• Title/Summary/Keyword: 레이저 가공시스템

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광소자 제작용 레이저 묘화 시스템 개발

  • 김정민;조성학;이응숙
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.123-123
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    • 2004
  • 최근에 급속히 성장하고 있는 광통신, 전자, 생명산업 등의 발전에 있어서 주목할 만한 경향중의 하나는 제품의 소형화 및 집적화라고 할 것이다. 현재 제조되고 있는 초정밀 미세 가공 부품 및 제조시스템은 반도체 공정에 기반을 두고 생산되고 있다. 반도체 공정은 기본적으로 웨이퍼 규모의 소형제품 제조에 최적화 되도록 제조시스템이 설계 및 제작되어 있다 그리고 광통신 분야에 사용되는 광기능성 소자는 벌크형 광부품 및 광섬유형 광부품 기술에서 평면 광도파로형(PLC) 광부품으로 발전되고 향후 평면 광도파로형 부품은 집적화되어 광IC화로 발전하고 있다.(중략)

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Interface between Robot and Scanner for Remote Laser Welding System Based on Time Synchronization (시간 동기화에 근거한 리모트 레이저 용접 시스템에서의 로봇과 스캐너 인터페이싱)

  • Kim, Jeong-Jung;Lee, Joon-Woo;Lee, Ju-Jang;Kwon, Kyung-Up;Kang, Hee-Shin;Suh, Jeong
    • Laser Solutions
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    • v.16 no.1
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    • pp.10-14
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    • 2013
  • Remote laser beam welding (RLW) has the benefits of high speed and high quality welding, especially as applied to automotive industry. RLW is designed in a way that end effecter and head of scanner move simultaneously, and require the compensation for the motion of end effecter in order to weld proper position. In this paper, we show the algorithms of RLW that enable the end effecter to synchronize with scanner based on time. The proposed method consists of two algorithms. These algorithms make it possible for the moving end effecter to weld on desired place. The effectiveness of the algorithms is shown by experiments.

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Development of Auto Positioning Laser System by using Image Measurement Data (영상 측정 데이터를 이용한 위치보정 레이저 가공시스템 개발)

  • Pyo, Chang-Ryul
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.3
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    • pp.36-40
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    • 2013
  • Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

Operating System Design of Multi Beam Control System with Miniaturized Electron Beam Columns (초소형 전자빔을 이용한 멀티 전자빔 운영 시스템 설계)

  • Lim, Sun Jong;Kim, Ho Seob
    • Laser Solutions
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    • v.18 no.4
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    • pp.12-16
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    • 2015
  • The research on multi electron beam systems is being carried out by various methods. We are studying multi electron beam system using miniaturized electron beam columns. The column consists of electrostatic lenses, electrostatic deflector and tip emitter. Our operating system controls 4 column array, captures images of each column and maintains the instrument. We present the usefulness of our operating system for multi columns by capturing images of each column.

Analysis of Cutting Characteristic of the Sapphire Wafer Using a Internal Laser Scribing Process for LED Chip (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 가공 특성 분석)

  • Song, Ki-Hyeok;Cho, Yong-Kyu;Kim, Byung-Chan;Kang, Dong-Seong;Cho, Myeong-Woo;Kim, Jong-Su;Ryu, Byung-So
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.9
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    • pp.5748-5755
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    • 2015
  • Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

Development of laser tailored blank weld quality monitoring system (레이저 테일러드 블랭크 용접 품질 모니터링 시스템 개발)

  • 박현성;이세헌
    • Laser Solutions
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    • v.3 no.2
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    • pp.53-61
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    • 2000
  • On the laser weld production line, a slight alteration of the welding condition produces many defects. The defects are monitored in real time, in order to prevent continuous occurrence of defects, reduce the loss of material, and guarantee good quality. The measurement system is produced by using three photo-diodes for detection of the plasma and spatter signal in CO$_2$ laser welding. For high speed CO$_2$ laser welding, laser tailored welded blanks for example, on-line weld quality monitoring system was developed by using fuzzy multi-feature pattern recognition. Weld qualities were classified optimal heat input, a little low heat input, low heat input, and focus misalignment, and final weld quality were classified good and bad.

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- Car Body Welding by $CO_2$ Remote Welding System- (($CO_2$ 레이저 원격용접 시스템을 이용한 차체용접)

  • Yeum, Jung-Whan;Lee, Heui-Bom;Jeong, Chang-Ho;Cho, Yong-Joon;Park, Hee-Kue
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2005.11a
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    • pp.7-10
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    • 2005
  • Nowadays, most automotives companies are making use of laser welding in car body assembly shop. But even though laser welding is better than resistance spot welding in many points, its application has been limited to special technology for manufacturing. The paper introduces in the field of remote welding system(RWS) to improve the process efficiency of laser welding. Positioning time of RWS between welding stitches are dramatically reduced to zero. It is a kind of solutions to generalize laser welding in mass production.

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Development of Nd-Yag Laser Marking System for Cylinderical Parts (Nd-Yag 레이저를 이용한 원통 형상 표면 마킹 시스템 개발)

  • Lee, Se-Han;Kang, Jae-Gwan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.5
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    • pp.70-75
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    • 2010
  • In this paper, laser marking systems dedicated to cylinderical parts was developed. We first develop the marking device which consists of Nd-Yag laser, galvano scanner and additional rotational axis, then develop algorithm for supporting the digital image with bmp data format. Additional rotational axis is so attached as to rotate the cylinderical parts for marking its whole surface. The image is separated into line by line and the separated line image is sent to galvano scanner while rotating the additional axis simultaneously. CxImage library, famous open source code, is employed for the image processing. The developed method was tested with various images and shows that it reduces marking time significantly without reducing marking quality.

The Technology of Laser Welding System Controller (고출력 레이저 용접 시스템 제어기술)

  • 김도열;최흥근;유석준;이승태
    • Journal of Welding and Joining
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    • v.14 no.3
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    • pp.20-28
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    • 1996
  • 고밀도 에너지를 열원으로 이용하는 고출력 레이저로는 CO$_{2}$레이저와 Nd;YAG 레이저가 있다. 레이저는 열가공임에도 불구하고 빔의 스폿경을 작게하여 높은 에너지 밀도($10^{6}$ W/cm$_{2}$ 이상)을 얻을 수 있으므로 열영향이 작고 작은 변형범위내에서 용접을 할 수 있고 입력 에너지의 제어성이 좋아서 미세한 용접이 가능하게 하고, 빔폭 대비 용입깊이가 커서 깊은 용접 비드가 형성되며, 자동화가 용이하다는 장점이 있다. 특히 Nd;YAG 레이저의 경우는 광 섬유를 이용하므로서 에너 지의 시간 분할 및 에너지 분할을 할 수 있는 등 분기 및 배치가 용이하며 펄스의 활 용을 극대화 할 수 있는 장점이 있다. 그러나, 결점으로도 맞대기 용접의 경우 갭의 여유가 판두께, 초점위치, 빔모드에 따라 변화하는데 이는 빔 스폿이 작음에 따른 장점이 단점으로 작용하는 경우이다. 레이저 용접부의 비드 폭이 좁기 때문에 인장 강도가 모재의 인장강도보다 밑도는 것도 겹쳐서 용접된 이음 부분의 인장강도에 있 어서 단점이 되고 있다.

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