Browse > Article
http://dx.doi.org/10.3795/KSME-A.2014.38.1.045

Location-dependent Reliability of Solder Interconnection on Printed Circuit Board in Random Vibration Environment  

Han, Changwoon (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.38, no.1, 2014 , pp. 45-50 More about this Journal
Abstract
A vibration test coupon is prepared with nine plastic ball grid array packages on a printed circuit board using SnPb solders, and a random vibration test is conducted on the coupon. Life data from the test are analyzed, and it is shown that over the board, life data is location-dependent. For investigating this location dependency, a finite element model is developed and the equivalent stresses, which are defined based on the stress response functions at each node, are investigated. It is shown that one of the corner solder balls has the maximum equivalent stress at a package during the test. Finally, it is demonstrated that the maximum equivalent stress and durability life are inversely proportional.
Keywords
Random Vibration Test; Solder Interconnection; Durability Life;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Wong, T., Reed, B., Cohen, H. and Chu, D., 1999, "Development of BGA Solder Joint Vibration Fatigue Life Prediction Model," Proc. 1999 Electronic Components and Technology Conference, pp. 149-154.
2 Gu, J., Barker, D. and Pecht, M., 2007, "Prognostics Implementation of Electronics Under Vibration Loading," Microelectronics Reliability, Vol. 47, No. 12, pp. 1849-1856.   DOI   ScienceOn
3 Liu, X., Sooklal, V., Verges, M. and Larson, M., 2006, "Experimental Study and Life Prediction on High Cycle Vibration Fatigue in BGA Packages," Microelectronics Reliability, Vol. 46, No. 7, pp. 1128-1138.   DOI   ScienceOn
4 Wong, S., Malatkar, P., Rick, C., Kulkarni, V. and Chin, I., 2007, "Vibration Testing and Analysis of Ball Grid Array Package Solder Joints," Proc. 2007 Electronic Components and Technology Conference, pp. 373-380.
5 Yu, D., Al-Yafawi, A., Nguyen, T., Park, S., and Chung, S., 2011, "High-Cycle Fatigue Life Prediction for Pb-Free BGA Under Random Vibration Loading," Microelectronics Reliability, Vol. 51, No. 3, pp. 649-656.   DOI   ScienceOn
6 IPC, 1992, IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
7 IEC, 1993, IEC 60068-2-64 Environmental Testing Part 2 : Test Methods Test Fh: Vibration, Broad-Band Random (Digital Control) and Guidance.
8 Kumar, S. M., 2008, "Analyzing Random Vibration Fatigue," ANSYS Advantage, Vol. 2, No. 3, pp. 39-42.
9 Han, C.-W., Oh, C., Hong, W., 2012, "Prognostics Model Development of BGA Assembly Under Vibration Environment," IEEE Trans. Comp. Pack. Manu. Tech., Vol. 2, No. 8, pp. 1329-1334.   DOI   ScienceOn
10 Ma, H. and Suhling, J. C., 2009, "A Review of Mechanical Properties of Lead-free Solders for Electronic Packaging," J. Mater. Sci., Vol. 44, No. 5, pp. 1141-1158.   DOI
11 Grieu, M., Massiot, G., Maire, O., Chaillot, A., Munier, C., Bienvenu, Y. and Renard, J., 2008, "Durability Modeling of a BGA Component Under Random Vibration," Proc. 9th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiment in Micro-Electronics and Micro-Systems, pp. 1-8.
12 www.matweb.com