• Electrical & Electronic Materials
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• v.9 no.7
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• pp.702-707
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• 1996

In this paper, in order to improve the withstand voltage properties of epoxy resin, IPN(interpenetrating polymer network) method was introduced and the influence was investigated. The single network structure specimen(E series), simultaneous interpenetrating polymer network specimen(EM series) and pseudo interpenetrating polymer network(EMP series) specimen were manufactured. In order to understand the internal structure properties, scanning electron microscopy method was utilized, and glass transition temperature was measured. Also, AC voltage dielectric breakdown strength, tensile strength and impact strength were measured to investigate the influence upon electrical and mechanical properties. As a result, it was confirmed that simultaneous interpenetrating polymer network specimen was the most execellent.

• Electrical & Electronic Materials
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• v.9 no.4
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• pp.364-371
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• 1996

In this study, in order to investigate the applicability of IPN structure to epoxy resin which has been widely used as electrical and electronic insulating materials, DC dielectric breakdown properties and morphology were compared and analyzed according to variation of network structure, using the single network structure specimen formed of epoxy resin alone, interpenetrating polymer network specimen formed of epoxy resin/methacrylic acid resin, and interpenetrating polymer network specimen formed of epoxy resin/methacrylic acid resin/polyurethane resin. As results of the measunnent of DC dielectric breakdown strength at 50[.deg. C] and 130[>$^{\circ}C$], IPN specimen formed of epoxn, resin 100[phr] and methacrylic acid resin 35[phr] was the most excellent, and which corresponded to the SEM phenomena. The effect of IPN was more remarkable at high temperature region than at low temperature region. It is supposed that the defect of epoxy resin, dielectric breakdown strength is lowered remarkably at high temperature region, be complemented according to introducing IPN method.

• Electrical & Electronic Materials
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• v.10 no.7
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• pp.651-658
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• 1997

In this paper, effect of interpenetrating polymer network(IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO$_2$composite materials, were investigated. we reported a relation between network structures and electrical properties, especially dielectric characteristics with variation of network structures for epoxy composite materials. According to experimental results, the specimens which have single network structures have lower dielectric constant than interpenetrating polymer network(IPN) specimens, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that change of structures is attained by introducing of IPN to insulating materials. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties.

• Electrical & Electronic Materials
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• v.7 no.6
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• pp.527-533
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• 1994

In this study, it was studied on dielectric breakdown strength and thennostability properties due to the structure variation of matrix resin and treatment of coupling agent of epoxy insulating materials. The interpenetrating network structure was formed by simultaneous heating curing the epoxy resin with single network structure and the methacrylic acid resin. Also inner structure was observed and the glass transition temperature was measured on these three type specimens. Dielectric breakdown properties were investigated by applying DC, AC and impulse voltage. As a result, the glass transition temperature and the dielectric breakdown strength of specimen with interpenetrating network structure was more higher than another two type specimens.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.156-159
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• 2000

In this paper, the physical and electrical properties of epoxy composites are investigated at boiling absorption condition to observe the influences of moisture. Also, in order to improve water resistance of matrix resin, IPN method was introduced and the influence was investigated. In order to analyze the basic physical properties of samples, scanning electron microscopy method was utilized, and impulse voltage dielectric strength was measured. As a result, it was verified that, in case of IPN samples, the ratio of moisture absorption was decreased due to the improvement of adhesion strength, and impulse voltage dielectric strength of SN sample was degraded abruptly as boiling time and filler content were increasing, while IPN samples were slowly degraded due to the improvement of adhesion strength.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.14 no.1
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• pp.53-58
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• 2000

In this paper, the variable mechanical strength and dielectric breakdown strength of epoxy composites were measured at boiling absorption condition in order to observe the influences of moisture in out door use. Also, in order to improve water resistance of matrix resin, IPN(interpenetrating polymer network) method which had been already reported, was introduced and the influence was investigated. As Adding filter(SiO2) classified by o[phr], 50[phr] and 100[phr] to two kinds of matrix resin, six kinds of specimens were manufactured. As a result, it was confirmed that the moisture absorption rate was increased and mechanical strength and dielectric breakdown strength were degraded with boiling time and filler content increasing. On the other hand, it was confirmed that moisture absorption rates were decreased and the degrading rates of mechanical strength and dielectric breakdown strength were lowered according to improvement of adhesion strength in case of IPN specimens.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.320-323
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• 1995

In this paper, in order to improve withstand voltage properties of epoxy resin, IPN(interpenetrating polymer network) method was introduced and the influence was investigated. The sing1e network structure specimen(E series), simultaneous interpenetrating polymer network specimen(EMF series) and pseudo interpenetrating polymer network(EMP series) specimen were manufactured. In order to understand the internal structure properties, scanning electron microscopy method was utilized, rind glass transition temperature was measured. Also, AC voltage dielectric strength, tensile strength and impact strength were measured to investigate influence upon electrical and mechanical properties. As a result, it was confirmed that simultaneous interpenetrating polymer network specimen was the most execellent.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.225-229
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• 1996

In this study, in order to develop outdoor insulating materials, SIN(simultaneous interpenetrating polymer network) was introduced to Epoxy resin and the environment resistance was investigated. The single network structure specimen(E series) formed of Epoxy resin alone and simultaneous interpenetrating polymer network specimen (EM series) in which epoxy resin was taken as the first network and methyl methacrylate resin as the second network were manufactured. Ten kinds of specimens were manufacture by filler (SiO$_2$) content. SEM were utilized in order to confirm their network structure changes, and AC voltage dielectric strength was measured. Also, UV-test and tracking test were carried out investigate the environment resistance characteristic. Therefore the variations of network structure were happened as a result of SEM test, and it was confirmed that simultaneous interpenetrating polymer network specimens were more excellent than single network structure specimens.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.165-168
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• 2000

This paper presents the tracking resistance and mechanical strength due to boiling absorption of epoxy resin. The single network structure specimen(E series) formed of epoxy alone and interpenetrating polymer network(IPN) structure specimen(EM series) which epoxy resin was taken as first network and methacrylic acid resin as second network were manufactured. As adding $SiO^2$ filler classified by o[phr], 50[phr] and 100[phr] to those specimens, six kinds of specimens were manufactured and boiled in water during 2, 4, 8, 16, 32 and 64[hours]. As a result, it was confirmed that the tracking breakdown time of E series showed a abrupt decrease with boiling time increasing, but that of EM series was decreasing smoothly. Also, it was verified that the degrading rates of mechanical strength was lowerd according to improvement of adhension strength in case of EM series.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.572-574
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• 1993

In order to obtain superior breakdown properties of Epoxy/$SiO_2$ composite materials at room and high temperature, the simultaneous interpenetrating polymer networks(SIN) is introduced into the Epoxy resin. As a result, it is observed that dielectric breakdown strength tends to increase according to the following order ; Epoxy/$SiO_2$ specimens, specimens treated with coupling agent and SIN introduced specimens which have stable temperature characteristics at room and high temperature. For introducing SIN Epoxy/$SiO_2$ composite material, rise of glass transition temperature and suppression of defects in its internal structure is achieved. This in turn improves the dielectric breakdown strength and the heat proof property of Epoxy/$SiO_2$ composite materials.