• Title/Summary/Keyword: 성형재료

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플라스틱 사출 성형 불량 해결을 위한 지식형 시스템 개발

  • 오정열;허용정
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2004.05a
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    • pp.191-194
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    • 2004
  • 본 연구는 차세대 반도체 칩 패키징 재료로 검토되고 있는 열가소성 수지(Thermoplastic resin)의 사출성형에 있어서의 불량과 그에 따른 해결책을 Visual Basic을 이용하여 전산 정보화함으로써 성형 불량 대책을 제공하는 지적 결정 시스템을 개발하였다. 체계적인 기술이 정립되어 있지 않는 플라스틱 성형의 문제점을 최소화하고 재료비 절감 설계 납기일 단축, 제품 품질 향상을 그 목적으로 하고 있다.

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Paticulate Processing for High Tech Materials and Advanced Forming (첨단기술 재료와 신성형방법을 위한 분말 공정)

  • 문인형
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 1993.11a
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    • pp.1-1
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    • 1993
  • 분말야금 또는 분말재료공정은 금속과 세라믹에 기초를 둔 신소재 가공기술로서 점차 그 역할이 증대되고 있다. 분말 공정은 합금의 신축성이라는 고유 잇점을 비롯하여, 조성적 균질성, 미세한 조직특성, 그리고 완성 또는 준 완성형태의 성형가능성 등을 제공하는 것으로 특징지워지는데 이러한 모든 것들은 첨단 재료의 제조가공을 위해서 요구되는 특징들이다. 본 강연의 전반부에서는 분말야금공정의 일반적 특징과 이제까지 개발된 첨단 재료들을 분류하고 그 현황을 살펴보았다. 강연의 후반부에서는 기계적 합금화, 고온등압성형, SHS, 금속사출성형과 같은 첨단 분말 공정을 간단하게 소개한다. 이들 새로운 공정은 대부분의 금속 및 세라믹 신소재의 제조가공기술로 도입되어 널리 응용되고 있다. 오늘날 분말재료공정은 신소재를 얻는 신기술 또는 신공정의 동의어로 이해되고 있다. 그러나 미래에 있어서도 더욱 새로운 첨단재료를 개발하는 데는 이러한 분말야금공정에 크게 의존하지 않을 수 없을 것이다.

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Evaluation of Mechanical Properties of Molding Materials Recycled Using Film Packaging Wastes (폐필름 포장재 재활용 성형재료의 역학적 특성 평가)

  • Kwon, Seung-Jun;Lim, Hee-Seob;Yang, Keun-Hyeok;Yoon, Hyun-Sub
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.6 no.4
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    • pp.342-348
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    • 2018
  • The present study examined the various strength and deformation performances of molding materials recycled using film packaging wastes to ascertain the their applicability to secondary products in construction industries. The stress-strain relationships of molding materials were measured under compression, tension, and flexure in accordance with the ASTM procedure. The measured mechanical properties of recycled molding materials were comparable to typical ranges observed in low-density polyethylene and/or high-density polyethylene. However, to stabilize the properties of the molding materials, further management systems are required as follows: 1) evaluation of mechanical properties of materials with respect to various mixing proportions of waste ingredients; 2) estimation of the effect of foreign substance and moisture contents on the mechanical properties; and 3) establishment of comprehensive database including various sources such as manufacture process including applied pressure to produce the molding materials, and collection region and time of wastes.

Failure Mode and Strength of Unidirectional Composite Single Lap Bonded Joints I. Experiments (일방향 복합재료 Single Lap접합 조인트의 파손 모드 및 강도 I. 실험)

  • Kim Kwang-Soo;Yoo Jae-Seok;An Jae-Mo;Jang Young-Soon
    • Composites Research
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    • v.17 no.6
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    • pp.14-21
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    • 2004
  • Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.

A Study on the Micro-deformation of Plain Weave Carbon/Epoxy Composite-Polymer Foam Sandwich Structures during Curing (평직 탄소섬유 복합재료-고분자 포움 샌드위치 구조의 성형 중 미소변형에 관한 연구)

  • Kim Yong-Soo;Chang Seung-Hwan
    • Composites Research
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    • v.17 no.6
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    • pp.28-36
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    • 2004
  • Micro-tow deformation during forming of PVC foam-fabric composite sandwich structure is investigated to find out the correlation between forming condition and material deformation. The foams used in this research are PVC foams which have 4 different densities and the fabric composite is Carbon/epoxy prepreg which is plain weave (3k) as a skin material. Tow parameters such as crimp angle and tow amplitude are measured using microscope and a proper image tool and are compared with each other. In order to find out the effect of foam deformation during forming on tow deformation the compressive tests of foams are performed in three different environmental temperatures ($25^{\circ}C$, $80{\circ}C$, $125^{\circ}C$). The microscopic observation results show that the micro tow deformations are quite different from each other with respect to the foam density and forming pressure.

Fabrication Process and Impact Characteristic Analysis of Metal Matrix Composite for Electronic Packaging Application (전자패키징용 금속복합재료의 제조공정 해석 및 충격특성평가)

  • 정성욱;정창규;남현욱;한경섭
    • Composites Research
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    • v.15 no.1
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    • pp.32-40
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    • 2002
  • This study developed fabrication process of $SiC_p/Al$ metal matrix composites as electronic packaging materials by squeeze casting method. The $SiC_p$ preform were fabricated in newly designed preform mold using about 0.8 % of inorganic binder(SiO$_2$) and 5 vol.% of $Al_2O_3$fiber. To infiltrate the molten metal into the preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication conditions, heat transfer analysis were preformed using finite element method and thus analyzed the temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites, impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in this study have 0.2~0.3 J impact toughness, $8~10 ppm/^{\circ}C$ thermal expansion coefficient and $2.9~3.0g/cm^3$density which is appropriate properties for electronic packaging application.