• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1754-1759
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• 2008

To produce plastic parts that have fine pattern through conventional injection molding, a lot of difficulties follow. Therefore, rapid heating and cooling methods are good candidates for manufacturing injection-molded parts with micro/nano patterns. In this study, we adopted the E-Mold patent technology. The mold for E-Mold technology has a separate heated core with micro heaters. It is very important to optimize the lay-out of the heaters in heated core because it influences both control and distribution of mold temperature. We developed a optimization method of heating line lay-out by using commercial softwares and compared the output with the experimental results. We used Pro-Engineer Wildfire 2.0 for the mold design, ICEMCFD for mesh generation, and FLUENT for heat transfer simulation. The simulation results showed the temperature profile from $60^{\circ}C$ to $120^{\circ}C$ or $180^{\circ}C$ during heating and cooling process which were compared with the injection molding experiments. We concluded that the simulation could well explain the experimental results. It was shown that the E-Mold optimization design for heater lay-out could be available through the simulation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1056-1063
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• 2006

Thermal evaporated 10 nm-Ni/l nm-Ir/(or polycrystalline)p-Si(100) and 10 nm-$Ni_{50}Co_{50}$/(or polycrystalline)p-Si(100) films were thermally annealed using rapid thermal annealing fur 40 sec at $300{\sim}1200^{\circ}C$. The annealed bilayer structure developed into Ni(Ir or Co)Si and resulting changes in sheet resistance, microstructure, phase and composition were investigated using a four-point probe, a scanning electron microscopy, a field ion beam, an X-ray diffractometer and an Auger electron spectroscope. The final thickness of Ir- and Co-inserted nickel silicides on single crystal silicon was approximately 20$\sim$40 nm and maintained its sheet resistance below 20 $\Omega$/sq. after the silicidation annealing at $1000^{\circ}C$. The ones on polysilicon had thickness of 20$\sim$55 nm and remained low resistance up to $850^{\circ}C$. A possible reason fur the improved thermal stability of the silicides formed on single crystal silicon substrate is the role of Ir and Co in preventing $NiSi_2$ transformation. Ir and Co also improved thermal stability of silicides formed on polysilicon substrate, but this enhancement was lessened due to the formation of high resistant phases and also a result of silicon mixing during high temperature diffusion. Ir-inserted nickel silicides showed surface roughness below 3 nm, which is appropriate for nano process. In conclusion, the proposed Ir- and Co- inserted nickel silicides may be superior over the conventional nickel monosilicides due to improved thermal stability.

• Journal of Life Science
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• v.33 no.8
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• pp.680-691
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• 2023

Peak oil, climate change, and microplastics caused by the production and usage of petroleum-based plastics have threatened the sustainability of our daily life, and this has emerged as a recent global issue. To solve this global issue, the production and usage of biodegradable eco-friendly bioplastics such as polyhydroxyalkanoates (PHAs) has been suggested as an alternative. Therefore, in this review, the present status of global PHA manufacturers, the advantages of the production of PHAs using marine-origin microorganisms (with their productivity potential) and further required research and development strategies for cost-competitive production of PHAs using marine-based microorganisms were investigated. In this review, PHAs produced from marine microorganisms were found to have similar physical properties to petroleum-based plastics but with several advantages that can reduce the costs of PHA production. Those advantages include, seawater used in the medium preparation step, and osmotic-based cell lysis technology used in the separation and purification steps. However, the PHA productivities from marine microorganisms showed somewhat lower efficiencies than those from the commercial strains isolated from terrestrial environments. In order to solve the problem, further research strategies using synthetic microbiology-based technology, the development of long-term continuous culture technology, and solutions to improve PHA efficiency are required to meet future market demands for alternative bioplastics.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.253-253
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• 2016

최근 세계적으로 대체 에너지는 중요한 이슈가 되고 있으며 그 중 열전 재료는 유망한 에너지 기술로서 주목 받고 있다. 특히 고 직접화 전자 소자의 발열 문제를 해결하기 위해, 소형화와 정밀 온도 제어가 가능한 박막형 열전 소자에 연구가 주목 받고 있다. 박막형 열전소자 중 산화물 반도체계에 대한 연구가 활발히 진행되고 있으며, 이러한 산화물 반도체계 중 In2O3는 BiTe, PbTe 등의 기존의 재료에 비해 독성이 낮을 뿐만 아니라 내 산화성 및 고온에서 열적 안정성이 우수하여 고온에서 적용 불가능한 금속계 열전 재료의 한계를 극복 할 수 있다는 장점을 가진다. 우수한 성능 가장 낮은 캐리어 밀도를 가지기 때문에 의 열전 재료는 높은 전기 전도도 및 제백 계수 그리고 낮은 열전도도 특성을 가져야만 한다. IZO:Sn(Zn 10 wt.%, Sn 800 ppm) 박막의 경우, 높은 전기 전도성을 가지면서 비정질 구조를 가진다. 이와 같이 비정질 구조를 가지는 박막 열전 재료는 격자에 의한 열 전도도가 낮기 때문에 결정질 구조에 비해 전체 열 전도도 값이 낮을 것으로 기대된다. 따라서 높은 전기 전도도를 가지면서 동시에 낮은 열 전도도를 가지게 되어 우수한 열전 특성을 가질 것이라 예상된다. 이러한 특성을 바탕으로 본 연구에서는 비정질 구조를 갖는 Zn와 미량의 Sn을 동시에 첨가한 In2O3박막의 전기적 특성및 열전 특성을 관찰하고자 한다. 본 연구에서는 magnetron sputtering법으로 IZO:Sn(Zn 10 wt.%, Sn 800 ppm) 타깃을 이용하여 기판 가열없이 DC Power 70 W, 작업 압력 0.7 Pa으로 SiO2 기판 위에 $400{\pm}20nm$ 두께의 박막을 증착하였다. 이러한 공정으로 만들어진 박막은 대기 중 후 열처리를 각각의 200, 300, 400, 500, $600^{\circ}C$ 온도에서 진행하였다. 박막의 미세 구조는 XRD를 통해 관찰하였다. 그리고 박막의 전기적 특성은 Hall effect measurement을 통해 측정하였고, 열전 특성은 Seebeck 상수의 측정을 통하여 평가하였다. XRD 확인 결과 RT에서 증착한 박막과 후 열처리 200, 300, 400, $500^{\circ}C$ 결과 비정질 구조를 보였고, 후열처리 $600^{\circ}C$에서는 결정의 회절 피크를 보였다. 전기적 특성의 경우, 후 열처리 온도가 증가함에 따라 전기 전도도는 감소한다. 이는 공기중의 산소가 박막에 침투하여 oxygen vacancy를 막아 캐리어 밀도가 감소한것에 기인 된 것으로 판단된다. 열전 특성의 경우 제백상수는 후 열처리 $600^{\circ}C$에서 가장 높은 제백상수를 나타낸다. 제백 상수는 수식에 따라 캐리어 밀도의 -2/3승에 비례하게 된다. 수식에 따라 후 열처리 $600^{\circ}C$에서 가장 낮은 캐리어 밀도를 가지기 때문에 가장 높은 제백 상수를 가지게 된다. 열전 성능 척도인 Power factor는 제백 상수의 제곱과 전기전도도의 곱으로 나타내는데, 후 열처리 $200^{\circ}C$에서 가장 높은 Power factor를 보인다. 이는 캐리어 밀도 감소에 따라 전기 전도도는 감소하였지만 이로 인해 제백상수는 증가하였고, 또한 캐리어 밀도 감소에 따라 이온화 불순물 산란의 감소에 의해 이동도의 증가에 의한 것으로 판단된다. 박막의 경우 기판의 영향으로 인해 열 전도도 측정이 어려워 열전 성능 지수(ZT)를 계산을 할 수 없지만, 마그네트론 스퍼터링법으로 증착한 IZO:Sn 박막은 비정질 구조를 가지므로 격자진동에 의한 열 전도도가 낮아 전체 열 전도도가 결정질에 비해 낮을 것이며 이는 높은 열전 성능 지수를 가질 것으로 예상된다.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.7
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• pp.777-782
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• 2011

Micro features on the surface are well-known to have significant effects on optical or mechanical properties such as the optical interference, reflectance at the surface, contact angle, interfacial friction, etc. These surface micro features are increasingly employed to enhance the functionality of the applications in various application areas such as optical components for LCD or solar panel. Diverse surface features have been proposed and some of them are showing excellent efficiency or functionality, especially in optical applications. Most applications employing the micro features need manufacturing process for mass production and the injection molding and roll-to-roll forming, which are typical processes for mass production adopting polymeric materials, may be also preferred for micro patterned plastic product. Since the functionality or efficiency of the surface structures generally depends on the shape and the size of the structure itself or the array of the structures on the surface, it would be very important to replicate the features very precisely as being designed during the molding the micro pattern applications. In this paper, a series of research activities is introduced for roll-to-roll forming of micro patterned film including filling of patterns with UV curable resin, demolding of surface structures from the roll tool, control of surface energy and cure shrinkage of resin and dispose time and intensity of the UV light for curing of UV curable resin.

• Journal of Korean Society of Environmental Engineers
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• v.31 no.11
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• pp.1025-1032
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• 2009

This study investigated a possibility to develop an adsorption process for volatile organic compounds (VOCs) of the solvent emitted during dry cleaning. Pitch activated carbon fiber (ACF) was chosen as an adsorbent of VOCs, and an electric swing adsorption process was utilized for the reproduction of the adsorbent after the completion of VOCs adsorption. Effects of ACF types and several solvents such as trichloroethylene (TCE) and toluene were examined on breakthrough curves and amounts of adsorbed VOCs. ACF was pretreated under various conditions in order to enhance the amounts of the adsorbed VOCs. Temperatures and voltages were measured for the reproduction of the ACF after full adsorption. ACF having micropores exhibited high adsorption of TCE, and high surface area of ACF could increase the adsorption property of toluene. In general, ACF could adsorb 41~54% TCE of the adsorbent weight. The increase of inlet VOCs concentration significantly decreased the breakthrough time and slightly lowered the amounts of adsorbed VOCs. Thus, ACF could effectively adsorb VOCs in low concentration in the feed stream. ACF pretreated by heat under vacuum showed excellent toluene adsorption with controlling oxygen functional groups on the ACF surface, which revealed that vacant carbon site could be the adsorption point of toluene. Most adsorbed toluene was desorbed at $150^{\circ}C$.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.24-31
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• 1997

2매의 금속을 맞대어 그 한 쪽에 접촉면과 평행하게 고주파진동을 가하면 단 시간에 접합된다. 이공정을 초음파 용접이라고 하며 그 물리적인 본질은 아직 불분명 하지만, 첫째로는 강한 마찰에 의해 금속 자유면의 산화물층이 제거되기 때문이라는 점과 둘째로는 마찰에 의해 금속 표면이 강하게 가열되어 이에 따른 연화에 의해 접합 이 된다고 하는 점이다. 그러나 이와 같이 가열된다고 하더라도 가열은 표면부에만 국한되고 다른 부분은 가열되지 않는다. 따라서 초음파용접은 냉간접합이라고도 한다. 또 가압력과 진동에 의한 힘이 동시에 작용하기 때문에 용접할 면을 미리 청정하게 할 필요는 없고 용접전의 단계에서 자연적으로 청정화가 이루어진다고 하는 사실이 간접 적으로 증명되고 있다. 초음파 용접(Ultrasonic welding)의 특징을 요약하면 고상용접 의 일종으로서 용접중에 국부적으로 고주파 진동에너지와 압력을 가하여 용접하는 방법이다. 이 때 모재를 용융시키지 않고 건전한 야금학적 결합부가 얻어진다는 데에 큰 특징이 있다. 또한 초음파용접은 다른 용접법에 비해 경제성이 매우 높고, 초음파 용접에 필요한 출력이 전기아크 용접에 필요한 출력의 5 - 10%로 충분한 경우가 많다. 초음파 용접은 통상의 방법으로는 용접하기 어려운 동종 금속이나 이종 금속의 용접에 널리 사용된다. 이 용접법은 반도체, 미세회로, 전기 접점의 형성에 대한 생산기술 로서 사용되고 있는데 소형 모터, 알루미늄 박의 가공, 알루미늄 합금의 조립 등에 이용되고 있다. 한편 최근에는 자동차, 우주항공산업 분야의 구조제 용접용으로도 채용되고 있다.출함이 바람직하다.분비되는 배설-분비 항원의 자극과 깊은 관계가 있음을 알 수 있었다.넌트 명세서를 대한 XML DTD(Document Type Definition)를 정의하고, HTML 기반 검색 방법과 XML 기반 검색 방법에 대한 컴포넌트 검색 성능을 비교한다.따라 NO 생산 및 세포독성이 증가하였고. NO 생산을 저하시키는 약제들은 활성화된 복강 대식세포 및 RAW264.7 세포에 의한 질편모충에 대한 세포독성을 현저히 감소시키는 것으로 보아 NO는 질편모충에 대한 대식세포의 숙주 방어기전에서 중요한 역할을 감당할 것으로 생각된다.nction index) 와 최대개구시 동통의 정도는 시술전과 시술 4주후간에 유의한 차이가 관찰되었다.피부온도는 검사자간에는 특정부위에 따라 다소 차이가 있을 수 있으나 일반적으로 높은 재현성을 보여줌으로서 향후 교근 및 측두근의 임상연구 평가에 피부온도조사는 도움이 되리라 사료된다. lactobacilli의 양은 peroxidase system을 함유하거나(p < 0.01) 함유하지 않은(p < 0.05) 치약을 사용한 군 모두에서 양치전에 비해 유의성있게 감소하였다. 6. 양치후 30분에 채취한 구강건조증 환자의 자극성 전타액내 S. mutans 양은 peroxida system을 함유한 세치제를 사용한 군에서 대조군에 비해 유의성있게 낮았다(p < 0.05). 7. 양치후 30분에 채취한 구강건조증 환자의 자극성 전타액내 lactobacilli양은 peroxidase system을 함유한 세치제를 사용한 군에서 대조군에 비해 상대적으로 낮게 나타났으나(p = 0.067)

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.37-43
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• 1999

Modules of the system that requires large capacity and high-speed information processing are implemented in the form of MCM that allows high-speed data processing, high density circuit integration and widely applied to such fields as ATM, GPS and PCS. Hence we developed the ATM switching module that is consisted of three chips and 2.48 Gbps data throughput, in the form of 10 multi-layer by Cu/Photo-BCB and 491pin PBGA which size is $48 \times 48 \textrm {mm}^2$. hnologies required for the development of the MCM includes extracting parameters for designing the substrate/package through the interconnect characterization to implement the high-speed characteristics, thermal management at the high-density MCM, and the generation of the testability that is one of the most difficult issues for developing the MCM. For the development of the ATM Switching MCM, we extracted signaling delay, via characteristics and crosstalk parameters through the interconnect characterization on the MCM-D. For the thermal management of 15.6 Watt under the high-density structure, we carried out the thermal analysis. formed 1.108 thermal vias through the substrate, and performed heat-proofing processing for the entire package so that it can keep the temperature less than $85^{\circ}C$. Lastly, in order to ensure the testability, we verified the substrate through fine pitch probing and applied the Boundary Scan Test (BST) for verifying the complex packaging/assembling processes, through which we developed an efficient and cost-effective product.

• Journal of the Korean Society of Propulsion Engineers
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• v.19 no.3
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• pp.83-88
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• 2015

Coating materials used in the electron beam (EB) deposition method, which is being studied as one of the fabrication methods of thermal barrier coating, are exposed to high power electron beam at focused area during the EB deposition. Therefore the coating source for EB process is needed to form as ingot with appropriate density and microstructure to sustain their shape and stable melts status during EB deposition. In this study, we tried to find the optimum powder condition for fabrication of ingot of 8 wt% yttria stabilized zirconia which can be used for EB irradiation. It seems that the ingot, which is fabricated through bi-modal type initial powder mixture which consists of tens of micro and nano size particles, was shown better performance than the ingot which is fabricated using monolithic nanoscale powder when exposed to high power EB.