• Title/Summary/Keyword: 반도체상

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Formulation and ink-jet 3D printability of photo curable nano silica ink (광경화 나노 실리카 잉크의 합성 및 잉크젯 프린팅 적층 특성평가)

  • Lee, Jae-Young;Lee, Ji-Hyeon;Park, Jae-Hyeon;Nahm, Sahn;Hwang, Kwang-Taek;Kim, Jin-Ho;Han, Kyu-Sung
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.6
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    • pp.345-351
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    • 2019
  • Recently, ink-jet printing technology has been applied for various industries such as semiconductor, display, ceramic tile decoration. Ink-jet printing has advantages of high resolution patterning, fast printing speed, high ink efficiency and many attempts have been made to apply functional materials with excellent physical and chemical properties for the ink-jet printing process. Due to these advantages, research scope of ink-jet printing is expanding from conventional two-dimensional printing to three-dimensional printing. In order to expand the application of ink-jet printing, it is necessary to optimize the rheological properties of the ink and the interaction with the substrate. In this study, photo curable ceramic complex ink containing nano silica particles were synthesized and its printability was characterized. Contact angle of the photo curable silica ink were modified by control of the ink composition and the surface property of the substrate. Effects of contact angle on printing resolution and three-dimensional printability were investigated in detail.

Implementation of Wired Sensor Network Interface Systems (유선 센서 네트워크 인터페이스 시스템 구현)

  • Kim, Dong-Hyeok;Keum, Min-Ha;Oh, Se-Moon;Lee, Sang-Hoon;Islam, Mohammad Rakibul;Kim, Jin-Sang;Cho, Won-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.10
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    • pp.31-38
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    • 2008
  • This paper describes sensor network system implementation for the IEEE 1451.2 standard which guarantees compatibilities between various wired sensors. The proposed system consists of the Network Capable Application Processor(NCAP) in the IEEE 1451.0, the Transducer Independent Interface(TII) in the IEEE 1451.2, the Transducer Electronic Data Sheet(TEDS) and sensors. The research goal of this study is to minimize and optimize system complexity for IC design. The NCAP is implemented using C language in personal computer environment. TII is used in the parallel port between PC and an FPGA application board. Transducer is implemented using Verilog on the FPGA application board. We verified the proposed system architecture based on the standards.

Study on the Top-Gate Pentacene Thin Film ransistors Using Solution Processing Polymeric Gate Insulator (용액 공정 고분자 게이트 절연체를 이용한 Top-Gate 펜타센 박막 트랜지스터에 관한 연구)

  • Hyung, Gun-Woo;Kim, Jun-Ho;Seo, Ji-Hoon;Koo, Ja-Ryong;Seo, Ji-Hyun;Park, Jae-Hoon;Jung, Young-Ou;Kim, You-Hyun;Kim, Woo-Young;Kim, Young-Kwan
    • Journal of the Korean Applied Science and Technology
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    • v.25 no.3
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    • pp.388-394
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    • 2008
  • 본 논문에서는 용액 공정을 이용한 고분자 절연층을 갖는 top-gate 구조의 펜타센 박막 트랜지스터(Thin Film Transistor, TFT)의 특성을 연구하였다. Top-gate 구조의 펜타센 TFT 제작에 앞서 유기 반도체인 펜타센의 결정성 성장을 돕기 위해서 가교된 PVP (cross-linked poly(4-vinylphenol))를 유리 기판 상에 스핀 코팅을 이용하여 형성한 후, 노광 공정을 통해 니켈/은 구조를 갖는 채널 길이 $10{\mu}m$의 소오스, 드레인 전극을 형성하였다. 그리고 열 증착을 이용하여 60 nm 두께의 펜타센 층을 성막하였고, 고분자 절연체로서 PVA(polyvinyl alchol) 또는 가교된 PVA를 용액공정인 스핀 코팅을 이용하여 형성한 후 열 증착으로 알루미늄 게이트 전극을 성막하였다. 이로써 제작된 소자들의 전기적 특성을 확인한 결과 가교된 PVA를 사용한 펜타센 TFT 보다 PVA를 게이트 절연체로 사용한 소자가 전기적 특성이 우수한 것으로 관찰되었다. 이는 PVA의 가교 공정에 의한 펜타센 박막의 성능 퇴화에 기인한 것으로 사료된다. 실험 결과 $0.9{\mu}m$ 두께의 PVA 게이트 절연막을 사용한 top-gate 구조의 펜타센 TFT의 전계 효과 이동도와 문턱전압, 그리고 전류 점멸비는 각각, 약 $3.9{\times}10^{-3}\;cm^2/Vs$, -11.5 V, $3{\times}10^5$으로써 본 연구에서 제안된 소자가 용액 공정형 top-gate 유기 TFT 소자로서 우수한 성능을 나타냄을 알 수 있었다.

A System Model of Iterative Image Reconstruction for High Sensitivity Collimator in SPECT (SPECT용 고민감도 콜리메이터를 위한 반복적 영상재구성방법의 시스템 모델 개발)

  • Bae, Seung-Bin;Lee, Hak-Jae;Kim, Young-Kwon;Kim, You-Hyun;Lee, Ki-Sung;Joung, Jin-Hun
    • Journal of radiological science and technology
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    • v.33 no.1
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    • pp.31-36
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    • 2010
  • Low energy high resolution (LEHR) collimator is the most widely used collimator in SPECT imaging. LEHR has an advantage in terms of image resolution but has a difficulty in acquiring high sensitivity due to the narrow hole size and long septa height. Throughput in SPECT can be improved by increasing counts per second with the use of high sensitivity collimators. The purpose of this study is to develop a system model in iterative image reconstruction to recover the resolution degradation caused by high sensitivity collimators with bigger hole size. We used fan-beam model instead of parallel-beam model for calculation of detection probabilities to accurately model the high sensitivity collimator with wider holes. In addition the weight factors were calculated and applied onto the probabilities as a function of incident angle of incoming photons and distance from source to the collimator surface. The proposed system model resulted in the equivalent performance with the same counts (i.e. in shortened acquisition time) and improved image quality in the same acquisition time. The proposed method can be effectively applied for resolution improvement of pixel collimator of next generation solid state detectors.

Study on Exposure Dose According to Change of Source to Image Distance and Additional Filter Using Abdomen Phantom (복부팬텀을 이용한 SID 변화와 부가필터 유무에 따른 피폭선량에 관한 연구)

  • Kim, Ki-Won;Son, Jin-Hyun
    • Journal of radiological science and technology
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    • v.39 no.3
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    • pp.407-414
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    • 2016
  • This study is to minimize the patient dose and maintain the image quality according to change of source to image receptor distance and applying additional filter. In this study, we used the DR system, the tissue-equivalent abdomen phantom and the aluminium filter. The exposure conditions were set to 80 kVp using AEC mode. The collimation size was $16{\times}16inch$. The exposure dose were measured 10 times when the SID was changed with 100, 110, 120 and 130 cm, respectively. The pirana 657 for dosimeter was located on center of radiation irradiation. The acquired images were analyzed by using the image J. In the results, the tube current was increased with increasing the SID but ESD was decreased with increasing the SID. The decrease of ESD attribute to use of filter that remove the photon of lower energy. In the histogram results using image J, there were differences between the ESD and the exposure conditions according to change of SID. However, there were not differences in histogram. Therefore, the exposure dose could reduced when set the longer SID. For pediatric exam, the exposure dose could reduced when used the aluminium filter.

Pulsed Laser Deposition을 이용하여 GZO/Glass 기판상에 성장시킨 염료감응형 태양전지용 $TiO_2$ Blocking Layer의 특성 연구

  • Yeo, In-Hyeong;Kim, Ji-Hong;No, Ji-Hyeong;Kim, Jae-Won;Do, Gang-Min;Sin, Ju-Hong;Jo, Seul-Gi;Park, Jae-Ho;Mun, Byeong-Mu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.259-259
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    • 2011
  • 염료감응형 태양전지(Dye-Sensitized Solar Cells:DSSC)는 환경 친화적이며, 저가의 공정에 대한 가능성으로 기존의 고가의 결정질 실리콘 태양전지의 경제적인 대안으로 각광을 받고 있다. 최근 염료감응형 태양전지는 투명 전도성 산화막(Transparent Conducting Oxide : TCO)으로 사용되는 Fluorine Tin Oxide (FTO)가 증착된 유리기판 위에 주로 제작된다. FTO는 낮은 비저항과 가시광선 영역에서 높은 투과도를 가지는 우수한 전기-광학적 특성을 갖지만, 비교적 공정이 까다로운 Chemical Vapor Deposition (CVD)법으로 제조하며, 전체 공정비용의 60%를 차지하는 높은 생산단가로 인해 현재 FTO를 대체할 재료개발 연구가 활발히 진행되고 있다. 그 중 ZnO (Zinc Oxide)는 우수한 전기-광학적 특성과 비교적 저렴한 가격으로 새로운 TCO로써 주목받고 있다. ZnO는 넓은 energy band gap (3.4 [eV])의 육방정계 울자이트(hexagonal wurtzite) 결정 구조를 가지는II-VI족 n형 반도체 물질이며, III족 금속원소인 Al, Ga 및 In 등의 불순물을 첨가하면 TCO로서 우수한 전기-광학적 특성과 안정성을 나타낸다. 이들 물질중 $Zn^{2+}$ (0.060 nm)의 이온반경과 유사한 $Ga^{2+}$0.062 nm) 이온이 ZnO의 격자반경을 최소화 시킬 수 있다는 장점으로 최근 주목 받고 있다. 하지만 Ga-doped ZnO (GZO)의 경우 DSC에 사용되는 루테늄 계열의 산성 염료 하에 장시간 두면 표면이 파괴되는 문제가 발생하며, $TiO_2$ paste를 Printing 후 열처리하는 과정에서도 박막의 파괴가 발생할 수 있다. 이를 방지하기 위해 $TiO_2$ Blocking Layer를 GZO 투명전극 위에 증착하였다. 또한, $TiO_2$ Blocking Layer를 적용한 GZO 박막을 전면전극으로 이용하여 DSC를 제작하여 효율을 확인하였다. 2wt%의 $Ga_2O_3$가 도핑된 ZnO 박막은 20mTorr 400$^{\circ}C$에서 Pulsed Laser Deposition (PLD)에 의해 성장되었고, $TiO_2$박막은 Ti 금속을 타겟으로 이용하여 30mTorr 400$^{\circ}C$에서 증착되었다. Scanning electron microscopy (FE-SEM)을 이용한 박막 분석 결과 $TiO_2$가 증착된 GZO 박막의 경우 표면 파괴가 일어나지 않았다. Solar Simulator을 이용하여 I-V특성 측정결과 상용 FTO를 사용한 DSC 수준의 효율을 나타내었다. 이에 따라 Pulsed Laser Deposition을 이용해 제작된 GZO 기판은 $TiO_2$ Blocking Layer를 이용하여 표면 파괴를 방지할 수 있었으며, 이는 향후 염료감응형 태양전지의 투명전극에 적용 가능 할 것으로 판단된다.

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Preparation and Electrical Properties of Electro-conducting Glasses Containing $\textrm{V}_{2}\textrm{O}_{5}$ ($\textrm{V}_{2}\textrm{O}_{5}$계 전자 전도성 유리의 제조 및 전기적 특성)

  • Kim, Il-Gu;Park, Hui-Chan;Son, Myeong-Mo;Lee, Heon-Su
    • Korean Journal of Materials Research
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    • v.7 no.1
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    • pp.81-88
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    • 1997
  • Vanadate glasses using $B_2O_3$ as a network former and with CuO additive were mainly investigated in relation to electrical properties. Crystalline phases formed by heat-treatment in each composition were examined and dc electrical conductivity changes of the glasses were analyzed. Crystalline phases were identified as $V_3O_5,\;a-CuV_2O_6\;and\;{\beta}-CuV_2O_6$ by XRD analysis. Crystallization degrees of $V_2O_5$ and ${\beta}-CuV_2O_6$ were little changed with heat-treatment time, but those of ${\alpha}u-CuV_2O_6$ were changed sharply with heat-treatment time. The more crystallization of ${\alpha}u-CuV_2O_6$ occurred, the higher electrical conductivity was observed. Electrical conductivities with $10^{-2}~10^{-4}/{\Omega}/cm$ at room temperature(303K) could be obtained by controlling the glass compositions. The electrical conductivities were increased with increasing of $V_20_5$ content and decreasing of alkality($CuO/B_2O_3$). In this study, electron was proved to be charge carrier by seebeck coefficient measurement. Accordingly, the glasses are believed to be n-type semiconductor. Calculated activation energies for the conduction were in the range 0.098-0.124 eV. Electrical conduction mechanism was small polaron hopping without showing variable range hopping in the temperature range $30~200^{\circ}C$.

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Optimization of solid phase extraction and simultaneous determination of trace anions in concentrated hydrofluoric acid by ion chromatography (불산 중 극미량 음이온 분석을 위한 고상 추출법 및 이온크로마토그래프를 이용한 동시분석법 확립)

  • Yoon, Suk-Hwan;Jo, Dong-ho;Kim, Hyun-Ji;Shin, Ho-Sang
    • Analytical Science and Technology
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    • v.29 no.5
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    • pp.219-224
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    • 2016
  • 불산 중 극미량 음이온의 고상추출과 이온크로마토그래프를 이용한 고감도 분석법이 개발되었다. 불산 중 불소이온이 고상에 의해 제거하였고 이어서 음이온 (F, CH3COO, Cl, Br, NO3, PO43−, SO42−)들이 이온크로마토그래프를 이용하여 연속적으로 분리하였다. 고상 추출법에 영향을 주는 각 인자들 (흡착제의 선택, 시료의 부피 및 pH, 용출 용액과 용출용액의 부피)을 결정하였으며 그 결과 흡착제로서 Oasis WAX 컬럼이 가장 우수하였고 1.0 mL의 시료부피, 용출용액으로 50 mM 초산암모늄염 5 mL가 분리능에서 가장 우수하였다. 개발한 방법에 의한 음이온 (Cl, Br, NO3, PO43−, SO42−)들의 방법검출한계는 25 % 불산용액 (w/w) 중에 0.04~0.30 µg/L의 범위를 보였고 정밀도는 20.0와 40.0 µg/L의 농도에서 5 % 이내를 보였다. 한 제조회사에 의한 25 % 불산 중 음이온의 4.2에서 47.5 µg/L의 범위로 모두 검출되었다. 이 방법은 시험절차가 간단하고, 재현성 및 감도가 좋아서 반도체회사에서 불산 중 음이온 불순물을 정도 관리하는데 매우 유용한 방법이 될 것으로 판단된다.

Spectroscopic Characterization of 400℃ Annealed ZnxCd1-xS Thin Films (400℃ 열처리한 삼원화합물 ZnxCd1-xS 박막의 분광학적 특성 연구)

  • Kang, Kwang-Yong;Lee, Seung-Hwan;Lee, Nam-Kwon;Lee, Jeong-Ju;Yu, Yun-Sik
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.1
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    • pp.101-112
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    • 2015
  • II~VI compound semiconductors, $Zn_xCd_{1-x}S$ thin films have been synthesized onto indium-tin-oxide(ITO) coated glass substrates using thermal evaporation technique. The composition ratio x($0{\leq}x{\leq}1$) was varied to fabricate different kinds of $Zn_xCd_{1-x}S$ thin films including CdS(x=0) and ZnS(x=1) thin films. Then, the deposited thin films were thermally annealed at $400^{\circ}C$ to enhance their crystallinity. The chemical composition and electronic structure of films were investigated by using X-ray photoelectron spectroscopy(XPS). The optical energy gaps of the samples were determined by ultra violet-visible-near infrared(UV-Vis-NIR) spectroscopy and were found to vary in the range of 2.44 to 3.98 eV when x changes from 0 to 1. Finally, we measured the THz characteristics of the $Zn_xCd_{1-x}S$ thin films using THz-TDS(time domain spectroscopy) system to identify the capability for electronic and optical devices in THz region.

Microstructure analyses of aluminum nitride (AlN) using transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) (투과전자현미경과 전자후방산란회절을 이용한 AlN의 미세구조 분석)

  • Joo, Young Jun;Park, Cheong Ho;Jeong, Joo Jin;Kang, Seung Min;Ryu, Gil Yeol;Kang, Sung;Kim, Cheol Jin
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.4
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    • pp.127-134
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    • 2015
  • Aluminum nitride (AlN) single crystals have attracted much attention for a next-generation semiconductor application because of wide bandgap (6.2 eV), high thermal conductivity ($285W/m{\cdot}K$), high electrical resistivity (${\geq}10^{14}{\Omega}{\cdot}cm$), and high mechanical strength. The bulk AlN single crystals or thin film templates have been mainly grown by PVT (sublimation) method, flux method, solution growth method, and hydride vapor phase epitaxy (HVPE) method. Since AlN suffers difficulty in commercialization due to the defects that occur during single crystal growth, crystalline quality improvement via defects analyses is necessary. Etch pit density (EPD) analysis showed that the growth misorientations and the defects in the AlN surface exist. Transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) analyses were employed to investigate the overall crystalline quality and various kinds of defects. TEM studies show that the morphology of the AlN is clearly influenced by stacking fault, dislocation, second phase, etc. In addition EBSD analysis also showed that the zinc blende polymorph of AlN exists as a growth defects resulting in dislocation initiator.