• 제목/요약/키워드: 반도체-디스플레이장비

검색결과 509건 처리시간 0.021초

유전체 재료용 Phosphate계 유리-BNT($BaO-Nd_{2}O_{3}-TiO_{2}$)계 세라믹 복합체의 특성

  • 이회관;이용수;황성건;강원호
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.234-239
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    • 2004
  • 본 연구에서는 마이크로파용 유전재료로서 널리 사용되고 있는 BNT($BaO-Nd_{2}O_{3}-TiO_{2}$)계 세라믹스를 기본조성으로 하고, 저융점의 phoshpate계 유리 프릿의 첨가를 통해 LTCC(Low Temperature Cofired Ceramic)에 적용 가능한 유전율을 가진 조성을 개발 하고자, $70P_{2}O_{5}-5B_{2}O_{3}-(25-x)BaO-xNa_{2}O$ 유리를 제조 및 특성을 평가하였다. 또한, BNT계 세라믹스에 glass frit을 5 - 15 wt% 범위에서 첨가하고, $800 - 950^{\circ}C$의 온도범위에서 소결하여 제조된 유리-세라믹 복합체의 소결특성 및 유전특성을 조사하였다.

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2차원 손실 의료영상 압축

  • 김영섭
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.217-222
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    • 2004
  • This paper focuses on lossy medical image compression methods for medical images that operate on two-dimensional(2D) integer wavelet transform. We offer an application of the Set Partitioning in Hierarchical Trees(SPIHT) algorithm to medical images, using a 2D wavelet decomposition and a 2D spatial dependence tree. The wavelet decomposition is accomplished with integer wavelet filters implemented with the lifting method, where careful scaling and truncations keep the integer precision small and the transform unitary. We have tested our encoder on medical images using different integer filters. Results show that our algorithm with certain filters performs as well and is sometimes better lossy coding using 2D integer wavelet transforms on medical images.

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마이크로 플라즈마 전극가공을 위한 FIB 연구

  • 최헌종;강은구;이석우;홍원표
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.229-233
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    • 2004
  • The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments of the micro plasma electrode fabrications using FIB. The sputtering of FIB has one major problem that is redeposited by sputtered material including $Ga^+$ ion source. Therefore we have verified the effect of the reposition by EDX. And the optimal condition is suggested to machine the micro plasma electrode.

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초정밀 선형 모터의 열.진동 분석

  • 임경화;이우영;설진수;김현철
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.163-168
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    • 2004
  • Linear motor can directly apply to the system needed linear mot ions without rotary mot ions. To control a high-speed and high-resolution, the development of the linear motors is recently required in the high-integrated and speed process industry. This paper presents vibration analyses as well as measurement standards of the newly developed linear motors through analyzing the vibration characteristics and thermal behaviors of the advanced products. Vibration experiments are conducted for identifying the hysteresis and vibration level during operation. They are also included in the modal test to analyze the vibration. Analytic data using Finite Element Method (FEM) are compared with the results of the modal. Loss of temperature generated the linear motor leads to a serious deformation within its parts. The thermal behaviors are very important factor in linear motor. The FEM and experiments make it possible to understand these characteristics.

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전자 부품 검사용 광학분석 장비 제어시스템에 대한 연구 (Study on the Optical Analysis Equipment Control System for Electronic Parts Inspection)

  • 이준하
    • 반도체디스플레이기술학회지
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    • 제14권4호
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    • pp.67-71
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    • 2015
  • Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

태양전지 제조용 세정장비의 건조모듈 유동해석 (Flow simulations of the wet station dryer module for the solar cell manufacturing)

  • 홍주표;임기섭;윤종국
    • 반도체디스플레이기술학회지
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    • 제10권2호
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    • pp.109-113
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    • 2011
  • Hot air flow simulations of the wet station dryer module for the solar cell cleaning were conducted. Air incident angles such as to the substrates ($45^{\circ}$), to the bottom ($90^{\circ}$), and to the wall ($135^{\circ}$) were considered. Based on the simulated velocity and temperature profiles, appropriate incident angle was proposed, and it was well matched to experimental results. Additionally, uniform and non-uniform air hole sizes of the tube were compared for the uniform air flow distribution through the batch.

쌍 체임버 기반 장비의 로드락 구성에 따른 생산성 분석 (Throughput Analysis of the Twin Chamber Platform Equipment according to the Load-lock Configuration)

  • 홍주표;이기석
    • 반도체디스플레이기술학회지
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    • 제7권2호
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    • pp.39-43
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    • 2008
  • Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

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PE-CVD 장비의 샤워헤드 표면 온도 모니터링 방법 (Showerhead Surface Temperature Monitoring Method of PE-CVD Equipment)

  • 왕현철;서화일
    • 반도체디스플레이기술학회지
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    • 제19권2호
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    • pp.16-21
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    • 2020
  • How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

저 전압 고성능 DSP를 이용한 AC 서보 모터 제어

  • 최치영;홍선기
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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    • pp.8-11
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    • 2003
  • 본 연구는 AC서보 모터의 벡터 제어를 구현하는데 있어 디지털 제어에 의한 시간 지연 및 Af) 변환기, QEP(Quadrature Encoder Pulse Circuit)등 주변 소자의 시간 지연에 의한 노이즈를 최소화하지 위하여 고성능 저 전압형 DSP인 TMX320F2812를 사용하였다. TMX320F2812는 150MIPS의 빠른 연산 속도와 12비트의 AD 컨버터, QEP회로는 물론 공간 전압 벡터 PWM을 발생시킬 수 있는 기능을 가진 모터 제어용 원친 DSP이다. 이와 같이 주변 회로들을 내장한 고성능 DSP의 사용은 모터 제어부의 하드웨어적인 구성을 간소화 시키고 이로 인한 비용 절감을 얻을 수 있다. 또한 전류 샘플을 위한 필터 부분을 디지털 필터화 하여 전류 샘플링 노이즈를 제거하였고, 옵셋 전압을 이용한 SVPWM을 구현하여 연산 시간을 대폭 단축 하였다. TMX320F2812의 단점인 고정 소수점 연산에 대해서는 각 변수에 대한 스케일링을 통해 유효 자리를 확보하였다.

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Dislocation densities of CMP processed sapphire wafers for GaN epitaxy

  • 황성원;남정환;신귀수;김근주;서남섭
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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    • pp.18-22
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    • 2003
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by grinding, lapping and polishing. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. This mechanical stress and strain can be cured by thermal anneal ing process. The sapphire crystalline wafers were annealed at $1100~1400^{\circ}C$ and then characterized by double crystal X-ray diffraction. The sample showed good quality of crystalline wafer surface wi th full width at hal f maximum of 16 arcsec for the 4-hour heat-treatment at $1300^{\circ}C$.

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