• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2369-2371
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• 2005

MEMS 기술을 이용하여 마이크로 $H_2$ 가스센서를 제작하고 마이크로 히터의 열적 특성과 $H_2$ 가스 농도 변화에 따를 마이크로 가스센서에 대한 감도를 분석하였다. 마이크로 가스센서의 전압 인가에 따른 히터의 온도는 1.0V에서 $250-280^{\circ}C$의 고온 특성을 보였으며, 동작온도 $250^{\circ}C$에서 $H_2$ 가스는 $SnO_2/V_2O_5/Pd$의 감응물질을 도포한 센서의 반응이 우수한 특성을 확인하였다. 동작 온도 $250^{\circ}C$ $H_2$ 농도 5000ppm의 조건에서 $SnO_2/V_2O_5/Pd$의 감응물질을 도포한 가스센서에서 $H_2$ 흡착 반응 시간은 3sec이 탈착 반응 시간은 8-10sec의 결과를 보였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.12
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• pp.17-23
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• 2003

A sensor array (3${\times}$5$\textrm{mm}^2$ in diaphragm dimension) of 12 sensing clements with different operating temperatures was optimized with respect to thermal operation. This sensor array with single heater on a glass diaphragm over back-etched silicon bulk realizes a novel concept of a sensor array: an array of sensor clements operated at different temperatures can yield more information than single measurement. The proposed micro sensor array could provide well-integrated array structure because it had only single heater at the center of the diaphragm and used the various sensing properties of two kinds of metal oxide layers with various operating temperatures.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1010-1015
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• 2003

Bubble growth on microheater has been experimentally investigated in this study. The experiment was performed using platinum microheaters having dimensions of 300 ${\mu}m$ or 50 ${\mu}m$ in length, 20 ${\mu}m$ or 5 ${\mu}m$ in width, and $0.2{\pm}0.01$ ${\mu}m$ in thickness. A high speed video camera was used to observe bubble growth at 2,000 frames per second. Microheater temperature was measured at the rate of 300 Hz. with a data acquisition system. Bubble nucleation frequency increased with working fluid temperature. Although the slope of temperature drop was similar in all cases, the magnitude of temperature drop was different. The temperature profiles and the high speed camera images were combined to explain temperature drop.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1527_1528
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• 2009

떠 있는 열선 구조를 채택한 고온 구동 마이크로 MEMS 히터의 특성을 평가하고 분석하였다. 고온 MEMS 히터는 적외선을 이용한 광학식 가스센서의 주요한 핵심 부품인 적외선 발광원으로 활용할 수 있다. MEMS 기술을 이용하여 대량생산이 가능하여 가격을 낮출 수 있고 소비전력이 작아 적외선 센서의 광원으로 응용되는 등 관련 분야의 연구가 많이 이루어지고 있다. 본 논문에서는 실리콘 기판으로부터 떠 있는 실리콘 지지구조물 위에 형성된 백금 저항성으로 고온 발열 동작하는 새로운 구조의 MEMS 히터에 대한 온도 특성을 고해상도 적외선 카메라로 측정한 이미지를 이용하여 분석하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.91-92
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• 2012

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.57-64
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• 2007

New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of $150\;{\mu}m$, thickness of $0.8\;{\mu}m$, and total length of 12.15 mm was sputter-deposited on the $5\;mm{\times}5\;mm$ Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1909-1914
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• 2003

Bubble growth on microheater has been experimentally investigated in this study. The experiment was performed using platinum micro heaters having dimensions of $100{\times}10{\times}0.2{\mu}m^3$ with constant heat flux. A high speed video camera was used to observe bubble growth at 250 frames per second. Microheater temperature was measured at the rate of 300Hz with a data acquisition system. When heater temperature was $139^{\circ}C$ a bubble was nucleated in the liquid FC-72. The temperature profiles and the high speed camera images were combined to explain heat transfer and bubble growth on microheater.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1464-1469
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• 2004

In this study, micro square heaters having dimensions of $65{\times}65{\mu}m^2$and $100{\times}100{\mu}m^2$ were fabricated and bubble nucleation experiments on the heaters were performed. Bubble nucleation temperature was also measured using a bridge circuit and the photographs of bubble nucleation and subsequent growth were taken by a camera with a flash unit. Measured bubble nucleation temperatures were found to be closer to the superheat limit of working fluid (FC-72). Also quasi-1D analyses for the square heaters were performed. The quasi-1D analysis yielded proper temperature distribution of the square heater at steady state, however failed to predict the temperature rise up to the steady state. Similar time dependent temperature can be obtained with proper value of thermal diffusivity. For the $100{\times}100{\mu}m^2$ square heater, nucleation of several bubbles was observed while only one bubble was observed to be nucleated on $65{\times}65{\mu}m^2$ heater.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.225-228
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• 2007

Micro solid propellant thruster is the most feasible for development with current MEMS. Basic components of micro solid propellant thruster are diverging nozzle, micro igniter, combustion chamber, and solid propellant. Micro nozzles and micro chambers were fabricated using photosensitive glass by anisotropic wet etching technique. Micro Pt heaters on glass membrane which ignited solid propellant were developed. Components of thruster were integrated. Successful ignition was observed.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.23-27
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• 2017

This paper proposes an approach to predict the reliability of high temperature heaters by identifying their primary failure modes and mechanisms in the field. Test specimens were designed to have the equivalent stress conditions with the high temperature heaters in the field in order to examine the effect of stress conditions on the solder joint failures. There failures often result from cracking due to intermetallic compound (IMC) or void formation within a solder joint. Aging tests have been performed by exposing the test specimens to a temperature of $170^{\circ}C$ in order to reproduce solder joint failures in the field. During the test, changes in IMC formation were investigated by scanning electron microscopy (SEM) on the cross-sections of the test specimens, while changes in void formation were monitored both by resistance spectroscopy and by micro-computed tomography (microCT), alternately. The test results demonstrated the void volume within the solder increased as the time at the high temperature increased. Also, the phase shift of high frequency resistance was found to have high correlation with the void volume. These results implied the failure of high temperature heaters can be non-destructively predicted based on the correlation.