• Journal of Korea Society of Industrial Information Systems
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• v.23 no.4
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• pp.23-31
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• 2018

This paper presented the implementation and design of the 2T-2R wireless HD video streaming systems over 1.7 GHz frequency band using 3GPP LTE-TDD standard on NI USRP RIO SDR platform. The baseband of the system used USRP RIO that are stored in Xilinx Kintex-7 chip to implement LTE-TDD transceiver modem, the signal that are transmitted from USRP RIO up or down converts to 1.7 GHz by using self-designed 1.7 GHz RF transceiver modules and it is finally communicated HD video data through self-designed 2x9 sub array antennas. It is that communication method between USRP RIO and Host PC use PCI express x4 to minimize delay of data to transmit and receive. The implemented system show high error vector magnitude performance above 32 dBc and to transmit and receive HD video in experiment environment anywhere. The proposed hybrid beam forming system could be used not only in the future 5G mobile communication systems under 6 GHz frequency band but also in the systems over 6 GHz frequency band like ones in mmWave frequency bands.

• Korean Chemical Engineering Research
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• v.55 no.1
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• pp.80-85
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• 2017

Recently, microalgae which can produce high-value products have attracted increasing attention for biological conversion of $CO_2$. However, low photosynthetic efficiency and productivity have limited the practical use of microalgae. Thus, we developed microdroplet photobioreactor for the analysis of photoautotrophic growth of model alga, Chlamydomonas reinhardtii. $CO_2$ transfer rate was increased by integrating micropillar arrays and adjusting height of microchamber. These results were identified by change of cell growth rate and fluorescence intensity. Lastly, the photoautotrophic growth kinetics of C. reinhardtii in microdroplet photobioreactor were investigated under different $CO_2$ concentrations and light intensities for 96 hours. As a result, microdroplet photobioreactor was efficient platform for isolation and rapid evaluation of microalgal strains which have enhanced productivity of high-value products and growth performance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.15-22
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• 2011

Integrated-optic symmetric/asymmetric Mach-Zehnder interferometers at $1.3{\mu}m$ wavelength were studied as sensing part for electric-field measurement system. The devices were simulated based on the BPM software and fabricated utilizing Ti-diffused $LiNbO_3$ channel optical waveguides and lumped-type electrodes. A half-wave voltage of $V_{\pi}$=6.6V and modulation depth of 100% and 75% for a symmetric structure were measured for 200Hz and 1kHz electrical signal bandwidth, respectively. By the way, almost half-maximum power transmission was observed for asymmetric interferometers with ${\pi}$/2 intrinsic phase difference. Expected experimental measurements were observed for 1kHz electrical signal bandwidth.

• The KIPS Transactions:PartA
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• v.11A no.2
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• pp.109-114
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• 2004

This paper presents a high-speed bit-parallel systolic divider for computing modular division A($\chi$)/B($\chi$) mod G($\chi$) in finite fields GF$(2^m)$. The presented divider is based on the binary GCD algorithm and verified through FPGA implementation. The proposed architecture produces division results at a rate of one every 1 clock cycles after an initial delay of 5m-2. Analysis shows that the proposed divider provides a significant reduction in both chip area and computational delay time compared to previously proposed systolic dividers with the same I/O format. In addition, since the proposed architecture does not restrict the choice of irreducible polynomials and has regularity and modularity, it provides a high flexibility and Scalability with respect to the field size m. Therefore, the proposed divider is well suited to VLSI implementation.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.561-566
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• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.6-13
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• 2009

For X-band phased array systems, a power amplifier, a 6-bit phase shifter, a 6-bit digital attenuator, and a SPDT transmit/receive (T/R) switch are fabricated and measured. All circuits are demonstrated by using CMOS 0.18 um technology. The power amplifier has 2-stage differential and cascade structures. It provides 1-dB gain-compressed output power ($P_{1dB}$) of 20 dBm and power-added-efficiency (PAE) of 19 % at 8-11 GHz frequencies. The 6-bit phase shifter utilizes embedded switched filter structure which consists of nMOS transistors as a switch and meandered microstrip lines for desired inductances. It has $360^{\circ}$ phase-control range and $5.6^{\circ}$ phase resolution. At 8-11 GHz frequencies, it has RMS phase and amplitude errors are below $5^{\circ}$ and 0.8 dB, and insertion loss of $-15.7\;{\pm}\;1,1\;dB$. The 6-bit digital attenuator is comprised of embedded switched Pi-and T-type attenuators resistive networks and nMOS switches and employes compensation circuits for low insertion phase variation. It has max. attenuation of 31.5 dB and 0.5 dB amplitude resolution. Its RMS amplitude and phase errors are below 0.4 dB and $2^{\circ}$ at 8-11 GHz frequencies, and insertion loss is $-10.5\;{\pm}\;0.8\;dB$. The SPDT T/R switch has series and shunt transistor pairs on transmit and receive path, and only one inductance to reduce chip area. It shows insertion loss of -1.5 dB, return loss below -15 dB, and isolation about -30 dB. The fabricated chip areas are $1.28\;mm^2$, $1.9mm^2$, $0.34\;mm^2$, $0.02mm^2$, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.5
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• pp.445-453
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• 2016

This paper presents the implementation and design of the 1T-1R wireless HD video streaming systems over 28 GHz mmWave frequency using 3GPP LTE-TDD standard on NI USRP RIO SDR platform. The baseband of the system uses USRP RIO that are stored in Xilinx Kintex-7 chip to implement LTE-TDD transceiver modem, the signal that are transceived from USRP RIO up or down converts to 28 GHz by using self-designed 28 GHz RF transceiver modules and it is finally communicated HD video data through self-designed $4{\times}8$ sub array antennas. It is that communication method between USRP RIO and Host PC use PCI express ${\times}4$ to minimize delay of data to transmit and receive. The implemented system show high error vector magnitude performance above 25.85 dBc and to transceive HD video in experiment environment anywhere.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.71-71
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• 2009

전자제품의 다양한 기능들의 융복합화 및 휴대 편의성 경향은 이제 더 이상 새로운 것이 아니다. 이러한 추세에 따라 전자부품들은 모듈화 되고, 휴대하기 용이해 지고 있다. 또한 다양한 제품 디자인에 적용하기 위해 제품에 장착되는 부품의 기구적 위치 배열의 한계 또한 제약 받고 있다. 따라서 최근의 전자부품은 모듈화 되고 있으며, 기구적 한계를 극복하기 위한 Flexible 모듈의 사용이 증가하고 있다. 또한 양산측면에서 Roll-to-Roll(R2R) 방식을 적용함으로써 생산성을 극대화 하고 있다. 이때 R2R 적용을 위해서는 제품이 굴곡 될 수 있도록 유연성이 보장되는 Bendable 전자모듈의 개발이 필수적으로 요구되고 있다. Flexible 기판은 더 이상 새로운 기술이 아니지만, Felxible 기판 내부에 칩이 내장되고, 회로가 형성되어 자체적으로 기능을 수행할 수 있도록 한 Bendable 전자모듈을 R2R 방식으로 제조하는 기술은 매우 새로운 접근이라 할 수 있다. 이러한 기술개발이 현실화 된다면, Wearable Electronics 및 Flexible Display 등 다양한 전자제품에 응용될 수 있을 것으로 기대된다. 그러나 이러한 제품의 상용화를 위해서는 Bendable 전자모듈에 대한 신뢰성이 확보되고, 제품으로써의 수명이 보증되어야 한다. 신규 개발되는 제품의 신뢰성 검증항목이나 수명평가 모델은 현재까지 제안되지 않고 있는 실정이다. 또한 다양한 사용 환경에서 고장(Failure) 발생을 유발하는 스트레스 인자(Stress Factor)를 도출함으로써, 가속시험 또는 신뢰성 검증을 위한 인가 스트레스를 선정할 수 있다. 그러나 이러한 고장물리를 기반으로 스트레스 인자를 해석한 결과는 아직 보고되고 있지 않다. 따라서 본 연구에서는 $50{\mu}m$ 두께의 Si Chip에 저항변화를 관찰하기 위한 회로를 형성한 후 폴리이미드 기판을 이용하여 Si Chip이 임베딩된 Bendable 전자모듈을 제작하였다. 전자모듈의 실사용 환경에서의 수명예측을 위한 사전단계로써 고장물리에 기반한 고장모드와 고장메카니즘을 해석하는 것이 최우선 수행되어야 하며, 이를 바탕으로 고장을 유발하는 스트레스 인자를 도출 하였다. 고장도출을 위해 시제품은 JEDEC J-STD-020C의 MSL시험, 고온가압시험, 열충격시험 및 고온저장시험을 각각 수행하였으며, 이로부터 발생된 각각의 고장유형을 분석함으로써 스트레스 인자를 도출하였다. 또한 모아레(Moire) 간섭계를 이용하여 제작된 샘플의 온도변화에 따른 변형해석을 수행하였고, 동시에 Half Symetry Model을 이용한 유한요소해석(FEA)을 수행하여 변형해석 및 스트레스 유발원인을 도출하였다. 이 결과로 부터 고장물리 기반의 고장해석과 Moire 분석 그리고 시뮬레이션 해석 결과를 바탕으로 Bendable 전자모듈의 고장유발 스트레스 인자를 해석할 수 있었다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.639-647
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• 2019

Recently, as the semiconductor integration technology due to miniaturization and high density of electronic equipment have developed, it is importantly recognized the application of thermal control system in order to release inner heat generated from chips, modules, In this study, we considered the heat transfer and pressure drop characteristics in a horizontal channel with four blocks using k-${\omega}$ SST turbulence model During CFD (Computational Fluid Dynamics) analysis, the parameters applied block width, block height, heat source and turbulence generator placement etc. As the boundary conditions of analysis, the channel inlet temperature and flow velocity were respectively 300 K and 3.84 m/s, the heat flux was $358W/m^2$. As a result, the heat transfer performance was decreased as the block width ratio (w/h) was increased, while it was increased as the block height ratio (h/w) was increased. In addition, as the arrangement of heat source size was increased to high heat flux from low heat flux, it was influenced by heat source size and the heat transfer coefficient showed a tendency to increase, When the turbulence generator was installed in the upper part of block No. 1 position the closely to the channel entrance, the heat transfer characteristics was greatly influenced on the whole of four heating blocks. and in oder to consider the pressure drop characteristics, we are able to select the most appropriate turbulence generator's position.