• 제목/요약/키워드: 빌드업

검색결과 33건 처리시간 0.027초

스크린인쇄 법을 이용한 Build-up다층인쇄회로기판의 쾌속제조공정 기술개발 (Development of Build up Multilayer Board Rapid Manufacturing Process Using Screen Printing Technology)

  • 조병희;정해도;정해원
    • 마이크로전자및패키징학회지
    • /
    • 제6권4호
    • /
    • pp.15-22
    • /
    • 1999
  • 일반적으로 빌드업 다층 인쇄회로기판은 에칭, 도금등의 습식공정에 의해 제작이 이루어지므로 많은 장비와 많은 시간이 필요하게 된다. 이러한 습식공정은 양산에는 적합하지만 개발단계에서는 그리 적합하지 않은 방법이다. 본 연구에서는 스크린 인쇄기술을 도입하여 빌드업 다층 인쇄회로기판을 제작하여 보았다. 절연성 재료로는 광경화성수지 또는 열경화성수지를 사용하였으며 전도성 재료로는 전도성 페이스트를 사용하였다. 층간의 전기적 연결을 담당하는 비아와 회로를 형성하기 위해 스크린 인쇄공정을 통해 전도성 페이스트를 인쇄 하였다. 이러한 방법을 통해 제품의 개발 단계에서 기존의 빌드업 다층 인쇄회로기판 제작 공정과 비교하여 좀더 효율적인 방법을 제시하였다.

  • PDF

쾌속조형과 스크린 인쇄기술을 이용한 빌드업인쇄회로기판의 제조공정기술개발 (Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology)

  • 조병희;정해도;정해원
    • 한국정밀공학회지
    • /
    • 제17권2호
    • /
    • pp.130-136
    • /
    • 2000
  • Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

  • PDF

기능성 시작품 제작기술을 이용한 빌드업인쇄회로기판의 제조 공정기술 개발 (Development of Build-up Printed Circuit Board Manufacturing Process Using Functional Prototype Fabrication Technology)

  • 임용관;조병희;정성일;정해도
    • 한국기계가공학회지
    • /
    • 제2권2호
    • /
    • pp.14-21
    • /
    • 2003
  • Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.

  • PDF

BLDC 전동기의 토크리플 저감에 대한 연구 (Research of Torque Ripple Reduction of BLDC Motor)

  • 남기용;홍정표;이춘만;정원지
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2005년도 춘계학술대회 논문집
    • /
    • pp.1455-1458
    • /
    • 2005
  • This paper presents the method of reducing torque ripple of Blushless Direct Current(BLDC) motor. In the BLDC motor, the torque is decided by the back-EMF and current waveform. If the back-EMF is constant, the torque ripple depends on the current ripple during commutation period. The current in commutation period is acquired by circuit analysis and then the torque ripple simply can be reduced by varying input voltage to flow the current continuously. And suggested method is confirmed by dynamic with parameters of 500W BLDC motor.

  • PDF