• Title/Summary/Keyword: 미세 캐비티

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Analysis on the Characteristics of Micro Cutting Process for DMLS Mold Material (DMLS 금형강의 미세 절삭가공 특성 분석)

  • Yoon, Gil-Sang;Kim, Gun-Hee;Lee, Jeong-Won;Kim, Jong-Deok
    • Proceedings of the KAIS Fall Conference
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    • 2011.12b
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    • pp.518-520
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    • 2011
  • 금속분말 쾌속조형법의 한 종류인 DMLS 공정은 사출성형품의 균일한 냉각이 가능한 3차원 냉각시스템을 포함한 코어, 캐비티 제작이 가능하다. 그러나, 코어 및 캐비티 내 미세형상의 경우 DMLS로 제작하기에는 난해하므로 별도 미세 절삭가공을 통해 제작할 필요가 있다. 따라서, 본 연구에서는 DMLS금형강 소재의 미세 절삭가공 특성을 분석하고자 하였으며, 이를 위하여 HIP 공정 적용 전 후 DMLS금형강 소재를 대상으로 미세 절삭가공 실험을 수행하고 버 발생 및 공구마모 경향을 분석하였다. 실험 결과 HIP 적용 전 시편이 강도 및 조직측면에서 미세 절삭가공에 상대적으로 유리함을 확인할 수 있었다.

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Distortion of the Bottom Surface in Micro Cavity Machining Using MEDM (미세 캐비티 방전 가공에서 바닥면 형상 왜곡)

  • 임종훈;류시형;제성욱;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.191-197
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    • 2003
  • As mechanical components are miniaturized, the demand on micro die and mold is increasing. Micro mechanical components usually have high hardness and good conductivity. So micro electrical discharge machining (MEDM) is an effective way to machine those components. In micro cavity fabrication using MEDM, it is observed that the bottom surface of cavity is distorted. Electric charges tend to be concentrated at the sharp edge. At the center of the bottom surface, debris can not be drawn off easily. These two phenomena make the bottom surface of the electrode and workpiece distort. As machining depth increases, the distorted shape of electrode approaches hemisphere. This process is affected by capacitance and the size of electrode. By using a smaller electrode than the desired cavity size and appropriate tool movement, bottom shape distortion can be prevented.

Sound absorption of micro-perforated thin plates in a duct (덕트내 미세천공 박판의 흡음)

  • Kim, Hyun-Sil;Kim, Bong-Ki;Kim, Sang-Ryul;Seo, Yun-Ho;Ma, Pyung-Sik
    • The Journal of the Acoustical Society of Korea
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    • v.36 no.5
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    • pp.305-313
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    • 2017
  • In this paper, sound absorption of thin elastic plates installed in a rigid duct is discussed using an analytic method. The number of plates can be one or two, and each plate might have micro-perforation. Vibration of the plates and sound pressure fields inside the duct and air cavity are expressed in terms of an infinite series of modal functions. Under the plane wave assumption, a low frequency approximation is derived by including the first few plate modes. It is found that the sound absorption coefficient of the plates without micro-perforation shows sharp peaks at resonance frequencies, and due to the interaction between the plates and air cavity, the resonance frequencies move as the cavity depth changes. For the case of micro-perforated plates, it is found that the sound absorption is mainly affected by the perforation ratio. When the perforation ratio is order of few percent, the sound absorption is almost independent of plate vibration.

Formation of Thermal Bubble from Particle-Filled Microcavity (미세 입자로 충전된 캐비티에서의 열 기포 형성)

  • Jeong, Kwang-Hun;Lee, Heon-Ju;Chang, Young-Soo;Lee, Yoon-Pyo;Kim, Ho-Young
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.31 no.3 s.258
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    • pp.248-255
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    • 2007
  • Thermal bubble formation is a fundamental process in nucleate boiling heat transfer and many microelectromechanical thermal systems. One of the established facts is that heterogeneous nucleation is originated from vapors trapped inside cavities. Based on this, we performed an experimental study on the formation of thermal bubbles from microcavity fabricated by microfabrication technology on a copper plate. The cavity was filled with aluminum particles to enhance thermal bubble formation. We observed the thermal bubble behaviors, such as bubble incipience, diameter, frequency and coalescence during nucleate boiling. The experimental data showed that the superheat required to trigger the bubble formation was significantly reduced when the cavity was filled with microparticles. We found that the initial increase of superheat led to the increase of both the departure diameter and frequency while the further increase of superheat caused multiple bubbles to coalesce resulting in the decrease of departure frequency.

Electrochemical Machining Using Tungsten Microelectrode (텅스텐 미세 전극을 이용한 전해 가공)

  • Ryu, Shi-Hyoung;Yu, Jong-Sun
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.4
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    • pp.134-140
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    • 2009
  • The feasibility of electrochemical drilling and milling on stainless steel are investigated using tungsten microelectrode with $10{\mu}m$ in diameter. For the development of environmentally friendly and safe electrochemical process, citric acid solution is used as electrolyte. A few hundred nanoseconds duration pulses are applied between the microelectrode and work material for dissolution localization. Tool fracture by Joule heating, micro welding, capillary phenomenon, tool wandering by the generated bubbles are observed and their effects on micro ECM are discussed. Occasionally, complex textures including micro pitting corrosion marks appeared on the hole inner surface. Metal growth is also observed under the weak electric conditions and it hinders further dissolutions for workpiece penetration. By adjusting appropriate pulse and chemical conditions, micro holes of $37{\mu}m$ in diameter with $100{\mu}m$ in depth and 26Jim in diameter with $50{\mu}m$ in depth are drilled on stainless steel 304. Also, micro grooves with $18{\mu}m$ width and complex micro hand pattern are machined by electrochemical milling.

3-dimensional Nano Structures for Semiconductor Light Source (반도체 광원 적용을 위한 3차원 나노 구조 개발)

  • Kim, Je Won
    • Journal of Convergence for Information Technology
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    • v.10 no.2
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    • pp.96-101
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    • 2020
  • In micro-sized light emitting diodes, which are increasingly attentions as the light sources of displays and semiconductor lighting, increasing the amount of light and improving the luminous efficiency are very important and various development directions and methods have been proposed. In this study, the design of 3-dimensional nano structures through nano frame formation and the application of a nano pattern and a reactive etching method were proposed. And it will also be discussed that nano pillar arrays with nano cavities having improved verticality can be applied to semiconductor light sources through the development of nano frame structures.

PIV Measurement on Collapse Behavior of Cavitation (캐비테이션 붕괴거동에 관한 PIV 유동계측)

  • Gim, Ok-Sok;Han, Min-Su;Kim, Seong-Jong;Lee, Gyoung-Woo
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2013.06a
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    • pp.130-131
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    • 2013
  • 캐비테이션 현상은 고 유속 환경에서 발생(inception), 성장(growth), 붕괴(collapse) 및 소멸(disappearance) 과정이 반복적으로 일어나며 그 과정에서 기포붕괴에 따른 큰 충격압력을 방지하려는 분야와 이를 능동적으로 산업분야에 적용하려는 분야로 크게 대별된다. 본 연구에서는 캐비테이션의 붕괴거동을 수중 초음파 진동자에서 미세기포를 발생시켜 PIV기법을 이용하여 유동장을 계측하였다. 초음파 진동자는 직경 16 mm이며, 진동주파수는 20 kHz, 진폭은 $5{\mu}m$, $10{\mu}m$, $30{\mu}m$$50{\mu}m$를 각각 적용하였다. 유동구조, 난류강도, 레이놀즈 응력에 대한 통계적 유동정보를 계측한 결과 충격압력의 원인으로 알려진 캐비티 붕괴로 인해 유동특성을 확인하였다.

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Micro Electrochemical Machining of Stainless Steel Using Citric Acid (구연산을 이용한 스테인레스 스틸의 미세 전해가공)

  • Ryu, Shi-Hyoung
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.3
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    • pp.134-140
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    • 2008
  • Micro electrochemical machining (ECM) is conducted on stainless steel 304 using non-toxic electrolyte of citric acid. Electrochemical dissolution region is minimized by applying a few hundred second duration pulses between the tungsten SPM tip and the work material. ECM characteristics according to citric acid concentration, feeding velocity and electric conditions such as pulse amplitude, pulse frequency, and offset voltage are investigated through a series of experiments. Micro holes of $60{\mu}m$ in diameter with the depth of $50{\mu}m$ and $90{\mu}m$ in diameter with the depth of $100{\mu}m$ are perforated. Square and circular micro cavities are also manufactured by electrochemical milling. This research can contribute to the development of safe and environmentally friendly micro ECM process.

A numerical study on micro leakage behaviors at cavity edge during photo reaction injection molding (광반응사출성형 시 캐비티 엣지에서 발생하는 미세누출현상에 관한 해석적 연구)

  • La, Moon-woo
    • Design & Manufacturing
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    • v.10 no.3
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    • pp.8-13
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    • 2016
  • Despite technological advance, there have been several troubles in photo reaction injection molding (photo RIM) to produce ultra thin light guide panels (LGPs). In this study, micro leakage problem at cavity edge during photo RIM was investigated numerically. In order to obtain optimal processing conditions, we regulated inlet pressure of injected resin at the cavity edge and figured out micro leakage behaviors. At low inlet pressure (less than 100 Pa), though the micro leakage problem was not occurred, another problem, short shot due to not enough driving force, was appeared More than 1,000 Pa of the inlet pressure, injected resin was rapidly leaked through the micro gap at the cavity edge. Finally, we obtained optimal inlet pressure around 600 ~ 1,000 Pa. At this region, injected resin fully filled the cavity without micro leakage behavior. Based on the present study, further comparative investigations with experimental photo RIM should be performed to find optimal processing conditions for produce ultra thin LGPs.

A Study on the Noise Performance of Silencer Fused with Hole-Cavity Resonance Technology and Micro-Sphere Stainless Chip Sintering Technology (Hole-Cavity 공명기술과 미세공 스테인레스칩 소결 융합 소음기의 소음성능에 관한 연구)

  • Cho, Dong-Hyun;BacK, Nam-Do
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.1
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    • pp.101-108
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    • 2019
  • In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.