• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.98-103
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• 2002

BGA(Ball Grid Array) 패키지의 솔더볼 패드 중의 하나인 Au/Ni-Co/Cu 금속층 위에 Bi가 첨가된 Sn-3.5Ag-$\chi$Bi 솔더볼을 리플로우시켰다. 리플로우한 후 130 $^{\circ}C$에서 열처리함에 따른 계면상 및 솔더 내부의 상변화를 관찰하였다. 계면에는 (Ni,Co)$_3$Sn$_4$외에 (Au,Ni,Co,Bi)Sn$_4$가 생성되었음을 관찰할 수 있었고, 솔더 내부에는 (Au,Ni,Co,Bi)SH$_4$, Ag$_3$Sn, Bi 상이 혼재되어 있었다. Nano-indentation에 의한 경도 측정 결과, Bi 함량 증가에 따라 경도는 증가하였으나, 볼전단(Ball Shear) 테스트 결과는 Bi가 증가됨에 따라 오히려 볼전단 강도값이 감소하였다. 이는 파면 검사 결과, 파괴 경로가 주로 계면의 금속간 화합물과 솔더 사이에서 진행함에 기인한 것이다. 솔더 내부의 파괴 경로를 가진 2.5Bi가 가장 우수한 볼전단 강도값을 나타내었는데, 이는 솔더내의 Bi의 고용강화에 기인한 것으로 보인다.

• Proceeding of EDISON Challenge
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• 2013.04a
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• pp.393-397
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• 2013

관내의 유량을 제어하는 볼 밸브(ball valve)는 개폐각도(opening degree)가 커짐에 따라 출구에서 유속이 증가하고 밸브(valve)의 입 출구 간 압력강하(pressure drop)가 증가한다. 출구에서의 압력이 작동유체의 포화증기압보다 낮아질 때 공동현상(cavitation)이 발생한다. 관내에서의 공동현상은 배관시스템의 진동 및 소음, 부식 등에 있어서 악영향을 미칠 수 있으므로 설계에 매우 중요한 요소이다. 버터플라이 밸브를 비롯한 다른 밸브에서는 공동현상감소에 대한 연구가 많이 이루어졌다. 이에 본 연구에서는 볼 밸브 내 유동 특성(characteristic of flow)과 볼 밸브의 입출구간 압력강하를 줄이는 연구를 수행하였다. 개폐 각도와 그에 따른 압력강하와의 관계를 Edison_전산열유체를 사용하여 분석하고 공동현상을 감소시킨 볼 밸브의 설계를 제시 하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.373-380
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• 2020

A valve product can be over-designed or too heavy. Finite element analysis was performed using ANSYS for two and three-dimensional ball valve models, and the ball weight was reduced by optimization within the allowable design criteria. The ball is structurally safe according to the computed stress values, which are within the material's admissible stress. The weight was reduced by about 22%, and the structural safety factor was 1.25. The structural safety of the seat insert and ring, which are used to prevent leakage, was confirmed through finite element analysis. It is shown that the two-dimensional analysis can result in similar values to the three-dimensional analysis for the axisymmetric structure. The redesign of the valve is not included in the results since such changes require a whole new design process, including all valve components.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.15-20
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• 2017

The main purpose of the ball valve ball is to be moved by the rotation of the stem when fully open or completely closed. In this study the heat of the initial model, which used a structure interaction analysis technique, tried to examine the structural safety of the high temperature for the ball valve. In the initial model the stress of the exiting sheet was more than the yield strength. We selected two design shapes with variables of length and thickness for the optimization of the sheet. The Kriging interpolation method was applied to a meta-model-based optimization technique. As a result, it was possible to find a thickness and length for the sheet within the yield strength. This was done by measuring the value of the capacity coefficient of the valve and evaluating the performance of the ball valve.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Korean Society of Radiology
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• v.17 no.6
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• pp.1001-1007
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• 2023

Dose limits are not applied to medical radiation exposure therefore justification and optimization should be essential for protecting radiation. This study explores methods to reduce exposure dose undergoing general radiation exam by bolus(tissue equivalent material) with keeping image quality. Hand PA projection with 50 kVp, 5 mAs, SID 100 cm, and 8×10 inch is referred by covered bolus of thickness 0, 3, 5, 8, and 10 mm for evaluation entrance dose and SNR. The entrance dose (μGy) to the hand by bolus thickness was 125.41±0.288, 106.85±0.255, 104.97±0.221, 91.68±0.299, and 90.94±0.106 showing a significant reduction in radiation exposure depending on if the bolus was used and bolus thickness. The SNR of the image was 13.997, 13.906, 12.240, 12.538, and 12.548 at each bolus thickness, showing no significant difference. It was confirmed that if appropriate thickness and size of bolus is used depending on the type of radiological imaging exam and the body site, a significant radiation dose reduction effect can be achieved without deteriorating image quality.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.6
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• pp.71-78
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• 1989

The imput-output relations for nonlinear systems can be explicitly represented by the Volterra series and they can be characterized by the Volterra kernels. This study is concerned with modeling an elastomer force-displacement relation due to step inputs by utilizing the truncated Volterra series. Since it is practically impossible to apply step inputs that have infinite slope at zero time, the loads due to constant penetration(displacement) rate followed by constant penetration inputs are measured as an alternative approach and estimated for step inputs and then utilized for the truncated Volterra series models. One second order and one third order truncated Volterra series models have been employed to model the force-displacement relation which is one of the prominent properties to characterize the viscoelastic material. The third order truncated Volterra series model has better results, compared with those of the second order truncated Volterra series model.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1994.10a
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• pp.210-216
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• 1994

본 연구에서는 볼 베어링의 전동체 회전에 의해 발생하는 원심력, 자이로스코픽 모멘트, 하중 방향선에 대한 전동체의 하중 분포 변화 등을 고려하여, 볼 베어링의 강성 특성을 해석하고, 볼 베어링으로 지지되는 간단한 회전축 계에 해석 결과를 적용하여 진동 특성을 해석하고자 한다.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04b
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• pp.1237-1240
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• 2001

최근 제품의 초소화와 반도체의 고집적화로, 작은 크기로 많은 리드를 제공하기 위해, 부품 밑면에 격자형태로 볼이 배열되어 있는 BGA나 CSP부품들이 최근 많이 이용되고 있다. 하지만, BGA는 한번 PCB에 장착되면, 볼 외관검사가 원천적으로 불가능하므로, 부품을 장착하기 전에 볼 품질의 검사와 부품의 정밀한 위치 및 각도의 측정이 요구된다. 본 논문에서는 BGA부품의 위치 및 각도를 추출하기 위한 방법과 볼을 검사하기 위한 알고리즘을 소개한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.184-184
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• 2004

볼 나사는 반도체ㆍLCDㆍPDP 등 전자제품 조립장비 제조업체와 CNC 공작기계, 정밀측정기계, 직교좌표로봇, 반송장치, 항공기용 유압구동장치 대체품, 전동공구, 파워 steering, 테이블 개폐장치 등에서 구동 장치 및 물품의 이송을 위해 대부분 사용되는 중요한 기계요소 중의 하나이다. 그것은 회전운동을 직선운동으로 전환해주는 기구부에 들어가는 가장 중요한 부품이며, 원통형의 봉에 나선형의 그루브를 가공한 장축의 나사와 단축의 너트 사이에 볼을 게재시켜 축의 회전 시 적은 구름마찰로 인해, 너트부가 직선 운동하는데 원활 하게 만들어진 기계요소이다.(중략)