• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.256.1-256.1
• /
• 2014

21세기 정보화 시대의 도래와 함께 반도체 및 디스플레이 분야는 고부가가치산업으로 급격히 성장하였고, 현재까지도 미래의 지속적인 시장 창출을 위하여 기술개발과 투자로 초미세화, 고효율, 대면적화에 대한 원천기술 확보가 중요시되고 있다. 반도체 및 디스플레이의 대면적화가 진행됨에 따라 플라즈마 공정장비의 대면적화도 활발히 기술개발이 진행되고 있으며, 대면적화에 있어 플라즈마의 공간균일도는 생산수율 및 공정균일화를 위해 기본적으로 평가되어야 하는 중요한 지표가 되었다. 하지만 종래의 진단법들은 대면적 플라즈마 진단에 매우 제한적이기 때문에 본 연구에서는 대면적 플라즈마의 공간균일도 평가를 위해 플라즈마의 방출광 측정을 기초로 하는 진단계를 개발하였다. 플라즈마 방출광을 이용한 진단은 플라즈마에 섭동을 주지 않고 전자온도의 변화 및 공간균일도를 평가할 수 있다. 이 진단법은 두 마주보는 한쪽 면이 평평한 볼록렌즈(plano-convex lens)로 이루어진 수광시스템과 역변환 알고리즘을 통해 선 적분된 방출광으로부터 플라즈마 방출광의 국지적 정보를 측정하는 것이다. 플라즈마와 같이 크기가 큰 광원의 경우 렌즈 광학계에서 필연적으로 수반되는 선적분된(chord-integrated) 방출광을 제거하기 위해 구조에 따른 시스템 함수를 이용한 푸리에 변환 알고리즘을 개발하였고, 이를 통해 렌즈 초점거리의 정확한 방출광 세기만 재구성하였다. 이러한 재구성 방법을 이용하여 렌즈의 거리를 움직이며 대면적 플라즈마의 방출광 분포측정을 수행하였고, 이에 대한 결과를 발표하고자 한다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2006.05a
• /
• pp.225-231
• /
• 2006

.고상반응법 (solid state reaction)합성된 ZnS:Mn,Cu,Cl 형광체는 약 $20^{\sim}25{\mu}m$ 의 구형이고, Cubic/hexagonal 구조를 보였다. Electroluminescent device(ELD)는 실크 스크린된 형광층(ZnS:Mn,Cu,Cl)/유전체층 ($BaTiO_3$)으로 구성되었으며, 각층은 $30^{\sim}50{\mu}m,\;50^{\sim}60{\mu}m$ 정도로 도포 하였다. 100 V-400 Hz 의 구동조건에서, ELD 의 백색 발광은 450 nm, 480 nm 픽에서 각각 $Cl_s{\to}Cu^{+}\;_{Zn},\;Cl_s{\to}Cu^{2+}\;_{Zn}$ 전이에 의해 중첩된 청색, 녹색 밴드의 발광과, 580 nm 픽에서 Mn 의 $^{4}T_1{\to}^{6}A_1$ 전이에 의한 황색 밴드의 발광으로 이루어진다. Cu 농도의 증가에 따라 450 nm 의 발광 밴드의 휘도는 감소하며 580 nm 의 발광 밴드의 휘도가 증가하였고 발광 휘도가 향상되었다. 즉, 색온도가 높은 cold white(10000 K)에서 색온도가 낮은 Warm white(3000 K) 로 변한다. 이것은 450 nm 의 발광 밴드가 580 nm 의 발광 밴드에 흡수되는 에너지 전이 (Energy transfer) 현상에 기인한다. ZnS:Mn,Cu,Cl 의 Mn 1.5 wt %, Cu 2.5 wt.% 에서 최적 발광 휘도를 보이며, 100 V-400 Hz 에서 약 $12cd/cm^2$이였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2006.05a
• /
• pp.190-193
• /
• 2006

Gadolinium-substituted bismuth titanate, $Bi_{3.3}Gd_{0.7}Ti_{3}O_{12}$, thin films were successfully fabricated on Pt(111)/Ti/$SiO_2$/Si(100) substrates by a MOCVD process. Fabricated BGT thin films were found to be random oriental ions, which were confirmed by X-ray diffraction and scanning electron microscope analysis. The remanent polarization value ($2P_r$) of the BGT thin film annealed at $720^{\circ}C$ was $45.13{\mu}C/cm^2$, at an applied voltage of 5 V. The BGT thin film exhibits a good fatigue resistance up to $1{\times}10^{11}$ switching cycles at a frequency of 1 MHz with applied voltage of 5 V. These results indicate that the randomly oriented BGT thin film is a promising candidate among ferroelectric materials useful in lead-free nonvolatile ferroelectric random access memory applications.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.139-144
• /
• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.125-130
• /
• 2011

The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within $20{\mu}m$ width on a $20{\mu}m$ thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.4
• /
• pp.119-124
• /
• 2011

Flow and temperature field in reactors are important factors for design of thermal chemical vapor deposition system to grow carbon nanotubes. In this study, effects of the variations of the inlet and outlet areas of the CVD reactor to the flow characteristics and temperature field are numerically analyzed. High temperature of the gas in the entrance region is obtained with slow gas speed resulted from the enlarged inlet area. Variation of the exit area has little effects on the flow field and temperature in the reactor. However the largest area among considered cases gives the highest gas temperature though the differences are small.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.100-105
• /
• 2020

Recently, as display and semiconductor devices have been miniaturized and highly integrated, there is a demand for optimization of the structural characteristics of the thin film accordingly. The sputtering device has the advantage of stably obtaining a desired thin film depending on the material selected for the target. However, due to the structural characteristics of the sputtering equipment, the structural characteristics of the film may be different depending on the incidence angle of the sputtering target material to the substrate. In this study, the characteristics of the thin film material according to the scattering angle of the target material and the incidence position of the substrate were studied to find the optimization design rule of the sputtering equipment. To this end, a Si thin film of 1 ㎛ or less was deposited on the Si(100) substrate, and then the microstructure, reflectance, surface roughness, and thin film crystallinity of the thin film formed for each substrate location were investigated. As a result of the study, it was found that as the sputter scattering angle increased and the substrate incident angle decreased, the gap energy along with the surface structure of the thin film increased from 1.47 eV to 1.63 eV, gradually changing to a non-conductive tendency.

• Journal of the Semiconductor & Display Technology
• /
• v.13 no.3
• /
• pp.39-43
• /
• 2014

The effect of electrode charging on the ion energy distribution (IED) was investigated in the dual-frequency capacitively coupled plasma source which was powered of 100 MHz RF at the top electrode and 400 kHz bias on the bottom electrode. The charging property was analyzed with the distortion of the measured current and voltage waveforms. The capacitance and the resistance of electrode sheath can change the property of ion and electron charging on the electrode so it is sensitive to the plasma density which is controlled by the main power. The ion energy distribution was estimated by equivalent circuit model, being compared with the measured distribution obtained from the ion energy analyzer. Results show that the low frequency bias power changes effectively the low energy population of ion in the energy distribution.

• Journal of the Semiconductor & Display Technology
• /
• v.15 no.2
• /
• pp.74-80
• /
• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2002.11a
• /
• pp.85-90
• /
• 2002

$RuO_2$/GaN and related contacts were investigated for Schottky contacts in GaN-Based optical and electronic devices. We demonstrated that an $RuO_2$ film forms a stable Schottky contact on a GaN layer with a barrier height (${\Phi}_B$) of 1.46 eV and transmittance of 70% in the visible and near UV region. $RuO_2$/GaN Schottky diode showed a breakdown at over -50V and leakage current of only 0.3 nA at -5V. The $RuO_2$/GaN Schottky type photodetector had the UV/Visible rejection ratio of over $10^5$ and the responsivity of 0.23 A/W at 330 nm. The $RuO_2$ gate AlGaN/GaN EFET exhibited high drain current ($I_d$) of 689.3 mA/mm and high transconductance ($g_m$) of 197.4 mS/mm. Cut-Off frequency ($f_t$) and maximum operating frequency ($f_{max}$) were measured as 27.0 GHz and 45.5 GHz, respectively.