• Title/Summary/Keyword: 마이크로 플레이트

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Numerical Study on the Performance of a Microchannel Heat Exchanger with a Novel Channel Array (새로운 채널 배열을 통한 마이크로채널 열교환기 성능 향상 수치 연구)

  • Jeon, Seung-Won;Lee, Kyu-Jung;Moon, Dong-Ju
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.11
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    • pp.1119-1126
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    • 2011
  • In conventional microchannel heat exchangers, only one kind of fluid (hot or cold) flows in each plate. The channels contain different kinds of fluid depending on the vertical position, but they have the same kind of fluid at all horizontal positions. Therefore, there is a slower heat transfer rate in the horizontal direction than in the vertical direction. We propose a microchannel heat exchanger in which hot and cold fluid flows alternately in each plate to improve the thermal performance. This novel channel array requires a special design for the inlet and outlet. The proposed channel array has a faster heat transfer rate than a conventional channel array. The thermal performance of the novel channel array increases with increasing Reynolds number and Prandtl number, but it decreases as the ratio of solid to fluid thermal conductivity increases.

Solder Bump Deposition Using a Laser Beam (레이저빔을 이용한 솔더범프 적층 공정)

  • Choi, Won-Suk;Kim, Jea-Woon;Kim, Jong-Hyeong;Kim, Joo-Han
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.1
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    • pp.37-42
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    • 2012
  • LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.

Room Temperature Imprint Lithography for Surface Patterning of Al Foils and Plates (알루미늄 박 및 플레이트 표면 미세 패터닝을 위한 상온 임프린팅 기술)

  • Tae Wan Park;Seungmin Kim;Eun Bin Kang;Woon Ik Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.65-70
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    • 2023
  • Nanoimprint lithography (NIL) has attracted much attention due to its process simplicity, excellent patternability, process scalability, high productivity, and low processing cost for pattern formation. However, the pattern size that can be implemented on metal materials through conventional NIL technologies is generally limited to the micro level. Here, we introduce a novel hard imprint lithography method, extreme-pressure imprint lithography (EPIL), for the direct nano-to-microscale pattern formation on the surfaces of metal substrates with various thicknesses. The EPIL process allows reliable nanoscopic patterning on diverse surfaces, such as polymers, metals, and ceramics, without the use of ultraviolet (UV) light, laser, imprint resist, or electrical pulse. Micro/nano molds fabricated by laser micromachining and conventional photolithography are utilized for the nanopatterning of Al substrates through precise plastic deformation by applying high load or pressure at room temperature. We demonstrate micro/nanoscale pattern formation on the Al substrates with various thicknesses from 20 ㎛ to 100 mm. Moreover, we also show how to obtain controllable pattern structures on the surface of metallic materials via the versatile EPIL technique. We expect that this imprint lithography-based new approach will be applied to other emerging nanofabrication methods for various device applications with complex geometries on the surface of metallic materials.

Prgress in MEMS Engine Development for MAV Applications (KAIST의 MAV용 MEMS 엔진 개발 현황)

  • Lee, Dae-Hoon;Park, Dae-Eun;Yoon, Eui-Sik;Kwon, Se-Jin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.30 no.6
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    • pp.1-6
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    • 2002
  • Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode is formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer from the engine. Combustor size was determined to be 1mn scale. Piston in cylinder moves by fuel injection and reaction. In firing test, adequate engine operation including ignition, flame propagation and piston motion was observed. Present study warrants further application research on MEMS scale internal combustion power units.

Thermal and Chemical Quenching Phenomena in a Microscale Combustor (I) -Fabrication of SiOx(≤2) Plates Using ion Implantation and Their Structural, Compositional Analysis- (마이크로 연소기에서 발생하는 열 소염과 화학 소염 현상 (I) -이온 주입법을 이용한 SiOx(≤2) 플레이트 제작과 구조 화학적 분석-)

  • Kim Kyu-Tae;Lee Dae-Hoon;Kwon Se-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.5 s.248
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    • pp.397-404
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    • 2006
  • Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

Study on Cell Growth Characteristics with Culture Medium Components by Using MABOOMSTM (마이크로플레이트 기반 생물반응기 시스템(MABOOMSTM)을 이용한 발효배지 성분의 미생물 성장 특성 연구)

  • Sohn, Ok-Jae;Rhee, Jong Il
    • KSBB Journal
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    • v.28 no.1
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    • pp.31-35
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    • 2013
  • In this work a $MABOOMS^{TM}$ has been employed to cultivate microorganisms and investigated the effects of culture medium components on cell growth. A 24-well microplate coated with 4-divided fluorescent sensing membranes was used to monitor the dissolved oxygen, pH and cell concentration during cultivations. Fluorescence intensity for dissolved oxygen or solution pH and reflectance for cell concentration was online monitored by using the $MABOOMS^{TM}$. The online monitoring results showed the effects of culture medium components on cell growth in cultivation processes very well.

Horizontal Behavior Characteristics of Umbrella-Type Micropile Applied in Sandy Soil Subjected to Seismic Motion (사질토 지반에 설치된 우산형 마이크로파일의 지진 시 수평거동 특성)

  • Kim, Soo-Bong;Son, Su Won;Kim, Jin Man
    • Journal of the Korean GEO-environmental Society
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    • v.21 no.7
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    • pp.5-16
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    • 2020
  • Currently, the seismic design standards have been strengthened due to the occurrence of the Gyeongju and Pohang earthquake, and seismic performance evaluation of existing facilities is being conducted. It aims to secure a seismic performance effect during earthquakes by improving the micro-pile method, which can be constructed in limited confined places while minimizing damage to existing facilities. The improvement method is to construct all the piles in the square-tray-type plate on the top of the pile by constructing the slope pile in the form of an umbrella around the vertical pile, the main pillar. In this paper, the numerical analysis was performed to analyze the horizontal displacement behavior of an umbrella-type micropile for various real-measurement seismic waves in sandy soil. As a result of numerical analysis, the softer the ground, the better the effect of horizontal resistance of umbrella-type micropile. The horizontal displacement reduction effect was pronounced when the embedded depth was 15 m or more at the same ground strength, and it was found to be effective in earthquakes if it was settled on the ground with an N value of 30 or more. The embedded depth and horizontal displacement suppression effect of the micropile was proportional. Generally, the weaker the ground, the greater the displacement suppression effect. Umbrella-type micropile had a composite resistance effect in which the vertical pile resists the moment and inclined pile resists the axial force.

Numerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive (수치해석을 이용한 전동차용 IGBT 모듈의 피로 수명 예측)

  • Kwon, Oh Young;Jang, Young Moon;Lee, Young-ho;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.103-111
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    • 2017
  • In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

Controlled Production of Monodisperse Polycaprolactone Microparticles using Microfluidic Device (미세유체장치를 이용한 생분해성 Polycarprolactone의 단분산성 미세입자 생성제어)

  • Jeong, Heon-Ho
    • Clean Technology
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    • v.25 no.4
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    • pp.283-288
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    • 2019
  • Monodisperse microparticles has been particularly enabling for various applications in the encapsulation and delivery of pharmaceutical agents. The microfluidic devices are attractive candidates to produce highly uniform droplets that serve as templates to form monodisperse microparticles. The microfluidic devices that have micro-scale channel allow precise control of the balance between surface tension and viscous forces in two-phase flows. One of its essential abilities is to generate highly monodisperse droplets. In this paper, a microfluidic approach for preparing monodisperse polycaprolactone (PCL) microparticles is presented. The microfluidic devices that have a flow-focusing generator are manufactured by soft-lithography using polydimethylsiloxane (PDMS). The crucial factors in the droplet generation are the controllability of size and monodispersity of the microdroplets. For this, the volumetric flow rates of the dispersed phase of oil solution and the continuous phase of water to generate monodisperse droplets are optimized. As a result, the optimal flow condition for droplet dripping region that is able to generate uniform droplet is found. Furthermore, the droplets containing PCL polymer by solvent evaporation after collection of droplet from device is solidified to generate the microparticle. The particle size can be controlled by tuning the flow rate and the size of the microchannel. The monodispersity of the PCL particles is measured by a coefficient of variation (CV) below 5%.

Locomotion Characteristics of a Foxtail and a Foxtail-like Robot (강아지풀 및 강아지풀모사로봇의 이동특성에 관한 연구)

  • Lee, Min-Su;Kim, Yeong-Hyeok;Leem, Sang-Huyck;Kim, Byung-Kyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.12
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    • pp.1893-1899
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    • 2010
  • A foxtail moves forward on a flat surface when pushed by a vertical force. The distance moved by the foxtail depends on the degree of deformation. We experimentally investigated the main parameters that influence the distance moved while varying the pushing force, area, and velocity. We then fabricated a nylon barb that mimics the foxtail barb and performed theoretical and experimental analyses of the displacement according to the acting force and the deflection. In addition, we investigated the relation between the displacement and the angle of a foxtail-like robot's leg by varying the clearance between the robot body and the inner surface of the pipe. To find the design parameters of the barb of the robot for tubular-type digestive organs and blood vessels, we studied the relation between the acting force and the elastic modulus while varying the leg diameter.