• Laser Solutions
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• v.18 no.2
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• pp.11-13
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• 2015

Pressure-drop in a micro-channel is critical when a hole diameter is less then 100um with the high aspect ratio, more than 40. To minimize these pressure loss for micro-channel applications is important and there would be the best hole diameter, taper angle, and their combinations. In this work, the parametric study for laser drilling of anodized material is conducted to obtain the micro-channel hole with high aspect ratio.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.3
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• pp.32-38
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• 2005

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.48-52
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• 2004

Ultrasonic machining is effective for machining of extreme hard and brittle materials, including glass, ceramic, carbide, graphite. The major machining principle involves the direct hammering as well as the impact of abrasive panicles on the workpiece. Also, it involve cavitation erosion. The general workpiece is flat side. This study attempted micro hole machining of a curved surface of glass tube. Ultrasonic machining is fault of the slow machining speed. An experiment does and got 16 seconds validity machining time as increasing the processing speed. Moreover, entrance crack and surface roughness was similar both machining speed is slow and fast. Several micro hole of glass tube machined using one micro tool, but tool wear is infinitesimal.

• 기계와재료
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• v.22 no.1
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• pp.22-29
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• 2010

최근 휴대폰 등 모방일 전자기기 산업에서 차세대 고부가 PCB(MLB, HDI, FPC, 등) 및 고기능 PCB(COF, MOF, SOF)의 급속한 적용 확대로 직경$20{\mu}m$급의 비아홀(viahole) 및 interconnection 홀 가공을 위한 초정밀/초고속 레이저 드릴링 공정 및 장비기술 개발에 대한 시장의 요구가 급증하고 있다. 이에 반해 기존의 CO2 레이저 드릴링은 기술적 한계에 도달하여 시장의 요구에 대응이 불가하며, 선진업체에서는 최근 UV 레이저 드릴링 장비에 대한 시장 점유율을 높여가고 있다. 특히 국내시장은 미국의 ESI사가 독점하고 있어 기술개발 투자를 통한 국산화가 절실한 상황이다. 이에 당사에서는 초고속/초정밀 UV laser 시스템을 이용한 FPC iva hole drilling을 연구과제로 개발을 진행하고 있으며 국산화를 넘어서 세계시장점유를 목표로 공정장비개발을 진행중이다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.436-441
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• 2005

In this study, precision injection molding analysis for BGA connector fabrication was performed. A BGA connector model with rectangular micro-holes were introduced to investigate the effect of mirco patterns on the injection molding process. Dual domain(2.5D) mesh and full 3D mesh for BGA connector model were prepared to perform precision injection molding analysis. To verify the Present analysis, experiments of injection molding were performed based on the results of the analysis. It was shown that the type of mesh has a significant effect on the flow pattern of BGA connector

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.1
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• pp.101-108
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• 2019

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

• Laser Solutions
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• v.17 no.2
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• pp.5-10
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• 2014

Aluminum has been widely used in the electric applications because of light metals. When mechanical element is periodically moving with contacting other surfaces, the anodizing process for aluminum is useful for avoiding the abrasive damage. The anodized element has quietly different characteristics with respect to the distribution of hardness and crystal structure. In this work, the laser drilling of anodized surface is studied experimentally. Fusion drilling method - laser drilling with inert gas blowing - is used. The effect of various process parameters (gas pressure, laser power, focus position) is investigated with respect to the hole size and circularity.

• Transactions of Materials Processing
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• v.21 no.5
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• pp.312-318
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• 2012

With an increasing trend toward miniaturization, electrical discharge machining(EDM) has been receiving a lot of attention as a suitable production technology for micro-parts, since it enables the machining of hard conductive materials with a high degree of repeatability and without alteration to the material. When a micro-hole is fabricated by EDM, however, the diameter of the inlet hole is larger than that of the outlet region due to the additional discharge effect caused by the eroded particles. In this paper, a shot blasting surface treatment, in which an abrasive material is accelerated through a pressurized nozzle and directed at the surface of a part, is suggested as an effective method to reduce the tapered shape of EDM micro-hole. In addition, the influence of process parameters such as spark-on time and electrode diameter on the machining performance was investigated. It is shown quantitatively that the difference in diameter between the inlet and outlet holes decreases with the shot blasting treatment and with decreasing spark-on time.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.