• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.251-265
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• 2001

As the device scaling proceeds, the operating voltage(VDD) of giga-bit DRAMs is expected to be reduced to 1.5V or down, fir improving the device reliability and reducing the power dissipation. Therefore the low-voltage circuit design techniques are required to implement giga-bit DRAMs. In this work, state-of-art low-voltage DRAM circuit techniques are reviewed, and four kinds of low-voltage circuit design techniques are newly proposed for giga-bit DRAMs. Measurement results of test chips and SPICE simulation results are presented for the newly proposed circuit design techniques, which include a hierarchical negative-voltage word-line driver with reduced subthreshold leakage current, a two-phase VBB(Back-Bias Voltage) generator, a two-phase VPP(Boosted Voltage) generator and a bandgap reference voltage generator.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.8
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• pp.98-105
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• 2008

FlexRay is a high-speed communications protocol with high flexibility and reliability. It was devised by automotive manufacturers and semiconductor vendors and implemented as on vehicle LAN protocol using x-by-wire systems. FlexRay provides a high speed serial communication, time triggered bus and fault tolerant communication between electronic devices for automotive applications. In this paper, we first design the FlexRay communication controller, bus guardian protocol specification and function parts using SDL (Specification and Description Language). Then, the system is re-designed using Verilog HDL based on the SDL source. The FlexRay system was synthesized using Samsung $0.35{\mu}m$ technology. It is shown that the designed system can operate in the frequency range above 76 MHz. In addition, to show the validity of the designed FlexRay system, the FlexRay system is combined with automobile advance alarm system in vehicle applications. The FlexRay system is implemented using ALTERA Excalibur ARM EPXA4F672C3. It is shown that the implemented system operates successfully.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.3
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• pp.570-576
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• 2007

In this study, the characteristics of metal-ferroelectric-semiconductor FET (MFSFET) device is investigated using field-dependent polarization and square-law FET models. From drain current with the gate voltage variation, when coercive voltages of ferroelectric thin film are 0.5 and 1V, the memory windows are 1 and 2V, respectively. When the gate voltages are 0, 0.1, 0.2 and 0.3V, the difference of saturation drain currents of the MFSFET device at two threshold voltages in ID-VD curve are 1.5, 2.7, 4.0, and 5.7mA, respectively. As a result of the analysis for drain currents after tine lapse, which is based on the simulation for hysteresis loop and the fitting of retention properties of ferroelectric thin films such as PLZT(10/30/70), PLT(10) and PZT(30/70) thin film shows excellent reliability that the decrease of saturation current is about 18% after 10 years.

• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.3
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• pp.619-626
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• 2019

The advances of semiconductor and circuitry technology dovetailed with nano processing techniques have further enhanced micro-miniaturization, sensitivity, longevity and reliability in MID(Medical Implant Device). Nevertheless, one of the remaining challenges is whether power can sufficiently and continuously be supplied for the operation of the MID. Self-powered MID that harvest biomechanical energy from human motion, respiratory and muscle movement are part of a paradigm shift. In this paper, we developed a rechargeable pacemaker through self-power generation with the triboelectric nanogenerator. We demonstrate a fully implanted pacemaker based on an implantable triboelectric nanogenerator, which act as a storage as well as active movement on a large-animal(dog) scale. The self-power pacemaker harvested from animal motion is 2.47V, which is higher than the required pacemaker device sensing voltage(1.35V).

• Progress in Superconductivity and Cryogenics
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• v.9 no.3
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• pp.57-61
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• 2007

The current limiting characteristics of hybrid SFCL with additional power electronic devices was investigated in order to improve operation reliabilities. The hybrid SFCL developed consists of a superconducting trigger (S/T) part, a fast switch (F/S) module and a current limiting (C/L) part. Although hybrid SFCL had shown a excellent current limiting characteristics, this device was rather vulnerable to the residual arc currents which could exist during fast switch operation. This undesirable arc should be extinguished as quickly as possible in order to implement perfect fault current commutation. So, in order to eliminate the residual arcs between fast switch contacts, the power electronic devices (IGBT or GTO) were connected in series between the S/T part and the interrupter of the F/S module. According to the fault tests conducting with an input voltage of $270\;V_{rms}$ and a fault current of $5\;kA_{rms}$, The power electronic devices could perfectly remove the arc generated between the contacts of the interrupter within 4 ms after the fault occurred. From the test analysis, it was confirmed that the hybrid SFCL could enhance the operation reliability by adopting additional power electronic devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.20-20
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• 2008

최근 LEDs가 동일 효율의 전구에 비해 에너지 절감 효과 크며 신뢰성이 뛰어나다기 때문에 기존 광원을 빠르게 대체해 나가고 있다. 특히 자외선 파장을 가지는 LEDs는 발열이 낮아 냉각장치가 필요 없으며, 수명이 길어 기존 UV lamp에 비해 많은 장점을 가지고 있기 때문에 많은 관심을 밭고 있다. 그럼에도 불구하고 자외선 LEDs는 제조 단가가 높고 power가 낮아 소요량이 많은 등 아직 해결해야 할 부분이 많기 때문에 이를 해결하기 위해 여러가지 재료와 다양한 구조가 고려되고 있다. 그 중 ZnO는 II-VI족 화합물 반도체로써 UV영역의 넓은 밴드갭(3.37eV)을 가지는 투명한 재료이다. 특히 ZnO는 60meV의 큰 엑시톤 결합에너지를 가지며, 가시광 영역에서 높은 투과율을 가지고, 상온에서 물리적, 화학적으로 안정하기 때문에 UV sensor, UV laser, UV converter, UV LEDs 등 광소자 분야에서 연구가 활발히 진행되고 있다. ZnO가 광소자의 발광재료로써 높은 효율을 얻기 위해서는 결정성을 높여 내부 결함을 감소시키며, 발광 면적을 높일 수 있는 구조가 요구된다. 특히 MOCVD 법으로 성장한 나노막대는 에피성장되어 높은 결정성을 기대할 수 있으며, 성장 조건을 조절함으로써 나노막대의 aspect ratio와 밀도 제어할 수 있기 때문에 표면적을 효과적으로 넓혀 높은 발광효율을 얻을 수 있다. 본 실험에서는 MOCVD 법으로 실리콘과 사파이어 기판 위에 다양한 성장 온도를 가진 나노구조를 성장 시키고 온도에 따른 형상 변화와 특성을 평가하였다. ZnO 의 성장온도가 약 $360^{\circ}C$ 일 때, 밀도가 조밀하고 기판에 수직 배열한 균일한 나노막대가 성장되었으며 우수한 결정성, 광학적 특성이 나타남을 SEM, TEM, PL, XRD를 사용하여 확인하였다.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.200-204
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• 2011

In this paper, we deposited the tungsten carbon nitride (W-C-N; nitrogen gas flow of 2 sccm) and tungsten carbon (W-C) thin film on silicon substrate using rf magnetron sputter. Then the thin films annealed at $800^{\circ}C$ during 30 minute ($N_2$ gas ambient) for thermal damage. Nano-indenter was executed 16 points on thin film surface to measure the thermal stability, and we also propose the elastic modulus and the Weibull distribution, respectively. This nanotribology method provides statistically reliable information. From these results, the W-C-N thin film included nitrogen gas flow is more stable for film uniformities, physical properties and crystallinities than that of not included nitrogen gas flow.

• Journal of the Korean Society for information Management
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• v.39 no.1
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• pp.257-280
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• 2022

In this study, we analyzed comments on news articles of representative companies of the three industries (i.e., semiconductor, secondary battery, and bio industries) that had been listed as national strategic technology projects of South Korea to identify public opinions towards them. In addition, we analyzed the relationship between changes in public opinion and stock price. 'Samsung Electronics' and 'SK Hynix' in the semiconductor industry, 'Samsung SDI' and 'LG Chem' in the secondary battery industry, and 'Samsung Biologics' and 'Celltrion' in the bio-industry were selected as the representative companies and 47,452 comments of news articles about the companies that had been published from January 1, 2020, to December 31, 2020, were collected from Naver News. The comments were grouped into positive, neutral, and negative emotions, and the dynamic topics of comments over time in each group were analyzed to identify the trends of public opinion in each industry. As a result, in the case of the semiconductor industry, investment, COVID-19 related issues, trust in large companies such as Samsung Electronics, and mention of the damage caused by changes in government policy were the topics. In the case of secondary battery industries, references to investment, battery, and corporate issues were the topics. In the case of bio-industries, references to investment, COVID-19 related issues, and corporate issues were the topics. Next, to understand whether the sentiment of the comments is related to the actual stock price, for each company, the changes in the stock price and the sentiment values of the comments were compared and analyzed using visual analytics. As a result, we found a clear relationship between the changes in the sentiment value of public opinion and the stock price through the similar patterns shown in the change graphs. This study analyzed comments on news articles that are highly related to stock price, identified changes in public opinion trends in the COVID-19 era, and provided objective feedback to government agencies' policymaking.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1992.10a
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• pp.48-52
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• 1992

진동원을 가진 장비를 임의의 구조물에 설치할 경우 관심이 되는 문제는 구 조물의 임의의 위치에서의 진동 수준을 추정하는 일이다. 특히 정밀장비를 다루는 반도체 공장에서 크린룸이나, 정밀측정, 분석 실험실등 미진동을 제 어해야 하는 분야에서는 더욱 그 필요성이 대두되고 있다. 진동제어가 필요 한 공간에 대한 진동수준의 예측이 가능할 경우 진동윈이나 수진점(active and passive type)방진에서 최적화된 전달률(transmissibility)을 명확히 결정 할 수 있어 설계와 시행오차를 최소화 할 수 있다. 그러나 이러한 실제문제 를 다룰 경우 대부분 진동제어 구조물은 복잡하고 설치 운용되는 장비들은 대형, 복합장비가 사용되는 것이 일반적이고 수행기간도 여러가지 공정상 단 시간에 이루어져야 하는 현실적인 어려움이 있다. 진동제어가 필요한 구조물 에 대한 임의의 공간에서 진동수준을 신속하고 정확하게 예측하기 위해서는 최소한 두 가지 정보만이라도 명확히 해야 한다. 하나는 장비의 주파수별 정 확한 가진력의 산정이고 다른 하나는 장비가 설치되고 진동제어가 필요한 구조물에 대한 동적특성(dynamic property)이다. 가진력에 대한 정보는 일반 적으로 장비제작사가 제시하는 것이 원칙이나 그렇지 못할 경우 구조해석 기술자(structure engineer)가 해석적으로 추정하거나 또는 명확히 가진 특성 을 알지 못하는 복잡한 장비는 실험적으로 결정해야 한다. 구조물의 동적 특 성을 나타내는 모빌리티(mobility)를 구하는 방법은 해석적인 방법과 실험적 인 방법이 있으나 복합재료, 복잡한 구조형태나, 지지조건, 다양한 결합부의 동적 특성을 정의하여 해석적으로 정확히 해결하기에는 어려움이 있다. 이러 한 제한조건을 손쉽게 해결하는 방법은 실 구조물에 대한 동적실험(dynamic test)을 통하여 단기간에 동적특성을 결정하고 SDM(structure dynamic modification)이나 FRS(force response simulation)를 수행하여 임의의 좌표 공간에 대한 진동수준을 해석적으로 예측할 뿐만 아니라 구조물의 진동제어 를 위한 동적인자를 변경시킬 수 있는 정보를 제공하며 장비를 방진할 경우 신뢰성 있는 전달률을 결정할 수 있다. 실험적으로 철교, 교량이나 건물의 철골구조 및 2층 바닥 등 대,중형의 복잡한 구조물에 대항 동특성을 나타내 는 모빌리티를 결정할 경우 충격 가진 실험이 사용되는 실험장비 측면에서 나 실험을 수행하는 과정이 대체적으로 간편하다. 그러나 이 경우 대상 구조 물을 충분히 가진시킬수 있는 용량의 대형 충격기(large impact hammer)가 필요하게 된다. 이러한 동적실험은 약 길이 61m, 폭 16m의 4경간 교량에 대 하여 동적실험을 수행하여 가능성을 확인하였다. 여기서는 실험실 수준의 평 판모델을 제작하고 실제 현장에서 이루어질 수 있는 진동제어 구조물에 대 한 동적실험 및 FRS를 수행하는 과정과 동일하게 따름으로써 실제 발생할 수 있는 오차나 error를 실험실내의 차원에서 파악하여 진동원을 있는 구조 물에 대한 진동제어기술을 보유하고자 한다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.