• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.338-339
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• 2008

현재 PCB (Printed circuit board) 산업은 디스플레이, 모바일 시장의 수요 증가로 인해 활성화 되면서 다앙한 분야로 확대 되어가고 있다. 전자기기의 직접화, 고속파, 사용 주파수 영역의 증가로 인해 수십 GHz 영역에서도 활용이 가능한 소재 및 기판의 필요성이 대두되어 지고 있어 이에 대응할 수 있는 소재 개발도 다양해지고 있다. 본 논문에서는 GHz 영역에서 인쇄회로기판의 회로형태가 특성에 미치는 영향에 대해 연구하였다. 이를위해 패턴도금법과 에칭법으로 회로를 형성하였다. 패턴도금법으로 형성된 시편은 무전해 구리도금 공정을 거친 후 감광성 필름을 이용하여 전해 도금방법을 패턴을 형성하여 회로를 구현하였고, 에칭 패턴 시편은 FR4를 이용하여 동박접합과 도금 공정 후 마스크 패턴을 사용하여 노광, 현상, 에칭 공정을 거쳐 회로를 구성하였다. GHz영역에서 Transmission Line 특성을 분석하였으며 구리 패턴과 절연체사이의 계면형태가 특성에 영향을 주는 것을 확인할 수 있었다.

• Applied Chemistry for Engineering
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• v.26 no.3
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• pp.270-274
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• 2015

We develop advanced oxidation processes for the treatment of spent electroless nickel plating solution. Apart form recovering nickel by leaching and enrichment, more emphasis is placed on rendering the waste water recyclable via oxidizing phosphite and hypophosphite into phosphate which can then be precipitated easily. $UV/H_2O_2$ process is employed and the conversion efficiency of COD and $PO_4-P$, and $H_2O_2$ consumption are analyzed. Furthermore, the $UV/H_2O_2/O_3$ process in conjunction with $O_3$ generator enables us to not only save the treatment time by 6 hours but also reduce $H_2O_2$ consumption by 30%.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.41-47
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• 2012

The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.232.1-232.1
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• 2015

흑연 박리를 통해 형성된 탄소나노플레이트를 탄소나노튜브 합성을 위한 지지체로 적용하여 탄소나노플레이트 위에 직접 탄소나노튜브를 합성함으로써 3차원 구조의 탄소나노튜브/탄소나노플레이트 나노혼성체를 합성하였음. 흑연의 박리를 통해 탄소나노플레이트를 제조하기 위해서 층간화합물 삽입과 열처리를 통해 팽창흑연을 제조하고, 물리적 분쇄 과정과 액상 고압균질기 방법을 통해 두께 30nm 이하, 수 마이크론 크기의 탄소나노플레이트를 제조하고 동결건조 방법으로 탄소나노플레이트를 제조하였음. 제조된 탄소나노플레이트 상에 탄소나노튜브 합성을 위해서 탄소나노플레이트 표면처리 공정을 적용하였는데, 표면처리 방법 및 물질에 따라 금속 촉매의 담지량 및 담지 형상이 결정되어 합성되어지는 탄소나노튜브의 합성 수율과 합성된 탄소나노튜브의 형성이 다르게 나타났다. 표면처리 방법으로는 산처리방법, 흡착성 고분자 처리법, 무전해 도금법, 무기산화물 처리법이 적용되었다. 또한 담지되는 촉매 종류 및 함량, 조촉매 적용에 따라 탄소나노튜브 합성 거동을 분석하여 최적 촉매시스템을 구축하여 촉매담지체 질량 대비 700% 이상의 고수율의 탄소나노튜브/탄소나노플레이트 혼성체 합성법을 개발하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.118-121
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• 2003

The electrochemical behaviors of UBM nickel were investigated. Electrode potential has been changed with the surface composition. Zinc is dissolved into the solution immediately after immersion. Electrode potential has three distinct regions: Zinc dissolution region, transient region and nickel plating region. The effects additives on electrode potential and polarization curves were also investigated. The addition of suppressor lowered the current density which is related with deposition rate.

• Journal of Powder Materials
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• v.11 no.3
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• pp.224-232
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• 2004

Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7$0^{\circ}C$ .

• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.863-867
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• 2008

Pitch based activated carbon fiber(ACF) was prepared from reformed naphtha cracking bottom oil(NCB oil) by melt spinning. The fibers obtained were stabilized, carbonized, and then steam activated. The ACF was sensitized with Pd-Sn catalytic nuclei via a single-step activation approach. This sensitized ACF was used as precursors for obtaining copper plated ACFs via electroless plating. ACFs uniformly decorated with metal particles were obtained with reduced copper plating in the reaction solution. Effects of the amount of copper on characteristics of ACF/Cu catalysts were investigated through BET surface area, X-ray diffraction, scanning emission microscopy, and ICP. The amount of copper increased with plating time, but the surface area as well as the pore volume decreased. NO conversion increased with reaction temperature. NO conversion decreased with increasing the amount of copper, which is seemed to be due to the reduction of surface area as well as the dispersion of copper.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.232.2-232.2
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• 2005

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.97-106
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• 2000

In these respects the purpose of this research is manufacturing Co-W-P alloy thin film on the corning glass 2948 by electroless plating method using $NaH_2PO_2H_2O$ (sodium hypophosphite) as a reductant, and analyzing deposition rate, alloy composition, microstructure, and magnetic characteristics at various pH's and temperatures. For Co-P alloy thin film, the reductive deposition reaction occurred only in basic condition, not in acidic condition. The deposition rate increased as the pH and temperature increased, and the optimum condition was found at the pH of 10 and the temperature of 8$0^{\circ}C$. Also magnetic characteristics was found to be most excellent at the pH of 9 and the temperature of 7$0^{\circ}C$, resulting in the coercive force of 870Oe and the squareness of 0.78. At this condition, the contents of P was 2.54% and the thickness of the film was 0.216$\mu\textrm{m}$. For crystal orientation, we could not observe fcc for $\beta$-Co. On the other hand, (1010), (0002), (1011) orientation of hcp for $\alpha$-Co was observed. We could confirm the formation of longitudinal magnetization from dominant (1010) and (1011) orientation of Co-P alloy. For Co-W-P alloy thin film, coercive force was 500Oe and squareness was 0.6. For crystal orientation, (0002) orientation of $\alpha$-Co was dominatly found. Then we could confirm the formation of perpendicular magnetization. The content of P was constant at 0.8$\pm$0.2% and the content of W increased as the concentration of Na$_2$WO$_4$increased. When the concentration of Na$_2$WO$_4$was 0.1mol/L, the composition of W was 20%. We observed the changes of magnetic characteristics and microstructure of thin film depositions of Co-W-P by the heat treatment. For heat treatment, the temperature was increased step by step to 10$0^{\circ}C$, 20$0^{\circ}C$, 30$0^{\circ}C$, and 40$0^{\circ}C$ and it took 1 hour at each step in the reductive condition of hydrogen gas. By the heat treatment, flatness of surface was improved, but there were no changes on the magnetic characteristics and the microstructures.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.187.2-187.2
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• 2014

최근 다양한 카본 나노소재들이 열 전도성 필러로써 고분자 복합체의 열전도도 향상을 위해 연구되고 있다. 그러나 구조적 이방성을 갖는 탄소나노튜브(CNT) 혹은 그래핀나노플레이트(Graphene Nanoplatelet)를 복합체에 적용할 경우, 복합체의 수직 방향과 수평 방향에서의 열전도도가 3배 이상 차이가 나는 문제가 있다. 따라서 본 연구에서는 2차원의 GNP 표면 위에 1차원의 CNT를 직접 성장시킨 하이브리드 탄소소재를 이용하여 이러한 열전도도 이방성을 개선하고자 하였다. 하이브리드 탄소소재는 무전해 도금법과 열기상법으로 제조하였다. 합성된 하이브리드 탄소소재 및 CNT를 단독 혹은 혼합하여 필러를 만들고 이를 에폭시 기지 내에 분산시켜 복합체를 제작하였다. 필러 함량별, 필러 비율별로 제작된 복합체의 열전도도를 레이저 플래시 법으로 측정 비교하였다. 결과적으로 기존의 단일 필러들보다 열전도도 이방성이 1.5배 이상 개선된 방열용 에폭시 복합체를 제작할 수 있었다. 한편 하이브리드 탄소와 2% 이하의 CNT 배합에서 단독 필러 투입에 비해 45% 이상의 열전도율 향상을 확인하였다. 이는 미세구조 분석 및 성분 분석 결과, 필러 분산 정도가 열전도도 향상의 주요 인자로 작용하는 것을 확인하였고 기지 내 CNT가 열전도도 경로로 작용하기보다는 하이브리드 탄소소재의 균일한 분산에 영향을 준 것으로 사료된다.