• Electronics and Telecommunications Trends
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• v.11 no.1 s.39
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• pp.29-47
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• 1996

본 고는 전자통신시스템 및 단말기의 소형화 및 고기능화를 위하여 대두되고 있는 다중칩 모듈(Multichip Module; MCM)중 Laminate기술을 기본으로 하며 대량생산이 가능한 Multichip Module-Laminate(MCM-L)기술에 대하여 논하고 있다. 본 내용에는 전기 및 열특성을 결정하는 기판재료, Laminate에서의 Via 및 Pad의 한계, MCM의 성능과 관련된 시험방법 등이 있으며, 마지막으로, 통신 및 타분야의 MCM 응용사례를 조사분석하고 향후 MCM의 기술발전방향을 예측해 보았다.

• Korean Journal of Food Science and Technology
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• v.28 no.5
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• pp.916-921
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• 1996

This study was conducted to measure fat contents of potatochips by near infrared spectroscopy (NIRS). Both potatochip powder and potatochips were used to find correlations between the absorbance at certain wavelengths find the fat contents. Based on the correlation analysis, linear regression models predicting the fat contents were developed to predict the fat contents. Artificial neural network (ANN) models were also developed. Predicted values were compared to the measured ones. The regression and the ANN model predicting the fat contents of potatochip powder had determination coefficients of 0.93 and 0.92, and standard errors of prediction (SEP) of 1.29% and 1.17%, respectively. The correlation analysis of potatochips showed that the determination coefficients were low. Therefore, the fat contents of not potatochips but potatochip powder could be measured by NIRS.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.6
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• pp.567-574
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• 2003

It is important to design and evaluate the chip waveform with the minimum MAI under the bandwidth constraint in the interference-limited DS-CDMA system. In this paper, by approximation we present the analytical chip waveforms that are proposed and optimized in the reference. Their performances are compared with performances of three conventional chip waveforms: rectangular, half-sine and raised-cosine. Waveform 1 of the proposed chip waveform outperforms the conventional ones. BER and throughput performance are evaluated in the Rayleigh and Nakagami-m fading channels when DPSK modulation is used. When the required BER is 10$\^$-3/ in two fading channels, the capacity of the waveform 1 is improved about 20 % rather than raised-cosine one. When the offered traffic is 30 and the number of packet per bit(N$\sub$d/) is 14, maximum throughput of the waveform 1 is better than raised-cosine chip waveform about 18 % in two fading channels.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.6
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• pp.443-453
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• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5748-5755
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• 2015

Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

• Journal of Korean Society of Forest Science
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• v.106 no.1
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• pp.54-62
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• 2017

This study was carried to develop the chip-harvester and to analysis the operation productivity and cost for effective collection and forwarding of forest biomass. Main target specification of chip-harvester is speed of 8km/h, maximum climbing capacity of $30^{\circ}$ and maximum load capability of 2000 kg. Body structure is articulate type to reduce turning radius. Driving equipment is six-wheel drive, and a rear wheel is tandem bogie type to increase grip force. As a result of the driving test about developed chip-harvester, driving speed was 6.9 km/hr and 8.1 km/hr in ${\pm}10%$ slope with loaded and 7.3 km/hr and 7.9 km/hr in ${\pm}10%$ slope without load. As a result of the operation productivity and cost, operation productivity of grinding and forwarding was approximately $10m^3$ per day, and operation cost was 393,126 won per day.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.88-88
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• 2013

최근 각광을 받고있는 나노바이오 질량이미징 분석법의 측정원리를 이해하고, 세포/생체조직/생체샘플/바이오칩의 측정결과를 바탕으로 핵심측정 능력을 파악하여 각자의 연구에 적용 가능성을 탐색할 수 있는 역량을 배양하고자 한다.

• Proceedings of the Korea Society for Simulation Conference
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• 1997.04a
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• pp.31-35
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• 1997

본 논문에서는 암호화 알고리즘의 하나인 GOST (Government Standard)를 칩으로 구현했을 경우에 차지하는 면적과 속도에 대해 DES와 비교 분석하고, GDES의 구조를 이 용하여 GOST 알고리즘을 빠르게 처리할 수 있도록 설계하였다. 합성한 것을 최종적으로 MAX+plus II를 이용하여 시뮬레이션을 통해 검증하였다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.65-69
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• 2008

This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.

• Nuclear Medicine and Molecular Imaging
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• v.41 no.4
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• pp.299-308
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• 2007

Purpose: The aim of this study was to develop a bioinformatics software and to test it in serum samples of papillary thyroid cancer using mass spectrometry (SELDI-TOF-MS). Materials and Methods: Development of 'Protein analysis' software performing decision tree analysis was done by customizing C4.5. Sixty-one serum samples from 27 papillary thyroid cancer, 17 autoimmune thyroiditis, 17 controls were applied to 2 types of protein chips, CM10 (weak cation exchange) and IMAC3 (metal binding - Cu). Mass spectrometry was performed to reveal the protein expression profiles. Decision trees were generated using 'Protein analysis' software, and automatically detected biomarker candidates. Validation analysis was performed for CM10 chip by random sampling. Results: Decision tree software, which can perform training and validation from profiling data, was developed. For CM10 and IMAC3 chips, 23 of 113 and 8 of 41 protein peaks were significantly different among 3 groups (p<0.05), respectively. Decision tree correctly classified 3 groups with an error rate of 3.3% for CM10 and 2.0% for IMAC3, and 4 and 7 biomarker candidates were detected respectively. In 2 group comparisons, all cancer samples were correctly discriminated from non-cancer samples (error rate = 0%) for CM10 by single node and for IMAC3 by multiple nodes. Validation results from 5 test sets revealed SELDI-TOF-MS and decision tree correctly differentiated cancers from non-cancers (54/55, 98%), while predictability was moderate in 3 group classification (36/55, 65%). Conclusion: Our in-house software was able to successfully build decision trees and detect biomarker candidates, therefore it could be useful for biomarker discovery and clinical follow up of papillary thyroid cancer.