• Title/Summary/Keyword: 랜덤진동

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Random Vibration Analysis of Control Element Assembly Shroud (제어봉집합체 보호구조물의 랜덤진동해석)

  • 정명조;김범식
    • Computational Structural Engineering
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    • v.9 no.1
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    • pp.47-54
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    • 1996
  • The Control Element Assembly(CEA) shroud is one of the most important components in the reactor vessel internals for the nuclear power plant. Because of the severe modification from its original design the structural integrity of this component has been questioned. In an attempt to resolve this question, the response of the CEA shroud to a random loading in the actual operating condition is calculated analytically and experimentally and compared to the code allowables to show that it is structurally adequate and acceptable for the long term operation.

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자이로 랜덤워크가 초기정렬에 미치는 영향에 대한 연구

  • Yu, Gi-Jeong;Kim, Cheon-Jung;Kim, Hyeon-Seok;Park, Heung-Won
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • v.2
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    • pp.459-462
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    • 2006
  • 스트랩다운 관성항법장치에 사용되는 대표적인 광학식 자이로인 링레이저 자이로(Ring Laser Gyro ; RLG)는 회전체가 없어 기존의 기계식 자이로가 가지고 있던 g-sensitive 오차가 발생하지 않지만 RLG 내부에 부착되어 링레이저를 반사시키는 기능을 하는 반사경의 산란에 의해 일정 크기의 작은 입력 각속도를 측정하지 못하는 lock-in이 발생한다. 이러한 lock-in을 제거하기 위해 정현파 진동을 RLG 몸체에 인가하며 이 진동에 의하여 자이로 출력에 랜덤워크 성분이 유발되어 RLG 성능저하의 원인이 된다. 본 논문에서는 RLG 랜덤워크에 의한 관성항법장치의 초기정렬 기법에 따른 초기정렬 성능을 분석하고 이에 대한 시뮬레이션 결과를 제시한다.

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Random Vibration and Harmonic Response Analyses of Upper Guide Structure Assembly to Flow Induced Loads (유체유발하중을 받는 상부안내구조물의 랜덤진동 및 조화응답해석)

  • 지용관;이영신
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.15 no.1
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    • pp.59-68
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    • 2002
  • The cylindrical Upper Guide Structure assembly of the reactor intervals wish the Core Support Barrel and the Inner Barrel Assembly is subjected to flow induced loads horizontally which include random pressure fluctuation due to turbulent flow and pump pulsation pressures. The purpose of this papers is to perform random vibration and harmonic response analyses fort flow induced loads. The dynamic response characteristics due to random turbulence and pump pulsation loads were evaluated using the lumped mass beam model. Especially the model considered the annulus effects due to water gaps existing between cylindrical structures such as the Upper Guide Structure Barrel, the Core Support Barrel, and the Inner Barrel Assembly. The effect of the Inner Barrel Assembly inside the Upper Guide Structure assembly was studied. The peak dynamic responses lot each loading condition due to the addition of IBA were affected by the natural frequencies of the structures. Therefore the peak dynamic responses of the structures should be conservatively obtained from evaluation of dynamic analysis for various loading conditions.

Location-dependent Reliability of Solder Interconnection on Printed Circuit Board in Random Vibration Environment (랜덤진동환경에서 솔더접합부의 인쇄회로기판내 위치에 따른 내구수명 변화 연구)

  • Han, Changwoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.1
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    • pp.45-50
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    • 2014
  • A vibration test coupon is prepared with nine plastic ball grid array packages on a printed circuit board using SnPb solders, and a random vibration test is conducted on the coupon. Life data from the test are analyzed, and it is shown that over the board, life data is location-dependent. For investigating this location dependency, a finite element model is developed and the equivalent stresses, which are defined based on the stress response functions at each node, are investigated. It is shown that one of the corner solder balls has the maximum equivalent stress at a package during the test. Finally, it is demonstrated that the maximum equivalent stress and durability life are inversely proportional.

Analysis of Transportation Vibration for Truck-Mounted Special Equipments via FEM and Experiments (유한요소법 및 실험을 이용한 트럭 탑재 특수 장비의 주행진동 해석)

  • Song, Oh-Seop;Lee, Hak-Yeol
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.19 no.10
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    • pp.1083-1091
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    • 2009
  • Modern military equipments are tend to be mounted on a movable truck for their survivability and operation performance. Special units and electronic equipments installed on the truck experience the vibration caused by road roughness during their transport. The level of the transportation vibration is affected by both road conditions and vehicle speeds. In this paper, various experiments on the vibration characteristics of the equipment are carried out via road tests. Transportation vibration is also investigated by numerical analysis using FEM, and natural frequencies and random responses of the launcher are obtained. The PSD and RMS values of acceleration of the equipment are predicted and compared with test results.

Vibration and Shock Measurement of KSLV-I Kick Motor on the Ground Test (KSLV-I 킥 모터 지상연소시험에서의 진동 및 충격 계측)

  • Oh, Jun-Seok;Kim, Jeong-Yong;Roh, Woong-Rae;Eun, Hee-Kwang;Im, Jong-Min;Moon, Sang-Mu
    • Aerospace Engineering and Technology
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    • v.8 no.2
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    • pp.98-104
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    • 2009
  • A solid kick motor is used for propulsion system of KSLV-I 2nd stage. During combustion of the kick motor, vibration and shock could be generated. And it could be transferred to the vehicle equipment bay through the kick motor body. If vibration and shock transferred to the vehicle equipment bay are considerable, electrical equipments could be disordered. Therefore we need to verify influence of vibration and shock caused by combustion of the kick motor. In this research, we measured vibration of the kick motor on the ground firing test. Based on this measurement data, we analyzed random vibration and shock response spectrum.

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Structural Reliability Evaluation on Solder Joint of BGA and TSSOP Components under Random Vibration using Reliability and Life Prediction Tool of Sherlock (신뢰성 수명예측 도구 Sherlock을 활용한 랜덤진동에서의 BGA 및 TSSOP 솔더 접합부의 구조 신뢰성 평가)

  • Park, Tae-Yong;Park, Jong-Chan;Park, Hoon;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.45 no.12
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    • pp.1048-1058
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    • 2017
  • One of the failure mechanism of spaceborne electronics is a fatigue fracture on solder joint under launch random vibration. Thus, a necessity of early diagnosis through the fatigue life evaluation on solder joint arises to prevent such potential risk of failure. The conventional life prediction methods cannot assure the accuracy of life estimation results if the packaging type changes, and also requires much time and effort to construct the analysis model of highly integrated PCB with various packaging types. In this study, we performed life prediction of PCB based on a reliability and life prediction tool of sherlock as a new approach for evaluating the structural reliability on solder joint, and those prediction results were validated by fatigue tests. In addition, we also investigated an influence of solder height on the fatigue life of solder joint. These results indicated that the Sherlock is applicable tool for evaluating the structural reliability of spaceborne electronic.