• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.1
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• pp.51-58
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• 2016

As semiconductor technology has developed, device performance has been improved. However, since device structures became smaller, circuit aging due to operational and environmental conditions can be accelerated. Circuit aging causes a performance degradation and eventually a system error. In reliable systems, a failure due to aging might cause a great disaster. Therefore, these systems need a performance degradation prediction function so that they can take action in advance before a failure occurs. This paper presents an on-line circuit performance degradation monitoring scheme for predicting a failure by detecting performance degradation during circuit normal operation. In our proposed scheme, IEEE 1149.1 output boundary scan cells and TAP controller are reused. The experimental result shows that the proposed architecture can monitor the performance degradation during normal operation without stopping the circuit.

• Polymer(Korea)
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• v.35 no.2
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• pp.136-140
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• 2011

The plasma resistances of nitrile curable perfluoro elastomer (NT PFE) and peroxide curable PFE (PO PFE) after exposing to $NF_3$ and $O_2$ remote plasmas were investigated by analyzing weight loss and morphology of O-ring made of PFE. The compounds were designed following the typical formulations of O-ring/seal which were applied in semiconductor and LCD production site. They were blended by an open roll mill, and then, O-ring was finally made by hot press molding and oven curing. The weight loss was calculated and morphology was observed for each atmosphere and temperature by a digital weighing machine and SEM. As results, it was confirmed the weight loss and related morphology were meaningfully different according to the cure type of PFE, filler system, and the species of remote plasma.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.7
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• pp.2323-2327
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• 2010

The experimental apparatus consists of dehumidifier with multi-layer type heat exchangers to remove the moisture from automatic equipments, semiconductors, and manufacturing processes under the low temperature environment, and chemical production lines which are likely to take moisture. The major components of this system are four evaporators with different fin pitch, two compressors, two condensers and an expansion valve. In this study, the performance characteristics of dehumidifier is analyzed by the variations of frontal air velocity in the first heat exchanger(evaporator). The cooling capacity of each heat exchanger is acquired by the enthalpy calculating from measuring point of temperature and relative humidity of the first heat exchanger from 1.0m/s to 4.0m/s with increasing interval 0.5m/s, and the front air velocity. As a result, it is found that cooling capacity of the first heat exchanger showed the best cooling capacity when its frontal air velocity is 2.0 m/s.

• Analytical Science and Technology
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• v.19 no.6
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• pp.535-543
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• 2006

Being used widely in semiconductor and display manufacturing, $NF_3$ is internationally considered as one of the regulated compounds in emission. Numerous companies have been continuously trying to reduce the emissions of $NF_3$ to comply with the global environmental regulation. This work is made to report the destruction and removal efficiency (DRE) of electrically heated scrubbers and the use rate in process chambers installed in three main LCD manufacturing companies in Korea. As the measurement techniques for $NF_3$ emission, mass flow controlled helium gas was continuously supplied into the equipment by which scrubber efficiency is being measured. The partial pressures of $NF_3$ and helium were accurately measured for each sample using a mass spectrometer, as it is emitted from inlet and outlet of the scrubber system. The results show that the DRE value for electrically heated scrubbers installed before 2004 is less than 52 %, while that for the new scrubbers modified based on measurement by scrubber manufacturer has been sigificentely improved upto more than 95 %. In additon, we have confirmed the efficiency depends on such variables as the inlet gas flow rate, water content, heater temperature, and preventative management period. The use rates of $NF_3$ in process chambers were also affected by the process type. The use rate of radio frequency source chambers, built in the $1^{st}$ and $2^{nd}$ generation process lines, was determined to be less than 75 %. In addition, that of remote plasma source chambers for the $3^{rd}$ generation was measured to be aboove 95 %. Therefore, the combined application of improved scrubber and the RPSC process chamber to the semiconductor and display process can reduce $NF_3$ emmision by 99.95 %. It is optimistic that the mission for the reduction of greenhouse gas emission can be realized in these LCD manufacturing companies in Korea.

• Journal of the Korean Institute of Gas
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• v.21 no.6
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• pp.52-60
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• 2017

In diffusion process exhaust line during semiconductor manufacturing process, In order to improve the transportation efficiency in the piping by removing "The reaction by-product, $ZrO_2$ and The unreacted material, TEMAZ, TMA, $O_3$, etc" and "Powder being deposited", the piping temperature was raised to $80^{\circ}C$ or more by using the heater jacket, and the bellows at the rear end of the vacuum pump ruptured. So conducted a case study and try to prevent the similar accidents from occurring through case studies. The causes of the accident were analyzed as follows: the inflow of outside air due to the generation of a gap on the suction side of the vacuum pump and heating the pipe with the heater jacket resulted in the overpressure in the pipe due to the volumetric expansion of the gas generated by decomposition of the unreacted TEMAZ, It can be assumed that the most vulnerable bellows of the piping has been ruptured. In order to prevent such accidents, This study is aimed to identify the cause of pipeline rupture accident and to establish safety measures for the prevention of similar accidents by evaluating physical hazards of TEMAZ, which is assumed to be the cause of pipe rupture accident.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.206-211
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• 2016

Various applications require dry air at low temperature, such automation equipment, semiconductor manufacturing, chemical production lines, and coating processes for the shipbuilding industry. Four evaporators for low temperature (below $0^{\circ}C$) were installed for a dehumidification system. Moist air is cooled sequentially over three evaporators. The first evaporator has an evaporation temperature of $13^{\circ}C$, that of the second evaporator is $5^{\circ}C$, and that of the third evaporator is maintained at $-1.3^{\circ}C$. In the fourth evaporator implantation thereby the moisture contained in the moisture air. A pressure regulator (CPCE 12) is used at this point and is defrosted when the vapor pressure is below a set value. The non-implantation moisture of the air is a heating system that uses the waste heat of a condenser with high temperature. It develops the cooling type's dehumidifier, which is important equipment that prevents the destruction of protein and measures the temperature and humidity at each interval by changing the front air velocity from 1.0 m/s to 4.0 m/s. The cooling capacity was also calculated. The greatest cooling capacity was 1.77 kcal/h for a front air velocity of 2.0 m/s