• Korean Journal of Optics and Photonics
• /
• v.24 no.6
• /
• pp.342-346
• /
• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.10
• /
• pp.6925-6931
• /
• 2015

LED(Light Emitting Diode) is used in various filed like a display because of low power consuming, long life span, high brightness, rapid response time and environmental-friendly characteristic. General fabrication method is combination blue light LED chip with yellow fluorescent substance. Because this way is suitable for industry field in terms of convenience, economic, efficiency. In white light LED packaging process, encapsulation process that is dispensing fluorescent substance with silicon to blue light LED chip is most important. So, in this paper we develop EHD pump system using voice coil motor and electrostatic pump for dispensing fluorescent substance. For these things we conduct basic test about liquid surface profiles by voltage and process time. Through this data we decide optimal process condition and verify the optimal condition using design of experiment method. And to confirm uniformity of the condition, we conduct repeat dispensing test.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.16 no.9
• /
• pp.2003-2008
• /
• 2012

A drive system is necessary to operate LED by an LED illumination system. Because Switched Mode Power Supply (SMPS) is higher in efficiency in the large capacity than Linear Regulator, it is used mainly and controls this in an analog form or digital method. A MCU and a DSP of the digital control central processing unit were higher in a unit price than existing analog control chip, so that an approach was not easy for application of SMPS. But it can take the earnings by it lets you integrate various digital control features like an LED illumination system in one MCU, and realizing a whole system. In this paper, we suggest the algorithm that can improve LED driving current in applying such a digital control method using low-priced type MCU.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.10 no.7
• /
• pp.1514-1519
• /
• 2009

We fabricated the GaNLED emitting 400 nm wavelength and improved the optical extraction efficiency by making surface patterns on n-GaN layer and ITO layer above p-GaN. In addition, the light reflection metal under the n and p pad is made and the light reflection metal is installed on the backside of the chip. The light extraction efficiency is increased by 20 % with texturing n-GaN layer and 18% with texturing ITO layer at 20 mA. Compared to planar-surface LED, the light extraction efficiency for surface texturing both n-GaN and ITO is increased by 32% at 20mA.

• Journal of the Korean Institute of Telematics and Electronics C
• /
• v.36C no.2
• /
• pp.54-61
• /
• 1999

This paper describes the design of a 4-Mbps wireless infrared data transceiver chip. The receiver consits of the analog front-end, clock recovery and frame generator, and demodulator. The transmitter consists of the demodulator and LED driver. The versatile analog front- end consisting of multiple amplifiers makes it possible for the chip to be applied to various infrared environments by compensating DC and offset signal components. A 4PPM (pulse position modulation) scheme is used for data transfer in order to meet the IrDA standards. The chip was fabricated in a $0.8-{\mu}m$ 2-poly, 2-metal CMOS technology and dissipates 122mW for ${\pm}2.5V$ supply.

• Korean Journal of Optics and Photonics
• /
• v.25 no.4
• /
• pp.221-224
• /
• 2014

We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

• Korean Chemical Engineering Research
• /
• v.51 no.2
• /
• pp.214-220
• /
• 2013

Hydrophobic coating on a silicate-based yellow phosphor ($Sr_2SiO_4:Eu^{2+}$) was carried out by using hexamethyldisiloxane (HMDSO) precursor in an atmospheric pressure dielectric barrier discharge plasma reactor, eventually to improve the long-term stability and reliability of the phosphor. The phosphor powder samples were characterized by a scanning electron microscope (SEM), a transmission electron microscope (TEM), a fluorescence spectrophotometer and a contact angle analyzer. After the coating was prepared, the contact angle of the phosphor powder increased to $133.0^{\circ}$ for water and to $140.5^{\circ}$ for glycerol, indicating that a hydrophobic layer was formed on its surface. The phosphor coated with HMDSO exhibited photoluminescence enhancement up to 7.8%. The SEM and TEM images of the phosphor powder revealed that the plasma coating led to a morphological change from grain-like structure to smooth surface with 31~46 nm thick hydrophobic layer. The light emitting diode (3528 1 chip LED) fabricated with the coated phosphor showed a substantial enhancement in the reliability under a special test condition at $85^{\circ}C$ and 85% relative humidity for 1,000 h (85/85 testing). The plasma-mediated method proposed in this work may be applicable to the formation of 3-dimensional coating layer on irregular-shaped phosphor powder, thereby improving the reliability.

• Journal of the Korean Chemical Society
• /
• v.61 no.4
• /
• pp.163-167
• /
• 2017

Along with the progress of white LED technology, red phosphors have become increasingly important in industry and academia, and a more specific demand has steadily increased in the market. Red phosphors are used in high efficiency and high rendering LED lightings. However, using red phosphors with $Eu^{2+}$ activators caused color rewarming and reduced emission intensity in white LED chips due to strong reabsorption in the green or yellow wavelength range caused by the 4f-5d transition. $Mn^{4+}$ doped phosphors which have no such drawbacks and which can further improve the color rendering index (CRI) are now of great interest. However, $Mn^{4+}$-doped phosphors have a disadvantage in that the emission wavelength is determined depending on the host due to the $^2E_g{\rightarrow}^4A_2$ transition. In this study, the $SrO-BaO-GeO_2$ solid-solution was selected, and $Sr_{1-x}B_axGe_4O_9:Mn^{4+}{_{0.005}}$ ($0{\leq}x{\leq}1$) phosphors were synthesized and characterized. This led to a versatile color tuning in LED technology.

• International Journal of Highway Engineering
• /
• v.13 no.4
• /
• pp.231-238
• /
• 2011

Variable message signs(VMS) in use are being displaying with the LED device as the luminous source, and it is a recent trend to be changed from the Lamp type to the Surface-Mount Devices(SMD) type. The LED device leads to get VMS display brightly and clearly, leading to have visibility and legibility better than the existing VMS. However, the lights which display off the road, the unnecessary energy, might have negative effect on ecosystem. This study developed the way of getting the lights be displayed only to drivers without the unnecessary energy and estimated the energy efficiency of the development by the optical testing. As a result, this study showed that the energy consumption of the developed display device appeared to decrease by about 36.1% compared to the existing device. Also the upward and downward angle of the lights changed from an angle of $24^{\circ}C$ to $0^{\circ}C$and from an angle of $-24^{\circ}C$ to $-11^{\circ}C$, respectively. Therefore, it anticipates that the developed device would benefit highway safety due to an improvement in visibility and legibility compared to the existing VMS and the energy consumption would be less lower than the existing VMS.