• Journal of Korea Foundry Society
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• v.28 no.3
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• pp.105-112
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• 2008

• Korean Journal of Materials Research
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• v.6 no.8
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• pp.817-824
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• 1996

Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

• Journal of the Korean Vacuum Society
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• v.21 no.1
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• pp.6-11
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• 2012

In order to understand a process of contaminants removal on surface of Cu seed layer (Cu seed/Ti/Si) by sputter deposition, we investigated the changed morphology and states of Cu seed surface after pretreatment in alkali degreasing Metex TS-40A solution according to dipping time. After TS-40A pretreatment, the surface morphology with clearer grains was observed by Field emission scanning electron microscope and the changed surface chemical states and impurities on surface of samples were checked by X-ray photoelectron spectroscopy. Dipping time in TS-40A solution had very little effect on surface of Cu seed layer. After pretreatment, much carbons and little oxygens on surface of Cu seed were eliminated and the decrease of peaks corresponded to O=C and $Cu(OH)_2$ was estimated. However, Si content (=silicate) was detected on sample surface. We think that the silicate impurity forms on Cu seed by chemical reaction of TS-40A solution included silicate component. By pretreatment of alkali degreasing Metex TS-40A solution, it showed an excellent effect in removal of O=C and $Cu(OH)_2$ on Cu seed layer, but the silicate was formed on surface of Cu seed. Therefore, another cleaning process such as acid cleaning is required for removal of this silicate in use of this alkali degreasing.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.111.2-111.2
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• 2011

야금학적 방법을 통한 태양전지용 실리콘 제조를 위하여 아크로(Arc furnace)에서 제조된 용융 상태의 금속급 실리콘을 슬래그와 직접 반응시켜 불순물을 제거하는 공정에 관한 연구를 수행하였다. 이를 위해 아크로와 고주파 유도용해로(High-frequency induction furnace)를 이용하여 금속급 실리콘을 제조와 정련 특성 실험을 수행하였다. 본 연구에서 금속급 실리콘을 제조하기 위한 장비로 150kW급-DC 아크로와 300kW급-AC 아크로를 사용하였다. 원재료로 규석, 코크스(Cokes), 숯, 그리고 우드칩(Wood chip)을 실험 비율에 맞춰 아크로 내부에 장입하고, 이를 용융환원 방법을 통해 반응을 시켰다. 이때 생산된 금속급 실리콘의 순도는 약 99.2~99.8% 이었으며, 원재료의 순도, 장입 비율 및 아크로 운전 특성에 따라 편차가 있다. 아크로에서 생산된 금속급 실리콘의 경우 인(phosphorus), 붕소(boron)를 다량 함유하고 있고, 이를 제거하기 위하여 50kW급 고주파 유도용해로 장비를 사용하여 슬래그 정련 실험을 수행하였다. 슬래그 정련시 사용한 성분은 SiO2, CaO 그리고 CaF2 이며, 금속급 실리콘과 슬래그의 질량비 및 반응 시간에 따른 실리콘 불순물 특성을 평가하였다. 실험결과 인과 붕소는 각각 1 ppm 이하, 5 ppm 이하 였으며, 칼슘을 제외한 대부분의 금속 불순물의 경우 0.1~0.2% 임을 확인하였다.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.10 no.2
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• pp.77-85
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• 2012

This study was carried out to remove (/recover) the uranium from the Uranium-bearing Lime Precipitate (ULP). An oxidative dissolution of ULP with carbonate-acidified precipitation and a dissolution of ULP with nitric acid-hydrogen peroxide precipitation were discussed, respectively. In point of view the dissolution of uranium in ULP, nitric acid dissolution which could dissolved more than 98% of uranium was more effective than carbonate dissolution. However, in this case, uranium was dissolved together with a large amount of impurities such as Al, Ca, Fe, Mg, Si, etc. and some impurities were also co-precipitated with uranium during a hydrogen peroxide precipitation. On the other hand, in the case of carbonate dissolution-acidified precipitation, U was dissolved less than 90%. Therefore, it was less effective than nitric acid dissolution for the volume reduction of radioactive solid waste. However, it was very effective to recover the pure uranium, because impurities were hardly dissolved and hardly co-precipitated with uranium.

• Resources Recycling
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• v.22 no.1
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• pp.42-47
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• 2013

Ferro-Nickel slag is a byproduct of Ferro-Nickel manufacturing process. Ferro-Nickel slag mostly discarded or used as aggregates despite having useful ingredients such as magnesium oxide and silicon oxide. This study tried to extract process for Mg ion using $H_2SO_4$ solution. And remove impurities and get high purity $Mg(OH)_2$ using NaOH. Mg ion was extracted with the Fe ion and other Ferro-Nickel slag composition by $H_2SO_4$ solution. It is important to control the pH because remove impurities and obtain high-purity $Mg(OH)_2$. The impurities were removed by precipitation of the hydroxides. After this process, we added NaOH and high-purity $Mg(OH)_2$ was obtained.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.102-109
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• 2000

It is difficult to meet the cleanliness requirement of $10^{10}/\textrm{cm}^2$ for the giga level device fabrication with mechanical cleaning techniques like scrubbing which is widely used to remove the particles generated during Chemical Mechanical Polishing (CMP) processes. Therefore, the second cleaning process is needed to remove metallic contaminants which were not completely removed during the mechanical cleaning process. In this paper the experimental results for the removal of the metallic contaminants existing on the wafer surface using remote plasma $H_2$ cleaning and UV/$O_3$ cleaning techniques are reported. In the remote plasma $H_2$ cleaning the efficiency of contaminants removal increases with decreasing the plasma exposure time and increasing the rf-power. Also the optimum process conditions for the removal of K, Fe and Cu impurities which are easily found on the wafer surface after CMP processes are the plasma exposure time of 1min and the rf-power of 100 W. The surface roughness decreased by 30-50 % after remote plasma $H_2$ cleaning. On the other hand, the highest efficiency of K, Fe and Cu impurities removal was achieved for the UV exposure time of 30 sec. The removal mechanism of the metallic contaminants like K, Fe and Cu in the remote plasma $H_2$ and the UV/$O_3$ cleaning processes is as follows: the metal atoms are lifted off by $SiO^*$ when the $SiO^*$is evaporated after the chemical $SiO_2$ formed under the metal atoms reacts with $H^+ \; and\; e^-$ to form $SiO^*$.

• Korean Chemical Engineering Research
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• v.60 no.1
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• pp.169-174
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• 2022

In this study, a tandem water and hexane washing process was developed to improve the recovery efficiency of paclitaxel derived from Taxus chinensis. The polar impurities contained in the sample were effectively removed by washing with water at a sample/water ratio of 1:40 (w/v) for 10 min. In addition, the non-polar impurities were effectively removed by washing with hexane at a sample/hexane ratio of 1:160 (w/v) for 20 min. A high purity of paclitaxel (>30.0%) was obtained in a short operating time (~30 min) by sequential washing with water and hexane.

• Journal of Korea Soil Environment Society
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• v.4 no.1
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• pp.69-73
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• 1999

The study was performed to examine the elimination capacity of impurity on the fiberglass wicks to exert a suction of Passive capillary samplers (PCAPS) on soil water. This impurity affects the capillary properties of the wick and the chemical properties of the samples collected. To determine the need, capillary rise and moisture contents were measured after the wicks were cleaned by four methods : combustion, acetone extraction, detergent washing, and uncleaning. The wicks were made with fibers produced by PPG Industries and Manville Company, U.S.A. Results showed that wicks made from PPG fibers lost up to 3.4% of original mass during combustion while Manville fiber wicks lost only up to 0.6%. These losses are assumed to have been due to combustion of organic compounds applied by the manufacturers. All cleaning methods had higher capillary rise than obtained with uncleaning method Combustion at 40$0^{\circ}C$ for 4 hours was the best cleaning method. removing 98 to 100% of impurities.

• Applied Chemistry for Engineering
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• v.32 no.3
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• pp.290-298
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• 2021

A purification process was performed for the application of natural graphite as an anode material. The influence of the structural change and impurity content of graphite according to the process on the anode electrochemical characteristics was investigated. Natural graphite was chemically/physically purified by acid-treatment which used different amounts of solution of ammonium fluoride/sulfuric acid in the same ratio and thermal treatment used different temperatures (800~2500 ℃). Acid-treatment had limitation to remove impurities, and identified that all impurity contents was removed except some traces of atom such as Si by after progressed thermal-treatment until 2500 ℃. The anode materials characteristic of graphite treated by purification process was improved, and changes in the structure and impurity contents affected dominantly the capacity, rate property and initial Coulombic efficiency. Consequently, the complex purification process improved the graphite structure and also the performance of lithium ion battery by controlling the excessive formation of solid electrolyte interphase and expanding Li⁺ insertion space originated from the effective removal of impurities.