• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.724-728
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• 2004

This paper describes on RIE(Reactive Ion Etching) characteristics of 3C-SiC(Silicon Carbide) grown on Si(100) wafers. In this work, CHF$_3$ gas was used to form the polymer as a function of a side-wall for excellent anisotropy etching during the RIE process. The ranges of the etch rate were obtained from 60 $\AA$/min to 980 $\AA$/min according to the conditions such as working gas pressure, RF power, distance between electrodes and the $O_2$ addition ratio in working gas pressure. Under the condition such as 100 mTorr of working gas pressure, 200 W of RF power and 30 mm of the distance between electrodes, mesa structures with about 40 of the etch angle were formed, and the vertical structures could be improved with 50 % of $O_2$ addition ratio in reactive gas during the RIE process. As a result of the investigation, we know that it is possible to apply the RIE process of 3C-SiC using CHF$_3$ for the development of electronic parts and MEMS applications in harsh environments.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.4
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• pp.347-353
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• 2002

A structure of a glass electrode-type pH sensor for measuring any concentration of $H^+$ in an aqueous solution was embodied with bulk micromachining technology. Two open well structures were formed, and a reference electrode was secured by the Ag/AgCl thin film in the sloped side of the etched structure. A sensitive membrane of an indicator electrode for generating a potential by an exchange reaction to $H^+$ was made with a glass containing Na 20% or more finely so that its thickness might be $100{\mu}m$ or so, and then it was bonded to one pyramidal structure. A liquid junction for a current path was formed by filling an agar in the anisotropically etched part of the Si wafer, which had a size of $50{\mu}m{\times}50{\mu}m$, and then bonded it to the other. After complete fabrication of each part, it was filled with a 2M KCl reference solution and encapsulated the sensor structure with a cold expoxy. The potential value of fabricated pH sensor was about 90mV/pH in the standard pH solutions.

• Applied Chemistry for Engineering
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• v.8 no.2
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• pp.161-171
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• 1997

Anodic regeneration of PCB enchant and cathodic deposition of copper using electrochemical method has been studied. Cu(I)/Cu(II) concentration ratio as a function of Cu(I) oxidation at the anode was measured from the potential difference between platinum and Ag/AgCl/4M KCl electrodes. Chlorine gas evolution was minimized by maintaining Cu(I) concentration above a specific concentration and using non-porous graphite electrode. Dendritic copper deposition was observed at the cathode and the optimum conditions for Cu deposition was identified as the current density of $360mA/cm^2$, and copper concentration of 12 g/l. Titanium was the most effective cathode material which showed a higher current efficiency and copper recovery. The current efficiency decreased with increasing temperature, but the highest power efficiency was achieved at $50^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.60-74
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• 1993

Experiments of RIE of tungsten films using SF$_{6}$ plasma were conducted to investigate the effect of process parameters on etch rate, uniformity, anisotropy, and selectivity. As power increased, the etch rate increased. Maximum etch rate was obtained at 200mtorr As interelectrode spacing increased the etch rate increased for P < 200mtorr while it decreased for P> 200mtorr. Etch rate was maximum at 20 sccm gas flow rate. As substrate temperature increased, the etch rate increased and activation energy was 0.046 eV. In addition, maximum etch rate was acquired at 20% $O_{2}$ addition. The etch rate slightly increased when Ar was added up to 20% while it continuously decreased when N$_{2}$ was added. Uniformity got improved as pressure decreased and was less than 4% for P <100mtorr. Mass spectrometer was utilized to analyze gas composition and S and F peaks were observed from XPS analysis with increasing power. The anisotropy was better for smaller power and spacing, and lower pressure and temperature. It improved when CH$_{4}$ was added and anisotropic etch profile was obtained when about 10% $O_{2}$ was added. The selectjvity was better for smaller power larger pressure and spacing, and lower temperature. Especially. low temperature processing was proposed as a novel method to improve the anisotropy and selectivity.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.31-43
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• 1993

Thermal behavior and $O_{2}$ plasma effects on residue and penetrated impurities formed by reactive ion etching (RIE) in CHF$_{3}$/C$_{2}$F$_{6}$ have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS) techniques. Decomposition of polymer residue film begins between 200-300.deg. C, and above 400.deg. C carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal above 800.deg. C under nitrogen atmosphere and out-diffusion of penetrated impurities is observed. The residue layer has been removed with $O_{2}$ plasma exposure of etched silicon and its chemical bonding states have been changed into F-O, C-O etc.. And $O_{2}$ plasma exposure results in the decrease of penetrated impurities.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.445.2-445.2
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• 2014

표면 조직화의 목적은 태양전지 표면에서의 입사되는 빛의 반사율을 감소 시키고, 웨이퍼 내에서 빛의 통과 길이를 길게 하며, 흡수되는 빛의 양을 증가시키는 것이다. 본 연구에서는 여러 가지 표면 조직화 공정 기술을 이용하여 표면 형상에 따른 광 변환 효율에 대해 연구하였으며, 셀을 제작하여 전기적 특성과 광학적 특성의 상관관계를 분석하였다. KOH를 이용한 표면 조직화, 산 증기를 이용한 표면 조직화, 반응성 이온 식각을 이용한 표면 조직화, 금속 촉매 반응을 이용한 표면 조직화 공정 기술을 이용하여 표면 조직화 공정을 진행하였다. 셀 제작 결과, 반사도 결과와는 상반되는 결과를 얻을 수 있었다. 표면 조직화 형상에 따른 셀 효율의 변화는 도핑 프로파일과 표면 재결합 속도의 변화 때문이라 생각되며 더 명확한 분석을 위해 양자 효율을 측정하여 분석을 시도하였다. 표면 조직화 공정 기술별 도핑 프로파일을 보면 KOH를 이용한 표면 조직화 공정을 제외한 나머지 표면 조직화 공정들의 도핑 프로파일은 불균일하게 형성되어 있는 것을 확인 할 수 있다. 양자 효율 측정 결과 단파장 대역에서 낮은 응답특성을 가지는 것을 확인 할 수 있었다. 그 이유는 낮은 반사도를 가지는 표면 조직화 공정의 경우 나노사이즈의 구조를 갖기 때문에 균일한 도핑 프로파일을 얻지 못해 전자, 정공의 분리가 제대로 이루어지지 못하였고 표면 재결합 속도증가의 원인으로 단락전류와 개방전압이 낮아져 효율이 떨어진 것으로 판단된다. 결과적으로 낮은 반사율을 갖는 표면 조직화 공정도 중요하지만 표면 조직화 공정 기술에 따른 균일한 도핑 프로파일을 갖는 공정을 개발한다면 단파장 응답도가 향상되어 단락전류밀도와 개방전압 상승효과를 얻을 수 있을 것이라 판단된다.

• Applied Chemistry for Engineering
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• v.9 no.7
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• pp.990-997
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• 1998

In this work, the $SiO_2$ films on the silicon substrate with different orientations were first prepared by the low temperature process using the ECR plasma diffusion as a function of microwave power and oxidation time. Before and after thermal treatment, the surface morphology, Si/O ratio from physicochemical properties, and the electrical properties of the oxide films were also investigated. The oxidation rate increased with microwave power, while surface morphology showed the nonuniform due to etching. The film quality, therefore, was lowered with increasing the defect by etching and the content of positive oxide ions in the oxide films from bulk by higher self-DC bias. The content of positive oxide ions in the oxide films with different Si orientations showed Si(100) < Si(111) < poly Si. The defects in $Si/SiO_2$ interface of $SiO_2$ film could be decreased by annealing, while $Q_{it}$ and $Q_f$ were independent of thermal treatment and the dependent on concentration of reactive oxide ions and self-DC bias of substrate. At microwave power of 300, and 400 W, the high quality $SiO_2$ film that had lower surface roughness and defect in $Si/SiO_2$ interface was obtained. The value of interface trap density, then, was ${\sim}9{\times}10^{10}cm^{-2}eV^{-1}$.

• Journal of the Korean Vacuum Society
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• v.13 no.1
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• pp.34-38
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• 2004

Hot embossing master is indispensable for the fabrication of polymeric optical waveguides using hot embossing technology. Sidewall roughness of silicon master is directly related to optical loss of optical waveguides In this paper, a silicon master was fabricated by using a deep-RIE process. Additionally, thermal oxidation followed by oxide removal was carried out to minimize etched Si sidewall roughness. Thermal oxidation and oxide removal were performed with $H_2O_2$ atmosphere at $1050^{\circ}C$ and $NH_4$F:HF=6:l BOE, respectively, for the oxide thickness of 400$\AA$, 1000$\AA$, 3000$\AA$, 4500$\AA$, 5600$\AA$ and 6200$\AA$. The sidewall roughness was characterized by SEM and SPM-AFH measurements. We found that the roughness was improved from 12nm (RMS) to 6nm (RMS) for the scalloped sidewall and from 162nm (RMS) to 39nm (RMS) for the vertical striation sidewall, respectively.

• Korean Journal of Materials Research
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• v.10 no.5
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• pp.360-363
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• 2000

Deformation in the hysteresis loop of $Pb(Zr,Ti)O_3$ (PZT) thin films with various Zr/Ti ratios has been studied by varying the top electrode preparation method and the annealing temperature. Pt/PZT/Pt capacitors was found to be positively poled due to dc plasma potential generated during reactive ion etch (RIE) of Rt. Internal field is formed by space charges trapped at domain boundaries. Aging phenomenon such as constriction in the middle of the hysteresis loop was observed in the PZT film with top electrode deposited by sputtering. Top electrode annealing restores the hysteresis loop by removing the space charges. As Zr/Ti ratio decrease, voltage shift increases and an-nealing temperature at which internal field disappears also increases.

• Korean Journal of Materials Research
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• v.21 no.2
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• pp.89-94
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• 2011

In this work, fabrication and electrochemical analysis of an individual multi-walled carbon nanotube (MWNT) electrode are carried out to confirm the applicability of electrochemical sensing. The reactive ion etching (RIE) process is performed to obtain sensitive MWNT electrodes. In order to characterize the electrochemical properties, an individual MWNT is cut by RIE under oxygen atmosphere into two segments with a small gap: one segment is applied to the working electrode and the other is used as a counter electrode. Electrical contacts are provided by nanolithography to the two MWNT electrodes. Dopamine is specially selected as an analytical molecule for electrochemical detection using the MWNT electrode. Using a quasi-Ag/AgCl reference electrode, which was fabricated by us, the nanoelectrodes are subjected to cyclic voltammetry inside a $2{\mu}L$ droplet of dopamine solution. In the experiment, RIE power is found to be a more effective parameter to cut an individual MWNT and to generate "broken" open state, which shows good electrochemical performance, at the end of the MWNT segments. It is found that the pico-molar level concentration of analytical molecules can be determined by an MWNT electrode. We believe that the MWNT electrode fabricated and treated by RIE has the potential for use in high-sensitivity electrochemical measurement and that the proposed scheme can contribute to device miniaturization.