• Title/Summary/Keyword: 빌드업

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Development of Build up Multilayer Board Rapid Manufacturing Process Using Screen Printing Technology (스크린인쇄 법을 이용한 Build-up다층인쇄회로기판의 쾌속제조공정 기술개발)

  • 조병희;정해도;정해원
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.15-22
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    • 1999

  • Generally, many equipments and a long lead time ale required to manufacture the build-up multilayer board through various processes such as etching, plating, drilling etc. Wet process is suitable for mass production, however it is not adequate for manufacturing prototype in developing stage. In this study, a silk screen printing technology is introduced to make a prototype build-up multilayer board. As for the material photo/thermal curable resin and conductive paste are used for forming dielectric and conductor. And conductive paste fills vias for interconnecting each layer, and also is used for circuit patterning by silk screen technology. Finally, the basic concept and the possibility of build-up multilayer board prototype is proposed and verified as a powerful approach, compared with the conventional processes.

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Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology (쾌속조형과 스크린 인쇄기술을 이용한 빌드업인쇄회로기판의 제조공정기술개발)

  • 조병희;정해도;정해원
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.2
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    • pp.130-136
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    • 2000

  • Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

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Development of Build-up Printed Circuit Board Manufacturing Process Using Functional Prototype Fabrication Technology (기능성 시작품 제작기술을 이용한 빌드업인쇄회로기판의 제조 공정기술 개발)

  • Im, Yong-Gwan;Cho, Byung-Hee;Chung, Sung-Il;Jeong, Hae-Do
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.2 no.2
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    • pp.14-21
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    • 2003

  • Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.

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Research of Torque Ripple Reduction of BLDC Motor (BLDC 전동기의 토크리플 저감에 대한 연구)

  • Nam K.Y.;Hong J.P.;Lee C.M.;Chung W.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1455-1458
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    • 2005

  • This paper presents the method of reducing torque ripple of Blushless Direct Current(BLDC) motor. In the BLDC motor, the torque is decided by the back-EMF and current waveform. If the back-EMF is constant, the torque ripple depends on the current ripple during commutation period. The current in commutation period is acquired by circuit analysis and then the torque ripple simply can be reduced by varying input voltage to flow the current continuously. And suggested method is confirmed by dynamic with parameters of 500W BLDC motor.

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