• Journal of Energy Engineering
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• v.25 no.4
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• pp.30-36
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• 2016

The battery pack which is a main component of E-scooter needs the cooling system because it is the matter of battery safety in spite of the incresing of charge efficiency due to decress the internal resistence in the condition of high temperature. The purpose of this study is to analyse the effects of cooling methods which is the control of air's inlet and outlet operating timing. When each battery had large temperature deviation in the battery pack, the difference of battery's performance and efficiency were appeared. In this study, the cooling performance of battery pack has been improved by changing the operation timing of inlet and outlet fan, it improved the performance and efficiency of battery. The numerical analysis using a commercial code ANSYS CFX version 17.0 were used for the study.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.11
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• pp.1538-1544
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• 2014

In recent years, The electronic and energy industries demand low power consumption and high efficiency, so under their demands, the white goods industries which are represented for refrigerator and air conditioner system be implemented energy-saving power suppling structure with inverter control system. As inverter control system is different from step control type, when switching system is optimizing temperature control during short period, the inrush plus current can be flown in the circuit. In despite of these characteristics, there is no fuse which can be applied to this type until now. For this reason, we suggest the method of manufacturing protector in the high efficient inverter control system using the alumina-based ceramic radiated heat characteristics and metal films laminated plating. And through the evaluating electrical characteristics, we make a possible to utilize the method when designing overall fuses.

• Journal of the Korea Safety Management & Science
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• v.15 no.2
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1231-1236
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• 2004

In the present work, the practical thermal design process of 1 DIN car DVD receiver described. In the course of its efficient design, CAE technique was essentially used. CAE technique has reduced research period, man power and material cost but has increased research convenience, organized results and persuasive power. CAE technique helped to study parameters such as vent, fan and heat sink. Using these elements, it tried to meet optimal thermal solution. But safety standard, printed circuit board and framework mechanism should be considered as the constraint. To overcome these constraints, we tried to communicate and compromise with projectors in charge. After all, the price of those efforts has made the most competitive heat sink for heat dissipation in the 1 DIN car DVD receiver market. Moreover, we are trying to save $3 per product by removing fan. This paper is supposed to show an example of the CAE technique and help thermal designers to make electronic packaging goods.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.563-571
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• 2017

Test stand for altitude engine test of reciprocating engine was designed, manufactured and validated by preliminary test and simple calculation. These test stand designed to interface with Altitude turbo-shaft engine test facility of Korea Aerospace Research Institute. Many limiting condition for altitude test of reciprocating engine are assumed and test stand was developed to satisfy those limits. Test stand design specially focused on a altitude, Mach number and fuel temperature control for reciprocating engine altitude test with smaller air and fuel flow than turbo-shaft engine.

• The Transactions of the Korean Institute of Power Electronics
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• v.22 no.6
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• pp.484-495
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• 2017

In HVDC thyristor valves, more than 95% of heat loss occurs in snubber resistors and valve reactors. In order to dissipate the heat from the valves and to suppress the electrolytic current, water with a high heat capacity and a low conductivity of less than 0.2 uS/cm must be used as a refrigerant of the heat sink. The cooling parts must also be arranged to reduce the electrolytic current, whereas the pipe that supplies water to the thyristor heat sink must have the same electric potential as the valve. Corrosion is mainly caused by electrochemical reactions and the influence of water quality and leakage current. This paper identifies the refrigerants involved in the ionization, electrical conductivity, and corrosion in HVDC thyristor valves. A method for preventing corrosion is then introduced. The design of the heat sink with an excellent heat radiation is also analyzed in detail.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.7
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• pp.778-784
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• 2012

In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

• Transactions of the Society of Information Storage Systems
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• v.2 no.1
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• pp.21-25
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• 2006

The new multimedia information environment requires smaller optical data storage systems. However, one of the difficulties encountered in designing small form factor(SFF) optical pick-up is to emit the heat which is generated from laser diode(LD). Heat generated at the LD can reduce the optical performance of the system and the lifetime of LD. Therefore, it is important to include the thermal design in the design stage of SFF optical pick-up system for high performance and the longer lifetime of LD, and furthermore, to analyze the thermal characteristics of LD in detail micro heat transfer analysis is necessary. In the present study, micro heat transfer analysis was performed using the finite element method for the $28{\times}11{\times}2mm^3$ super slim swing-arm type optical pick-up actuator for Blu-ray disk. Two different materials were used for a swing-arm; a double layer polycarbonate/steel structure and a single aluminum structure.