• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.12
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• pp.2885-2890
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• 2014

Localization of a sensor network node using machine learning has been recently studied. It is easy for Support vector machines algorithm to implement in high level language enabling parallelism. Raspberrypi is a linux system which can be used as a sensor node. Pi can be used to construct IP based Hadoop clusters. In this paper, we realized Support vector machine using python language and built a sensor network cluster with 5 Pi's. We also established a Hadoop software framework to employ MapReduce mechanism. In our experiment, we implemented the test sensor network with a variety of parameters and examined based on proficiency, resource evaluation, and processing time. The experimentation showed that with more execution power and memory volume, Pi could be appropriate for a member node of the cluster, accomplishing precise classification for sensor localization using machine learning.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.533-535
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• 2015

Recently bleak outside the city to find a peace of mind to education for children living in nature while enjoying the leisure life As more families there is growing interest in managing a farm on weekends grow crops by the weekend. However, due to the need for a weekend farm has a lot of information in order to receive pre-sale of farm experience and meets the conditions demanding application process simply weekend to participate in the farm program there is a difficulty. In this paper, in order to solve these problems and to develop a farm Sale and learning system using a public API to the smart phone applications. The system basically provides information and tips on growing farm so that you can easily get pre-sale and manage weekend farm Bulletin boards, albums, providing a play culture that can improve the learning ability of children with certain management functions to increase the degree of interest and participation in weekend farm.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.8 no.6
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• pp.483-490
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• 2015

There are many software reliability models that are based on the times of occurrences of errors in the debugging of software. It is shown that it is possible to do likelihood inference for software reliability models based on finite failure model and non-homogeneous Poisson Processes (NHPP). For someone making a decision about when to market software, the conditional failure rate is an important variables. The infinite failure model are used in a wide variety of practical situations. Their use in characterization problems, detection of outlier, linear estimation, study of system reliability, life-testing, survival analysis, data compression and many other fields can be seen from the many study. Statistical process control (SPC) can monitor the forecasting of software failure and thereby contribute significantly to the improvement of software reliability. Control charts are widely used for software process control in the software industry. In this paper, proposed a control mechanism based on NHPP using mean value function of Musa-Okumo and Power law type property.

• Journal of the Korea Society of Computer and Information
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• v.18 no.1
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• pp.21-29
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• 2013

The current software for creating and editing animation offers the possibility of dividing variable objects into layers. This paper suggests a method to render and edit each of right and left layer in the process of creating a 3D stereoscopic animation. It is possible to apply a variety of effects to left and right images and to adjust the gap of binocular parallax through this method so that wider variation of images and richer sense of depth can be produced. In addition, this method offers freedom of deleting and inserting an object, controlling size and position of the object and adjusting the gap of binocular parallax. Thus, new sense of depth can be obtained. This method shows the results to apply various effects on the 3D stereoscopic image and to reduce visual fatigue rather than the method to render simultaneously both of left and right layer.

• Journal of Digital Convergence
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• v.11 no.10
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• pp.679-687
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• 2013

Currently, we are living in the era of digital media that puts the technologies in front which is called digital. Based on the characteristic of 'de-materialistic', human senses have been extended more than ever and there is no exception on those influences. Even though the existence of media seriously brought the identity and value of the painting into a question after the emergence of analog photos, advent of digital photos are raising the wind of new paradigms and values creation more seriously than ever. Unlike analog photos of the past which go through chemical process, true nature of digital photo goes through the digital process which is represented by 0 and 1. This didn't bring the loss of the original, but rather brought the creation of the copy which excels the original through retouching and consequently, destroyed the traditional value which is referred as an original. Like this, digital photo image has aesthetics and value of existence which is differentiated from analog photo because it has essentially different structures and characteristics with analog photo.

• Journal of Digital Convergence
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• v.16 no.7
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• pp.55-62
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• 2018

American charter schools are independent public schools of choice, freed from rules but accountable for results. Charter schools have celebrated the 25th anniversary of its creation in 2017 and become part of landscape of public education in America. However, little research has been conducted on an individual charter school. This study aimed to examine the major factors of a successful charter school. A qualitative approach was employed. Seven one-hour in-depth interviews were conducted with semi-structured interview questions. And four teachers were participated. The conclusions are as follows: First, there is the combination of system and cultural factors as major successful factors of the Dayton Early College Academy. Second, system factors are the gateways and the advisory that is a twin at the charter school. The findings are considered to be applied for Korean educational settings and the implications can be used for policy development in Korea.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.23-31
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• 2019

In this study, we conducted numerical analyses using the Taguchi method and finite element method to calculate the thermal deformation of a printed circuit board and the effect of design factors on the thermal deformation. Analysis results showed that the thermal deformation of the panel had the strongest effect on the thermal deformation and shape of the strip and unit. In particular, the deformation in the z direction was larger than that in the xy-plane direction. The effect of design factors and the design conditions for reducing the thermal deformation of the panel and strip changed at the unit level. Therefore, it is recommended that panel-level thermal deformation must be controlled to reduce the final thermal deformation at the unit level because the thermal deformation of the strip strongly affects that of the unit.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.6
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• pp.375-381
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• 2019

Structural health monitoring to determine structural conditions at an early stage and to efficiently manage the energy requirements of buildings using systems that collects relevant data, is under active investigation. Structural monitoring requires cutting-edge technology in which construction, sensing, and ICT technologies are combined. However, the scope of application is limited because expensive sensors and specialized technical skills are often required. In this study, a Raspberry Pi module, one of the most widely used single board computers, a Lora module that is capable of long-distance communication at low power, and a high-performance accelerometer are used to construct a wireless edge computing system that can monitor building response over an extended time period. In addition, the Raspberry Pi module utilizes an edge computing algorithm, and only meaningful data is obtained from the vast amount of acceleration data acquired in real-time. The raw data acquired using Wi-Fi communication are compared to the Laura data to evaluate the accuracy of the data obtained using the system.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.1-7
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• 2010

Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at $430^{\circ}C$. The thickness of interfacial reaction layers with respect to the soldering time was also measured. After the reflow soldering, it was observed that a $(Cu,Ni)_2Sb$, a $Cu_4Sb$ intermetallic layer, and a haze layer, which is consisted of Bi and $Cu_4Sb$ phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest $Cu_4Sb$ interfacial layer, suppression of the interfacial growth was not observed.