• Title/Summary/Keyword: 박막저항

Search Result 1,446, Processing Time 0.027 seconds

Variation of Soil Properties by Permeating Injection of Chemical Grouts (약액(藥液)의 침투주입(浸透注入)에 의한 토질성상변화(土質性狀變化))

  • Chun, Byung Sik
    • KSCE Journal of Civil and Environmental Engineering Research
    • /
    • v.2 no.4
    • /
    • pp.1-9
    • /
    • 1982
  • Variation of soil properties is studied by permeating injection of chemical grouts, such as cement type, water-glass type and acrylamide type, to the same soil samples with different densities. Moreover, injection tests using specially prepared equipments of 1.0 shot system and 1. 5 shot system are attempted to investigate permeating injection effects in highly compacted soil and in the presence of ground water. The main factor which causes the improvement of cut-off effect and shearing strength is the cohesion of soil. The strength in the loose state is fundamentally governed by the membrane cohesion, meanwhile, in the loose state is governed by the structural cohesion. Injection effects under the ground water flow is considerably decreased, and effective gelling ratio of approximate 45~80% is observed by variation of velocity and gel time, besides grading of injection materials has high relation with permeation and traveling length but has little relation with effective gelling ratio. Permeating injection effects, such as gelling scope, gelling strength in highly compaoted soil conditions can be confirmed by penetration resistance diagram and iso-strength curve.

  • PDF

백색 LED증착용 MOCVD 유도가열 장치에서 가스 inlet위치에 따른 기판의 온도 균일도 측정

  • Hong, Gwang-Gi;Yang, Won-Gyun;Ju, Jeong-Hun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.08a
    • /
    • pp.115-115
    • /
    • 2010
  • 고휘도 고효율 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색 LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 에피웨이퍼공정은 에피층과 기판의 격자상수 차이와 열팽창계수차이로 인하여 생성되는 에피결함의 문제로 기판과 GaN 박막층 사이에 완충작용을 해줄 수 있는 버퍼층 (Buffer layer)을 만든다. 그 위에 InGaN/GaN MQW (Multi Quantum Well)공정을 하여 고휘도 고효율 백색 LED를 구현 할 수 있다. 이 공정에서 기판의 온도가 불균일해지면 wafer 파장 균일도가 나빠지므로 백색 LED의 yield가 떨어진다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 등이 장비의 설계 요소이다. 본 연구에서는 유도가열방식의 유도가열히터를 이용하여 기판과 히터의 간격에 차이에 따른 기판 균일도 측정했고, 회전에 의한 기판의 온도분포와 자기장분포의 실험적 결과를 상용화 유체역학 코드인 CFD-ACE+의 모델링 결과와 비교 했다. 또한 가스의 inlet위치에 따른 기판의 온도 균일도를 측정하였다. 본 연구에서 사용된 가열원은 유도가열히터 (Viewtong, VT-180C2)를 사용했고, 가열된 흑연판 표면의 온도를 2차원적으로 평가하기 위하여 적외선 열화상 카메라 (Fluke, Ti-10)를 이용하여 온도를 측정했다. 와전류에 의한 흑연판의 가열 현상을 누출 전계의 분포로 확인하기 위하여 Tektronix사의 A6302 probe와 TM502A amplifier를 사용했다. 흑연판 위에 1 cm2 간격으로 211곳에서 유도 전류를 측정했다. 유도전류는 벡터양이므로 $E{\theta}$를 측정했으며, 이때의 측정 방향은 흑연판의 원주방향이다. 또한 자기장에 의한 유도전류의 분포를 확인하기 위하여 KANETEC사의 TM-501을 이용하여 흑연판 중심으로부터 10 mm 간격으로 자기장을 측정 했다. 저항 가열 히터를 통하여 대류에 의한 온도 균일도를 평가한 결과 gap이 3 mm일때, 평균 온도 $166.5^{\circ}C$에서 불균일도 6.5%를 얻었으며, 회전에 의한 온도 균일도 측정 결과는 2.5 RPM일 때 평균온도 $163^{\circ}C$에서 5.5%의 불균일도를 확인했다. 또한 CFD-ACE+를 이용한 모델링 결과 자기장의 분포는 중심이 높은 분포를 나타냄을 확인했고, 기판의 온도분포는 중심으로부터 55 mm되는 곳에서 300 W/m3로 가장 높은 분포를 나타냈다. 가스 inlet 위치를 흑연판 중심으로 수직, 수평 방향으로 흘려주었을 때의 불균일도는 각각 10.5%, 8.0%로 수평 방향으로 가스를 흘려주었을 때 2.5% 온도 균일도 향상을 확인했다.

  • PDF

Effect of air-contaminated TiN on the deposition characteristics of Cu film by MOCVD (공기 중에 노출된 MOCVD TiN 기판이 MOCVD Cu 증착에 미치는 효과)

  • Choe, Jeong-Hwan;Byeon, In-Jae;Yang, Hui-Jeong;Lee, Won-Hui;Lee, Jae-Gap
    • Korean Journal of Materials Research
    • /
    • v.10 no.7
    • /
    • pp.482-488
    • /
    • 2000
  • The deposition characteristics of Cu film by MOCVD using (hfac)Cu(1,5-COD)(1,1,1,5,5,5-hexafluro-2,4-pentadionato Cu(I) 1,5-cryclooctadiene) as a precursor have been investigated in terms of substrate conditions. Two different substrates such as air-exposed TiN and non-contaminated TiN were used for the MOCVD of Cu. MOCVD of Cu on the air-exposed TiN affected the nucleation rate of Cu as well as its growth, resulting in the Cu films having poor interconnection between particles with relatively small grains. On the other hand, in-situ MOCVD of Cu led to the Cu films having a significantly improved interconnection between particles with larger grains, indicating the resistivity as low as $2.0{\mu}{\Omega}-cm$ for the films having more than 1900$\AA$ thickness. Moreover, better adhesion of Cu films to the TiN by using in-situ MOCVD has been obtained. Finally, initial coalescence mechanism of Cu was suggested in this paper in terms of different substrate conditions by observing the surface morphology of the Cu films deposited by MOCVD.

  • PDF

Chromel-Alumel Thermoelectric Flow Sensor Fabricated on Dielectric(Si3N4/SiO2/Si3N4) Membrane (유전체(Si3N4/SiO2/Si3N4)멤브레인 위에 제작된 크로멜-알루멜 열전 유량센서)

  • Lee, Hyung-Ju;Kim, Jin-Sup;Kim, Yeo-Hwan;Lee, Jung-Hee;Choi, Yong-Moon;Park, Se-Il
    • Journal of Sensor Science and Technology
    • /
    • v.12 no.3
    • /
    • pp.103-111
    • /
    • 2003
  • A chromel-alumel thermoelectric flow sensor using $Si_3N_4/SiO_2/Si_3N_4$ thermal isolation membrane was fabricated. Temperature coefficient of resistance of thin film Pt-heater was about $0.00397/^{\circ}C$, and Seebeck coefficient of chromel-alumel thermocouple was about $36\;{\mu}V/K$. The sensor showed that thermoelectric voltage decreased as thermal conductivity of gas increased, and $N_2$-flow sensitivity increased as heater voltage increased or the distance between heater and thermocouple decreased. When heater voltage was about 2.5 V, $N_2$-flow sensitivity and thermal response time of the sensor were about $1.5\;mV/sccm^{1/2}$ and 0.18 sec., respectively. Linear range in flow sensitivity of the flow sensor was wider than that of Bi-Sb flow sensor.

Effects of Metalized Al-2%Zn Layer on the Corrosion Behavior of Al 5083 Alloy (Al 5083 합금의 부식거동에 미치는 Al-2%Zn 용사 코팅층의 영향)

  • 김용철;김영근;이성민;고영태
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 1999.05a
    • /
    • pp.2-2
    • /
    • 1999
  • 금속재료의 표면 특성을 높이기 위해서 여러 표면처리 방법들이 사용되어져 오고 있다. 그 중 용사법에 의한 코팅방법이 최근의 현저한 기술적인 진보와 새로운 용사재료의 개발 등에 의해 여러 분야에 널리 응흉되고 있다. 일반적으로 이 용사법에 의한 코팅층은 다리, 선박 등의 대형 구조물에 대한 내식성 향상뿐만 아니라 자동차 및 항공기 부품, 핵 반응기 등의 코팅부에 널리 이용되고 였다. 특히 해수분위기에서 주로 사용되는 설비의 내식성을 향상시킬 목적으로 사용되 는 알루마늄 및 아연 합금의 용사 코팅층은 대부분의 경우 건조한 분위기보다는 수분이 많은 수용액 환경 하에서 사용되므로, 사용 환경 중에서 용사피막의 내식성을 조사하는 연구가 요구되고 있다. 사용되는 환경하에서의 침지시험에 의한 방법도 중요하지만, 가속화된 전기화학측정에 의한 방법 또한 이용된다. 열용사법에 의한 코팅층의 전기화학적 특성을 알아보기 위해서 3.5 % NaCI 수용액 내에서 AI 5 5083 모재와 Al-2%Zn 합금의 용사 코팅층 각각에 대한, 그리고 AI 5083 모재 위 AI-2%Zn 용사층이 코팅된 경우에 대한 분극거동과 침지시간에 따른 부식전위 및 분극저항성의 특성변화, 표면의 임피던스특성 변화 등을 측정하였다. 이 결과 모재에 대한 코팅층의 희생양극성올 판단할 수 있고, 모재/코팅 사스템의 분극거동은 혼성전위이론(mixed-potential theory)에 의해 결정되었다. 용사 코팅층이 박리되어 모재가 일부 드러난 경우를 모사한 시험편올 제작하고, 시험편 표면의 각 위치에 따라 부식전위 분포를 측정하였다. 그리고 측정 데이터를 기초로 표면의 상태변화를 모사하여 용사코팅에 의한 표면에서의 방식전위분포를 시율레이션하였다. 이와 같은 표면에서의 방식전위분포 해석을 통하여, 코팅층의 희생양극성에 의한 모재의 방식범위를 판단할 수 있다.의 비저 항을 갖는 철 박막에서도 99.9% 순도의 철을 타켓으로 하여 증착된 막은 일반 저탄소 강을 타켓으로 하여 증착된 막보다 훨씬 낮은 부식속도를 보였다.TEX>$He/O_2/Ar/N_2$의 gas를 사용 한 atmospheric pressure plasma cleaning 과 $Ar/O_2$의 gas를 사용한 ICP cleaning에서 이 차전자방출계수(SEEC)가 약 1.5~2.5배 증가된 것을 알 수 있었다. 저지능 등을 평가하여 각 실험결과를 비교분석하여 보았다. 수록 민감하여 304 의 IGSCC 와 매우 유사한 거동을 보인다. 본 강연에서는 304 와 600 의 고온 물에서 일어나는 IGSCC 민감도에 미치는 환경, 예민화처리, 합금원소의 영향을 고찰하고 이에 대한 최근의 연구 동향과 방식 방법을 다룬다.다.의 목적과 지식)보다 미학적 경험에 주는 영향이 큰 것으로 나타났으며, 모든 사람들에게 비슷한 미학적 경험을 발생시키는 것 이 밝혀졌다. 다시 말하면 모든 사람들은 그들의 문화적인 국적과 사회적 인 직업의 차이, 목적의 차이, 또한 환경의 의미의 차이에 상관없이 아름다 운 경관(High-beauty landscape)을 주거지나 나들이 장소로서 선호했으며, 아름답다고 평가했다. 반면에, 사람들이 갖고 있는 문화의 차이, 직업의 차 이, 목적의 차이, 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로 $\ulcorner$순응$\lrcorner$의 범위를 벗어나지 않는다. 그렇기 때문에도 $\ulcorner$순응$\lrcorne

  • PDF

Microstructure analyses of aluminum nitride (AlN) using transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) (투과전자현미경과 전자후방산란회절을 이용한 AlN의 미세구조 분석)

  • Joo, Young Jun;Park, Cheong Ho;Jeong, Joo Jin;Kang, Seung Min;Ryu, Gil Yeol;Kang, Sung;Kim, Cheol Jin
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.25 no.4
    • /
    • pp.127-134
    • /
    • 2015
  • Aluminum nitride (AlN) single crystals have attracted much attention for a next-generation semiconductor application because of wide bandgap (6.2 eV), high thermal conductivity ($285W/m{\cdot}K$), high electrical resistivity (${\geq}10^{14}{\Omega}{\cdot}cm$), and high mechanical strength. The bulk AlN single crystals or thin film templates have been mainly grown by PVT (sublimation) method, flux method, solution growth method, and hydride vapor phase epitaxy (HVPE) method. Since AlN suffers difficulty in commercialization due to the defects that occur during single crystal growth, crystalline quality improvement via defects analyses is necessary. Etch pit density (EPD) analysis showed that the growth misorientations and the defects in the AlN surface exist. Transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) analyses were employed to investigate the overall crystalline quality and various kinds of defects. TEM studies show that the morphology of the AlN is clearly influenced by stacking fault, dislocation, second phase, etc. In addition EBSD analysis also showed that the zinc blende polymorph of AlN exists as a growth defects resulting in dislocation initiator.

Fabrication of the Wafer Level Packaged LED Integrated Temperature Sensor and Configuration of The Compensation System for The LED's Optical Properties (온도센서가 집적된 WLP LED의 제작과 이를 통한 광 특성 보상 시스템의 구현)

  • Kang, In-Ku;Kim, Jin-Kwan;Lee, Hee-Chul
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.49 no.7
    • /
    • pp.1-9
    • /
    • 2012
  • In this paper, resistance temperature detector (RTD) integrated into the LED package is proposed in order to solve the temperature dependence of LED's optical properties. To measure the package temperature in real time, the RTD type temperature sensor having excellent accuracy and linearity between temperature change and resistance change was adopted. A stable metallic film is required for long term reliability and stability of the RTD type temperature sensor. Therefore, deposition and annealing condition for the film were determined. Based on the determined condition, the RTD type temperature sensor with the sensitivity of about $1.560{\Omega}/^{\circ}C$ was fabricated inside the LED package. In order to configurate the LED package system keeping the constant brightness regardless of the temperature, additional conversion circuit and control circuit boards were fabricated and added to the fabricated LED package. The proposed system was designed to compensate the light intensity caused by temperature change using the variable duty rate of driving current. As a result, the duty rate of PWM signal which is the output signal of the configurated system was changed with the temperature change, and the duty rate was similarly varied with the target duty rate. Consequently, it was focused the fabricated RTD can be used for compensating the optical properties of LED and the LED package which exhibits constant brightness regardless of the temperature change.

A STUDY ON THE RESISTANCE OF WEAR AND CYTOTOXICITY OF THE TITANIUM SURFACE AFTER FILM DEPOSITIONS (박막증착시 티타늄 표면의 마손저항도와 세포독성에 관한 연구)

  • Kim Hyung-Woo;Kim Chang-Whe;Kim Yung-Soo
    • The Journal of Korean Academy of Prosthodontics
    • /
    • v.39 no.1
    • /
    • pp.84-95
    • /
    • 2001
  • Titanium is widely used in dentistry for its low density, high strength, fatigue resistance, corrosion resistance, and biocompatibility. But it has a tendency of surface damage under circumstance of friction and impact for its low hardness of the surface. Coating is one of methods fir increasing surface hardness. Its effect is to improve surface physical characteristics without change of titanium. Diamond-like carbon and titanium nitride are known for its high hardness of the surface. So that this study was aimed at the wear test and the cytotoxicity test of the commercially pure titanium and Ti-6Al-4V alloy which were deposited by diamond-like carbon film or titanium nitride film to acertain improvement of the surface hardness and the biocompatibility. A disk (25mm diameter, 2mm thickness) was made of commercially pure titanium and Ti-6Al-4V alloy and these substrates were deposited by diamond-like carbon film or titanium nitride film. Diamond-like carbon film was deposited by the method of radiofrequency plasma assisted chemical vapor deposition and titanium nitride film was deposited by the method of reactive arc ion plating. Then these substrates were tested about wear characteristics by the pin-on-disk type wear tester in which ruby ball was used as a wear causer under the load of 32N, The fracture cycles were measured by rotating the substrates until their films were fractured. The wear volume was measured after 150 cycles and 3,000 cycles using surface profiler. The cytotoxicity test was peformed by the method of the MTT assay. The results were as follows : 1. In the results of the wear volume test, commercially pure titanium and titanium alloy which were coated by diamond-like carbon film or titanium nitride aim had higher resistance against wear than the substrates which were not coated by any films (P<0.05). 2. In the results of the fracture cycle test and the wear volume test, diamond-like carbon film had higher resistance against wear than titanium nitride film (P<0.05). 3. In both coatings of diamond-like carbon aim and titanium nitride film, Ti-6Al-4V alloy had higher resistance against wear than commercially pure titanium (P<0.05) 4. In the results of the cytotoxicity test, diamond-like carbon film and titanium nitride film had little cytotoxicity as like commercially pure titanium or Ti-6Al-4V alloy (P>0.05).

  • PDF

The Fabrication of Poly-Si Solar Cells for Low Cost Power Utillity (저가 지상전력을 위한 다결정 실리콘 태양전지 제작)

  • Kim, S.S.;Lim, D.G.;Shim, K.S.;Lee, J.H.;Kim, H.W.;Yi, J.
    • Solar Energy
    • /
    • v.17 no.4
    • /
    • pp.3-11
    • /
    • 1997
  • Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

  • PDF

Distribution of Magnetic Field Depending on the Current in the μ-turn Coil to Capture Red Blood Cells (적혈구 포획용 미크론 크기 코일에 흐르는 전류의 크기에 따른 자기장 분포 특성)

  • Lee, Won-Hyung;Chung, Hyun-Jun;Kim, Nu-Ri;Park, Ji-Soo;Lee, Sang-Suk;Rhee, Jang-Roh
    • Journal of the Korean Magnetics Society
    • /
    • v.25 no.5
    • /
    • pp.162-168
    • /
    • 2015
  • The ${\mu}$-turn coil having a width of ${\mu}m$ on the GMR-SV (giant magnetoresistance-spin valve) device based on the antiferromagnetic IrMn layer was fabricated by using the optical lithography process. In the case of GMR-SV film and GMR-SV device, the magnetoresistance ratios and the magnetic sensitivities are 4.4%, 2.0%/Oe and 1.6 %, 0.1%/Oe, respectively. In the y-z plane the distribution of magnetic field of GMR-SV device and $10{\mu}$-turns coil which put under the several magnetic bead(MB)s with a diameter of $1{\mu}m$ attached to RBC (red blood cell) was analyzed by the computer simulation using the finite element method. When the AC currents of 20 kHz from 0.1 mA to 10.0 mA flow to the 10 turns ${\mu}$-coil, the magnetic field at the position of $z=0{\mu}m$ at the center of coil was calculated from $30.1{\mu}T$ to $3060{\mu}T$ in proportion to the current. The magnetic field at the position of $z=10{\mu}m$ was decreased to one-sixth of that of $z=0{\mu}m$. It was confirmed that the $10{\mu}$-turn coil having enough magnitude of magnetic field for the capture of RBC is possible to use as a biosensor for the detection of magnetic beads attached to RBC.