circ}C$ were investigated. It appeared that surface dissolution of the ceramics was initiated from grain boundaries after 3 days of immersion in water. Following 10 days of immersion, microstructural disintergration of HA was severs for non-stoichiometric compounds, I.e Ca/P ratios of 1.62 and 1.72. Notably, a micron-sized circular cavity similar to lacunae, which can be generally formed in osteoclastic resorption process, was observed.

• Journal of the Korean Ceramic Society
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• v.35 no.10
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• pp.1055-1060
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• 1998

The effects of particle size distribution have been investigated on the high frequency low loss Mn-Zn fer-rites. The particle size distribution was controlled by milling time. Zirconia ball and engineering plastic jar were employed to avoid iron contamination from the milling media. As increasing the milling time BET value was increased from 0.55 to 3.21m2/g and mean particle size was decreased from 2.1 $\mu\textrm{m}$ to 1.0$\mu\textrm{m}$ The large specific surface area of initial powder resulted in the high density of sintered core. However starting powders with high BET lead to inhomogeneous grain growth as well as poor electromagnetic pro-perties at sintering temperature above 1300$^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.196-199
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• 2000

마이크로파용 세라믹 유전체로 사용되는 MgTiO$_3$-CaTiO$_3$계 유전체에 Li을 첨가하여 이때 얻어지는 마이크로파 유전특성과 소결특성에 대하여 알아보았다. 94MgTiO$_3$-6CaTiO$_3$으로 주조성을 고정시키고 여기에 Li$_2$CO$_3$를 Li원자 기준으로 0 ~ 10 mol% 범위 안에서 첨가하여 1200~140$0^{\circ}C$의 온도에서 4시간 소결하였다. Li의 첨가량이 적을 때에는 유전체의 품질계수와 유전상수가 모두 감소하였으나 약 lmol% 이상 되면 다시 증가하였으며, 이후 첨가량이 과도해지면 다시 서서히 감소하는 경향을 볼 수 있었다. 1.0 ~ 3.0 mol%의 첨가량 범위 안에서 Li은 MgTiO$_3$-CaTiO$_3$계 유전체의 품질계수를 증가시켜주는 역할을 하는 것으로 나타났다 1.5mol%의 Li을 첨가하고 1275$^{\circ}C$에서 4시간 소결한 시편에서 유전상수는($\varepsilon$$_{r}$) 20.0, Qf는 78,000 그리고 공진주파수 온도계수($\tau$$_{f}$)는 -1.6ppm/$^{\circ}C$의 결과를 얻을 수 있었다.다.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.476-480
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• 2004

AZO (Al-doped ZnO) thin films were deposited on glass by pulsed magnetron sputtering method, and their structural, electrical and optical properties were investigated. XRD patterns showed that a highly c-axis preferred AZO film was grown in perpendicular to the substrate when pulse frequency of 30 ㎑ was applied to the target. Microstructure of thin films showed that the fibrous grain of tight dome shape was grown. The deposition rate decreased linearly with increase of pulse frequency, and the lowest resistivity was 8.67${\times}$10$\^$-4/ $\Omega$-cm for the film prepared at pulse frequency of 30 ㎑. The optical transmittance spectra of the films showed a very high transmittance of 85∼90%, within visible wavelength region and exhibited the absorption edge of about 350 nm. The characteristics of the low electrical resistivity and high optical transmittance of AXO films suggested a possibility for the application to transparent conducting oxides.

• Journal of the Korean Ceramic Society
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• v.36 no.2
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• pp.178-185
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• 1999

For the process control of silicon nitride gelcasting, the composition effect of acryamide system on the viscosity of slip and mechanical property of gelcast green body were investigated. The slip was prepared by ball milling of silicon nitride suspension prepared with acrylamide monomer and polyelectrolyte dispersant after premixing them by attritor. The slip mixed with initiator was vacuum deaired and cast into molds, and then polymerized. The consolidated green body was obtained by drying the gelated slip. The viscosity measument and the diametral compression test was done to evaluate the rheological behaviro of slip and mechanical property of gelcast body, respectively. Experimental results showed that the high solid loading of silicon nitride slip was obtained up to 46 vol% with a low viscosity. The mechanical property of gelcast body mainly increased with increasing the concentration of monomer. The gelcast body was machinable above the ∼3 MPa of tensile strength. The relative density of pressured-sintered body was 98.5% at 1760$^{\circ}C$, 3 h.