• Proceedings of the KIPE Conference
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• 2011.07a
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• pp.487-488
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• 2011

본 논문에서는 풍력발전용 전력변환기 내부 소자의 방열에 사용되는 수냉식 방열판의 관 형상을 제안한다. 최근 대용량 전력변환기는 소형화 및 효율성이 중요시 되고 있으며, 이에 따라 기구의 안정적이고 장기적인 운영을 위한 수냉식 방열설계가 필수적이라 할 수 있다. 수냉식 방열판는 다수의 원형관으로 구성되며, 이 원형관의 형상은 방열판의 열전달 성능에 직접적인 영향을 주게 된다. 따라서 본 논문에서는 열전달 촉진을 위한 방열판의 관 형상들을 모델링하고 열해석 시뮬레이션을 진행하여 모델링된 방열판들의 방열특성을 비교/분석하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4398-4404
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• 2012

This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.8
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• pp.687-693
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• 2018

In this paper, we studied on the thermal design of the active antenna system for stable performance considering thermal reliability. The active antenna has high performance and heat flux elements in T/R modules. Thermal heating of elements in T/R modules has to be dissipated effectively and the antenna has to be operated over the range of suggested temperature by the thermal design. T/R modules of high heat flux in the active antenna can be dissipated effectively by liquid cooling. In this study, we studied on the thermal design including the liquid cooling system to optimize the thermal performance of the active antenna. And the thermal design was verified by numerical analysis.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2243_2244
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• 2009

본 논문에서는 알루미늄 재질로 된 방열판과 PCB에 1[W]급 LED 14개를 모듈 방열 설계 하여 COMSOL Multiphysics로 시뮬레이션을 통한 결과, 경계면 온도는 약 $80^{\circ}C$, Max.온도$141^{\circ}C$, Min.온도$20^{\circ}C$까지 변화로 실 제작에 근접한 온도 확인이 가능함을 확인 할 수 있었다.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Proceedings of the KIPE Conference
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• 2011.07a
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• pp.485-486
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• 2011

대용량 전력변환기에서 대부분의 열은 IGBT 소자에서 발생한다. 따라서 소자의 방열을 위한 방열시스템은 전력변환기의 구동 뿐 아니라 각 장치들에 대한 소형, 경량화의 추세에 있어서도 중요한 부분을 차지한다. 본 논문에서는 소자의 냉각을 위해 수냉식 방법을 선정하였으며, 배관 구조에 따른 방열판의 방열특성을 비교하여 최적의 배관 구조를 가진 수냉식 방열판을 제안하였다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.1
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• pp.76-83
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• 2011

This paper focuses on the thermal design of a signal processor in Micro-Wave Seeker. High temperature environment and ESS(Environmental Stress Screening) test condition should be considered in designing a signal processor. First, we performed the thermal analysis to know conditions under which a signal processor is thermally reliable. As a result of thermal analysis, we found that adopting heat transfer block to the thermally fragile components is most efficient, because the heat transfer block can control the thermal loads of the individual components. Next, we verified this solution by numerical simulation and experiment and concluded that thermal reliability of a signal processor can be achieved. Maximum temperature difference between numerical simulation and experiment is about $2^{\circ}C$.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.561-566
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• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.