• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.179.2-179
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• 2002

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.264-269
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• 2017

To improve heating characteristics of graphite fibers, graphite fibers were copper-plated by electroless plating. The Cu-plated graphite fibers were investigated by thermos-gravimetric analysis in air to calculate quantities of copper on surface of graphite fiber according to plating time. Also, the surface temperature with applied voltage was observed by thermos-graphic camera using a strand of graphite fiber. According to the increment of plating time, the higher quantities of plated copper on graphite fiber were obtained. The electric conductivity of plated graphite fiber for 20 minutes was resulted in 1594.3 S/cm, and surface temperature of this sample showed the maximum temperature $57.2^{\circ}C$. These result could be attributed that copper having great electric conductivity are growing on graphite fiber and followed improving heating characteristics.

• Applied Chemistry for Engineering
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• v.24 no.4
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• pp.438-442
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• 2013

In the present work, electroless plating was used for coating thin films consisting mainly of Ni and P on carbon fiber. Structural changes appeared upon the post-annealing at various temperatures of the Ni-P film on carbon fiber was studied using various analysis methods. Scanning, a flat surface structure of Ni-P film on carbon fiber was found after electroless plating of Ni-P film on carbon fiber without post-annealing, whereas annealing at $350^{\circ}C$ resulted the formation of porous structures. With increasing the annealing temperature to $650^{\circ}C$ with an interval of $50^{\circ}C$, the pore size increased, but the density decreased. X-ray diffraction (XRD) showed the existence of metallic Ni, and Ni-P compounds before post-annealing, whereas the post-annealing resulted in the appearance of NiO peaks, and the decrease in the intensity of the peak of metallic Ni. Using X-ray photoelectron spectroscopy (XPS), phosphorous oxides were detected on the surface upon annealing at $650^{\circ}C$, and $700^{\circ}C$, which can be attributed to the phosphorous compounds originally existing in the deeper layers of the Ni films, which undergo sublimation and escape from the film upon annealing. Escape of phosphorous species from the bulk of Ni-P film upon annealing could leave a porous structure in the Ni films. Porous materials can be of potential applications in diverse fields due to their interesting physical properties such as high surface area, and methods for fabricating porous Ni films introduced here could be easily applied to a large-scale production, and therefore applicable in diverse fields such as environmental filters.

• Polymer(Korea)
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• v.34 no.1
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• pp.25-31
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• 2010

Polymer core and metal shell composite particles have been prepared by the electroless nickel plating on the surface of monodisperse polystyrene microspheres. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling the dispersion medium in dispersion polymerization. Electroless nickel plating was performed on the polystyrene particle with diameter of $3.4\;{\mu}m$. The morphology of polystyrene/nickel composite particles was investigated to see the effect of the plating conditions, such as the $PdCl_2$ and glycine concentrations and the dropping rate of nickel plating solution, on nickel deposition. With $PdCl_2$ and glycine concentrations at more than 0.4 g/L and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was introduced by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min showed rather uniform plating.

• Resources Recycling
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• v.21 no.6
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• pp.39-44
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• 2012

An attempt to recover copper from electroless plating wastewater has been made through evaporation followed by the electrowinning method. From the determination of each element in electroless plating wastewater, the content of Cu was found to be 582 mg/l and small amount of Fe was also contained in it. Moreover, the content of COD and TOC which was resulted from the addition of Rochell salt was found to be 9,560 and 13,100 mg/l, respectively. The content of formic acid generated by the oxidation of formaldehyde was determined to be 7.73 %. As a result, current efficiency was decreased with increase in current density and therefore current density less than $40mA/cm^2$ should be maintained to obtain current efficiency more than 80 %. The content of Fe in Cu obtained by electrowinning was found to be 0.021 and 0.01 % at the concentration of sulfuric acid of 2 and 10 vol%, respectively.

• The korean journal of orthodontics
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• v.36 no.2 s.115
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• pp.145-152
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• 2006

The purpose of this study was to evaluate electroless plating as a method of increasing the diameter of an orthodontic wire in comparison with eletroplating. After pretreatment plating of the 0.016 inch stainless steel orthodontic wire, electroless plating was performed at $90^{\circ}C$ until the diameter of the wire was increased to 0.018 inch. During the process of electroless plating, the diameter of the wire was measured every 5 minutes to examine the increasing ratio of the wire's diameter per time unit. And to examine the uniformity, the diameter at 3 points on the electroless-plated orthodontic wire was measured. An X-ray diffraction test for analyzing the nature of the plated metal and a 3-point bending test for analyzing the physical property were performed. The electroless-plated wire group showed a increased tendency for stiffness, yield strength, and ultimate strength than the electroplated wire group. And there was a statistically significant difference between the two groups for stiffness and ultimate strength. In the electroless-plated wire group, the increasing ratio of the diameter was $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min). In the electroplated wire group, it was $0.00821{\pm}0.00015mm/min$. The results of the uniformity test showed a tendency for uniformity in both the plating methods. The results of this study suggest that electroless plating of the wire is closer to the ready-made wire than electroplating wire in terms of the physical property. However, the length of plating time needs further consideration for the clinical application of electroless plating.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.416-416
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• 2014

탄소나노튜브(CNTs)의 비강도는 철합금에 비해 30~50배 높으며, 알루미늄 밀도($2.7g/cm^3$)보다 낮은 $1.3{\sim}1.4g/cm^3$의 값을 갖는 고강도 고경량의 탄소소재이다. 이러한 CNT를 금속기지에 복합화 하면 비강도가 매우 우수하고 고경량화 소재의 제조가 가능하다. 하지만, CNT는 반데르발스(Van der waals) 힘에 의해 서로 뭉쳐서 존재하며, 젖음성이 나쁘기 때문에 금속과 부상 분리되는 단점이 있다. 따라서, 이러한 문제점을 보완하기 위하여 무전해 도금법, 전해도금법 등으로 Cu, Ni등을 코팅하여 문제점을 해결하려는 연구가 진행되어 왔지만, 복합소재를 제조하기 위해 필요한 CNT를 대량으로 코팅하기엔 적합하지 않다. 본 연구에서는 CNT표면에 Cu를 대량으로 형성시킬 수 있는 시멘테이션법을 이용하여, 공정조건에 따른 CNT/Cu의 석출되는 형상 및 성분의 변화를 조사하였다.

• Clean Technology
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• v.19 no.2
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• pp.84-89
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• 2013

The running blots between patterns during electroless nickel electroless palladium immersion gold (ENEPIG) surface finish of printed circuit board (PCB) are investigated and a proper solution is presented. Computational chemistry is first employed to understand the process and experiments are then designed to verify the proposed ideas. A $PdCl_2$ activator which has relatively weak chemical bonding to the epoxy resin is introduced to prevent the formation of palladium seeds on the epoxy resin and a couple of operational measures such as increasing HCl concentration and lowering the temperature of Pd activation process are executed to prevent a further hydrolysis of $PdCl_2$ to more stable $Pd(OH)_2$ in aqueous solution. Computational chemistry provides thermodynamic backgrounds for experiments and their results. This combined approach is expected to be very useful in the research of relevant processes.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.31-37
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• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.5
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• pp.193-198
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• 2015

In the study, electroless Ni-plating on flexible ethylene-propylene-diene-monomer (EPDM) rubber sheets for the application of an insert block for shielding electromagnetic interference of multi cable transit (MCT) systems was investigated. Ni crystallinity and adhesion have been found to vary with processing parameters such as pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity and optimum electric conductivity were obtained on EPDM rubber sheets under pH 7 and 8 at $60{\sim}70^{\circ}C$. The conductive Ni-plated EPDM rubber prepared at pH 7 at $70^{\circ}C$ showed the enhanced adhesion and electric conductivity, and the high electromagnetic interference shielding effect in the 400 MHz~1 GHz range.