• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.380-386
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• 2001

A nuclear microprobe system with adjustable precision object slits and a magnetic quadrupole doublet was designed by the beam optics simulation using a first order matrix formalism, and installed in a $30^{\circ}$ beam line connected with KIGAM 1.7 MV Tandem VDG Accelerator. Demagnification factors for x and y axis are calculated to be 25 and 4.9, respectively, and a minimum beam spot side is expected to be about 5 $\mu\textrm{m}$ for 3 MeV proton beams with a current of about 1 nA. A multi-purpose octagonal target chamber has been built to facilitate MeV ion-beam analytical techniques of PIXE, RBS, ERDA, and ion beam micro-machining. It contains X-ray and particle detectors, a zoom microscope, a Faraday cup, a 4-axis sample manipulator and a high vacuum pumping system. The system performance of the nuclear microprobe is now being tested, and automatic manipulator control and data acquisition system will be installed for routine applications of micro ion-beam analytical techniques.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.187-196
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• 2005

MEMS devices such as a vibratory gyroscope often suffer from a lower yield rate due to fabrication errors and the external stress. In the decoupled vibratory gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, fabricated with SOI (Silicon-On-Insulator) wafer and packaged using the anodic bonding, has a large wafer bowing caused by thermal expansion mismatch as well as non-uniform surfaces of the structures caused by the notching effect. These effects result in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) technology. It uses a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching. In the packaged SiOG gyroscope, the notching effect is eliminated and the warpage of the wafer is greatly reduced. Consequently the frequency difference is more uniformly distributed and its variation is greatly improved. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.55-59
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• 2018

In this paper, we investigated the characteristics of shear stress type piezoresistor on a diaphragm structure formed by MEMS (Microelectromechanical System) technology of silicon-direct-bonding (SDB) wafers with Si/$SiO_2$/Si-sub. The diaphragm structure formed by etching the backside of the wafer using a TMAH aqueous solution can be used for manufacturing various sensors. In this study, the optimum shape condition of the shear stress type piezoresistor formed on the diaphragm is found through ANSYS simulation, and the diaphragm structure is formed by using the semiconductor microfabrication technique and the shear stress formed by boron implantation. The characteristics of the piezoelectric resistance are compared with the simulation results. The sensing diaphragm was made in the shape of an exact square. It has been experimentally found that the maximum shear stress for the same pressure at the center of the edge of the diaphragm is generated when the structure is in the exact square shape. Thus, the sensing part of the sensor has been designed to be placed at the center of the edge of the diaphragm. The prepared shear stress type piezoresistor was in good agreement with the simulation results, and the sensitivity of the piezoresistor formed on the $2200{\mu}m{\times}2200{\mu}m$ diaphragm was $183.7{\mu}V/kPa$ and the linearity of 1.3 %FS at the pressure range of 0~100 kPa and the symmetry of sensitivity was also excellent.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.7-13
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• 2007

In the optical module for optical communications, the flip chip bonding is used fer the precise alignment of the optical fiber and optical device. In flip chip bonding, the optical device is aligned and welded while observing the alignment mark of substrate and chip by using flip chip bonder in order to bond the optical device at the exact position. In this research, optical passive alignment method of photodiode(PD) flip chip bonding is suggested for low cost optical subassembly. By using the visible He-Ne laser (633nm wavelength), photodiode is easily aligned with emitting spot on the optical fiber with the help of stereoscopic alignment system. We compensated wavelength dependent deviation about 4m to find out real alignment position of 1550nm input laser by ray tracing. The maximum optical coupling efficiency between the optical fiber and photodiode was about 23.3%.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.10b
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• pp.15-15
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• 1994

M MA ODS 합금의 보다 폭넓용 실용확훌 위해 크게 요구되고 있는 적정 접합기술 개발의 한 방안￡로, 마찰압접(Friction Welding) 방법의 가능성옳 조사하기 위하여 마찰압력과 시간, 마 찰 후 접촉압력(Upset Pressure) 풍을 다양하게 변화시켜 접합체톨 제조한 후, 접합체 강도에 대한 인장시험과 접합계연의 결합 및 미세구조에 대한 현미경 관찰, EDS에 의한 원소분석, 접 합이옴부의 경도분포와 파단면 분석 풍율 행하였다. 실험에 사용된 모재는 기계적 합금법으로 제조된 Inca사의 Ni기 MA 754 합금이었으며, 직경 l 10 mm, 길이 50 mm로 가공한 후, 아세통￡로 초음파 세척하여 접합에 사용하였다. 접합온 브 레이크식 마찰압접기틀 사용하여 행하였으며, 회전시험편의 회전수는 2400 rpm이었A며, 다른 한쪽의 고정시험편과의 마찰압력 및 마찰시간온 각각 50 - 500 MPa과 1-5초로, 또한 업셋압 력도 50 - 600 MPa로 변화시켰다. 이때 업셋압력은 모든 시편에 대해 일정하게 6초동안 가하 였다. 얻어진 접합체는 각 압접조건 당 2개 이상의 접합시험편에 대해 상온 인장강도톨 측정하 였으며, 파단이 일어난 위치를 확인한 후 파면에 대한 분석율 주사전자현미경(SEM)과 에너지 분산형 분광분석기mDS)릎 사용하여 행하였다. 컵합이옴부의 첩합성올 확인하기 위하여, 접합 체를 접합변에 수직으로 절단, 연마한 후 광학현미경과 SEM, EDS 퉁으로 관찰, 분석하여 접 합부의 형상과 결합형성 여부, 접합계면의 미세조직 퉁옳 조사하였다. 또한 마찰압접에 따론 모재와 접합계연부의 경도분포훌 접합이옴부로부터 모재쪽으로 일정 간격율 두어 마이크로 비 커스 경도기로 측정, 조사하였다. 이상의 설험 결과, 다옴과 같온 결론옳 얻었다. ( (1) 접합체 강도가 모채 강도의 95% 이상이 되는 양호한 렵합체흩 얻기 위한 마찰압력 조건 온, 2400 rpm의 회전속도와 6초의 업셋압력 유지시간에서 마찰압력과 업셋압력, 그리고 마찰시 간이 각각 400 MPa 이상과 500 MPa 이상,2초입율 확인하였다. ( (2) 컵합이옴부의 관찰 결과, 모든 마찰압접 조건에서 컵합이옴부는, 기폰 모재의 texture 조직 을 유지하고 있는 모재부 영역(영역 ill)과 첩합계면부에 인접하여 업셋압력이 주어질 때 단조 효과에 의해 계연 외부로 metal flow가 일어나면서 형성된 영역 II, 매우 미세한 결정립으로 구성된 중앙부의 영역 1 로 이투어져 있옴융 확인하였다. ( (3) 최적접합조건이 충족되지 않온 경우, 접합부의 영역 I 에서 관찰된 void와 균열, 불균일한 접합계면 통의 접합결함에 Al과 Y. Ti 퉁￡로 구성된 산화물률이 용집되어 있옴을 확인하였 다-( (4) 접합체의 파단 양상온 크게 접합부 파단과 모재부 파단, 이률의 혼합형 파단i로 나눌수 있었다. 모재부 파단의 경우, 파단면이 매끄럽고 파변상의 결정립도 매우 미세하였으며, 산확물 의 용집도 찾아보기 어려웠 나, 접합부 파단의 경우에는 파변의 굴곡이 비교척 심하고 연성 입계파괴의 형태를 보였￡며, 결정립도 모채부 파단의 경우에 비해 조대하였다. 조대하였다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.45-50
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• 2009

By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.6 no.2
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• pp.26-33
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• 2007

Social cost has been increased by traffic accident and congestion since early 1990s. The construction of roadways and railways has been suggested as countermeasures. However, ITS has finally introduced as a logical solution because the expenses of infrastructures are costly. The data collection field has developed through numerous researches and pilot projects. However the information provision field does need a lot of study. The traffic information broadcasting whether simple traffic information or the value-added information has been available via radio, television and internet which does not require tremendous investment compared with data collection stage. Therefore, this study reviews the suitability of the gadget service usually offered by window vista users which is the result of the development of technology and the changes of internet environment. It also suggests to using the RSS(Really Simple Syndication) manner as a basic method to provide the traffic information based on the needs of user in order to enhance the usability of traffic information. For this, this study analyzes the current methods and techniques of traffic information service which is widely available by local governments and companies and suggest possible changes and methods in order to provide Gadget-based service to the public.