• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.1
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• pp.160-170
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• 2002

Many of aged and damaged concrete structure have been revitalized with composite reinforcement. Flexural behaviors of composite-patched concrete specimens are characterized by high-sensitivity moire interferometry. The three-mirror, four-beam interferometry system and a compact loading system are used for obtaining singe patterns representing whole-field contour maps of in-plane displacements. It is seen from the calibration test for the loading system that the measured bending displacement is in excellent agreement with the displacement calculated by the beam theory. The crack opening displacement as well as the bending and the horizontal displacement fur the notched and unnotched specimen are investigated. The results also show that the notched specimen reinforced by a composite sheet has sufficient stiffness and strength compared to the original concrete specimen.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• Korean Journal of Optics and Photonics
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• v.3 no.3
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• pp.172-177
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• 1992

Improved technique for collimation testing based on bidirectional shearing interferometry is presented. It consists of a wedgc. plate and two plane mirrors. The proposed technique has its own reference mark to indicate collimation of the light beam and provides a two fold increase in sensitivity. Detailed analyses for various configurat~ons are presented, and the usef~llness for practical applications is demonstrated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.11
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• pp.1100-1107
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• 2007

In this study, a method to characterize material properties of adhesive that is used in a layered plates bonding process is developed by combined evaluation of experiment, simulation and optimization technique. A small bonded specimens of rectangular plate are prepared to this end, and put into a thermal loading conditions. $Moir{\acute{e}}$ interferomety is used to measure submicron displacements occurred during the process. The elevated temperature is chosen as control factors. FE analysis with constant values for the adhesive materials is also carried out to simulate the experiment. Significant differences are observed from the two results, in which the simulation predicts the monotonic increase of the bending displacement whereas the measurement shows decrease of the displacement at above $75^{\circ}C$. In order to minimize the difference of the two, material parameters of the adhesive at a number of different temperatures are posed as unknowns to be determined, and optimization is conducted. As a result, optimum material parameters are found that excellently matches the simulation and experiment, which are decreased with respect to the temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.2
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• pp.186-193
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• 2008

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.7 s.166
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• pp.1129-1138
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• 1999

[$Moir\acute{e}$] technique is now being extensively investigated as a fast non-contact means of three-dimensional profile measurement especially for reverse engineering. One problem with $moir\acute{e}$ technique is so called $2\pi$-ambiguity problem that limits the maximum step height difference between two neighboring sampling points to be less than half the equivalent wavelength of $moir\acute{e}$ fringes. In this investigation, a new two-wavelength scheme of projection $moir\acute{e}$ topography is proposed and tested to cope with the $2\pi$-ambiguity problem. Experimental results are discussed to assess the new method in measuring large objects with high step discontinuities.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.11
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• pp.7-14
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.