• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1918-1920
• /
• 2001

초소형 히트파이프는 고집적 반도체 소자에서 발생되는 열을 효과적으로 소산하기 위한 열교환 장치이다. 초소형 히트파이프는 작동유체가 상 변화 잠열을 이용한 칩 레벨의 냉각 장치이다. 작동유체는 진공으로 밀봉된 공간내에서 외부 동력 없이 모세관력에 의하여 이동한다. 본 논문에서는 실리콘보다 열전도도가 우수하여 발생되는 열을 더욱 빠르게 소산시킬 수 있는 구리 모재의 초소형 히트파이프를 제작한다. 특히, 모세관력은 히트파이프의 성능을 좌우하는 요소이다. 모세관력 향상을 위해서 구리 전기도금으로 이용하여 홈(groove)부분을 제작한다. 윅(wick) 제작, 구리판 접합, 작동유체 충전등으로 초소형 히트파이프를 제작한 후, 성능 실험한 결과를 보여준다.

• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.6
• /
• pp.14-20
• /
• 2009

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.39 no.4
• /
• pp.359-370
• /
• 2015

The present study aims to numerically investigate the behavior of liquid droplet driven by capillarity force imbalance on horizontal surfaces ranging from hydrophilic to hydrophobic, under various conditions. The droplet behavior has been simulated using an in-house solution code(PowerCFD), which employs an unstructured cell-centered method based on a conservative pressure-based finite-volume method with interface capturing method(CICSAM) in a volume of fluid(VOF) scheme for phase interface capturing. The detailed droplet behavior was obtained under various conditions for droplets with different initial shapes, contact angles and surface tension forces(or Bond number). The mechanism of droplet transport was examined using the numerical results on the droplet shapes.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.40 no.11
• /
• pp.755-759
• /
• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

• Journal of the Korean Geotechnical Society
• /
• v.26 no.4
• /
• pp.37-45
• /
• 2010

Salt cementation, a typical naturally-cemented phenomenon, may occur due to water evaporation under the change of climate. Capillary force may influence the distribution of cement in granular soils. This study addresses the effect of capillary force on salt cementation using five different techniques: cone penetration test, electrical conductivity measurement, photographic imaging technique, nondestructive imaging technique, and process monitoring by elastic wave. Glass beads modeling a particulate media was mixed with salt water and then dried in an oven to create the cementation condition. Experimental results show that salt cementation highly concentrates at the top of the small particle size specimens and at the middle or the bottom of the large particle specimens. The predicted capillary heights are similar to the locations of high salt concentration in the cemented specimens. Five suggested methods show that the behavior of salt-cemented granular media heavily depends on the capillary force.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.66-66
• /
• 2007

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.39 no.11
• /
• pp.871-884
• /
• 2015

Fluid transport is a key issue in the development of microfluidic systems. Recently, Myong (2014) has proposed a new concept for droplet transport without external power sources, and numerically validated the results for a hypothetical 2D shape, initially having a hemicylindrical droplet shape. Myong and Kwon (2015) have also examined the transport mechanism for an actual water droplet, initially having a 3D hemispherical shape, on a horizontal hydrophilic/hydrophobic surface, based on the numerical results of the time evolution of the droplet shape, as well as the total kinetic, gravitational, pressure and surface free energies inside the droplet. In this study, a 3D numerical analysis of an initially spherical droplet is carried out to establish a new concept for droplet transport. Further, the transport mechanism of an actual water droplet is examined in detail from the viewpoint of the capillarity force imbalance through the numerical results of droplet shape and various energies inside the droplet.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.27 no.1
• /
• pp.17-24
• /
• 2003

A mathematical model of the hydrodynamic and heat transfer performances of two-phase flow (gas-liquid) in thin film region of micro channel is proposed. For the formulation of modeling, the flow of the vapor phase and the shear stress at the liquid-vapor interface are considered. In this work, disjoining pressure and capillary force which drive the liquid flow at the liquid-vapor interface in thin film region are adopted also. Using the model, the effects of the variations of channel height and heat flux on the flow and heat transfer characteristics are investigated. Results show that the influence of variation of vapor pressure on the liquid film flow is not negligible. The heat flux in thin-film region is the most important operation factor of micro cooler system.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.7
• /
• pp.51-58
• /
• 2002

In this paper, the characteristics of silicon wafer surface which is textured by KOH anisotropic etching method and mechanical polishing are investigated from the viewpoint of stiction and friction. It was found that the characteristics of stiction and friction of each textured surface are dependent on the contact area characterized by surface parameters such as bearing length ratio and peak count. To find the mechanism of the variation of stiction and friction in textured surface, OTS SAM coated wafer was used. In this case, the variation of stiction and friction was diminished, Therefore, it is concluded that the reason of variation of stiction and friction on textured surface is mainly caused by capillary which in turn is affected by the surface topography

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.18 no.4
• /
• pp.369-374
• /
• 2009

In micro/nano-scale contacts in MEMS and NEMS, capillary and van der Waals forces generated around contacting micro-asperities significantly influence the performance of concerning device as they are closely related to adhesion and stiction of interacting surfaces. In this regard, it is of prime importance to accurately estimate the magnitude of surface forces so that an optimal solution for reducing friction and adhesion of micro/nano-surfaces may be obtained We introduced an effective method to calculate these surface forces based on topography information obtained from an atomic force microscope. This method was used to calculate surface forces generated in the contact interface formed between diamond-like carbon coating and $Si_3N_4$ ball. This method is shown to effectively demonstrate the influence of capillary force in the contact area, especially in humid atmosphere.