• 한국정밀공학회지
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• 제16권12호
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• pp.230-238
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

• 한국공작기계학회논문집
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• 제13권6호
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• pp.87-93
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• 2004

An experimental is carried out to investigate the characteristics of blanking for nickel alloy Alloy42 (t=0.203mm), a kind of IC lead frame material. By varying clearance between die and punch the shapes of shear profile are examined. Finite element analysis with element deletion algorithm for ductile fracture mode is also carried out to study the effect of clearance theoretically and to compare with experimental results. The rectangular shape specimen with four different comer radius is used to study the characteristics of blanking for straight side and comer region simultaneously. As the result the ratios measured k(m experiment of roll over, burnish and fracture zone based on initial blank thickness are compared with those of FE analysis. Both experiment and FE analysis show that the amount of mil over and fracture is increased as the clearance increases. When the radius of comer is less than thickness of blank it has been found that larger clearance is required than that of straight region in order to maintain same quality of shear profile at the comer region.

• 한국정밀공학회지
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• 제18권3호
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• pp.182-188
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• 2001

An experiment is carried out to investigate the characteristics of blanking for copper alloy C194 (t=0.254mm), a kind of IC lead frame material. By varying clearance between die and punch, the shapes of shear profile are examined. Finite element analysis with element deletion algorithm for ductile fracture mode is also carried out to study the effect of clearance theoretically and to compare with experimental results. The rectangular shape specimen with four different corner radius is used to study the characteristics of blanking for straight side and corner region simultaneously. As the result, the ratios measured from the experiment of roll over, burnish, and fracture zone based on intial blank thickness are compared with those of FE analysis. Both experiment and FE analysis show that the amount of roll over and fracture is increased as the clearance increases. It has been found that larger clearance is required than that of straight region when the radius of corner is less than thickness of blank, in order to maintain same quality of shear profile at the corner region.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 한국항행학회논문지
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• 제24권2호
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• pp.134-141
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• 2020

원격측정 시스템은 무인기, 위성 발사체 등의 비행체 개발과정에서 비행 데이터 수집과 모니터링을 위해 비행체 내 다양한 신호를 계측하여 지상으로 전송하는 통신시스템이다. 최근 무선통신 기술의 발전으로 비행 데이터의 전송 과정에서 일어날 수 있는 보안 위협에 대응하기 위해 원격측정 시스템의 암호화 기술 적용은 중요해지고 있다. 따라서 본 논문에서는 원격측정 시스템의 암호화 적용을 위해 국가 표준 암호 알고리즘인 ARIA-256의 적용 방법을 제안하고 구현하였다. 블록 오류 확산과 원격측정 프레임의 특성을 고려하여 CTR (counter) 모드를 응용하고, 위성통신 표준화 기구(CCSDS)에서 권장하는 리드솔로몬 코드를 적용할 수 있도록 프레임을 구성하여 암호화하였다. ARIA-256 알고리즘과 암호 프레임은 FPGA(filed programmable gate array)로 구현하였고 시뮬레이션과 하드웨어 검증 시스템을 통해 연속성 있는 프레임의 암호화를 확인하였다.

• 한국산학기술학회논문지
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• 제13권10호
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• pp.4378-4384
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• 2012

LED 칩 패키징에서 다이 본딩은 웨이퍼에서 분할된 다이를 리드 프레임에 접착제로 고정시켜 칩이 다음 공정을 견딜 수 있는 충분한 강도를 제공하는 중요한 공정이다. 본 논문에서는 PLCC 구조 LED 패키지 프레임에 소형 제너 다이오드를 부착하는 다이 본딩 공정능력의 최적화를 위하여 공정에 영향을 미치는 여러 인자를 분석하여 반응표면분석법을 적용하여 그 결과를 도출하였다. 인자를 분석하여 5인자 3수준 4반응치를 고려하여 실험계획법을 수립하였으며, 그 결과 모든 반응치의 목표를 만족하는 최적 조건을 확보할 수 있었다.

• 소성∙가공
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• 제11권2호
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• pp.132-137
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• 2002

Using the Taguchi method, optimum process condition of lead frame blanking has been determined in the point of view of shape of blanked profile. As the main process parameters, clearance, strip holding pressure and bridge width are selected. According to the orthogonal array table, three levels of experiment have been carried out for each factor. The optimal blanking condition is analyzed with the SN ratio. It has been verified that the optimal Process condition can be determined with a combination of basic blanking experiment and experiment design method. Both the effect of each factor and gain can be judged in the quantitative manner from the analysis of SN ratio.

• 대한기계학회논문집
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• 제18권3호
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 소성∙가공
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• 제15권6호
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• pp.428-435
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• 2006

IC leadframe needs precision shape for good efficiency. Friction conditions also have a significant impact on blanking deformation. Therefore, studying the friction produced by the tribology between die and materials becomes necessary. In this study, in order to measure mechanical properties and frictions for leadframe materials such as Ni alloys and coppers, tensile test and straight pulling friction test are executed. In particular, the effect of clearance on the blanking characteristics depending on friction coefficient is examined by finite element simulation. From the finite element simulation, the metal flow, side pressure of punch and crack initiation are evaluated according to the leadframe materials.