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http://dx.doi.org/10.5139/JKSAS.2017.45.12.1048

Structural Reliability Evaluation on Solder Joint of BGA and TSSOP Components under Random Vibration using Reliability and Life Prediction Tool of Sherlock  

Park, Tae-Yong (Department of Aerospace Engineering, Chosun University)
Park, Jong-Chan (Korea Aerospace Research Institute(KARI))
Park, Hoon (Danam Systems Inc.)
Oh, Hyun-Ung (Department of Aerospace Engineering, Chosun University)
Publication Information
Journal of the Korean Society for Aeronautical & Space Sciences / v.45, no.12, 2017 , pp. 1048-1058 More about this Journal
Abstract
One of the failure mechanism of spaceborne electronics is a fatigue fracture on solder joint under launch random vibration. Thus, a necessity of early diagnosis through the fatigue life evaluation on solder joint arises to prevent such potential risk of failure. The conventional life prediction methods cannot assure the accuracy of life estimation results if the packaging type changes, and also requires much time and effort to construct the analysis model of highly integrated PCB with various packaging types. In this study, we performed life prediction of PCB based on a reliability and life prediction tool of sherlock as a new approach for evaluating the structural reliability on solder joint, and those prediction results were validated by fatigue tests. In addition, we also investigated an influence of solder height on the fatigue life of solder joint. These results indicated that the Sherlock is applicable tool for evaluating the structural reliability of spaceborne electronic.
Keywords
Spaceborne Electronics; Random Vibration; Structural Reliability; Fatigue Life; Solder Joint;
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1 Oh, H. U., Jeon S. H., and Kwon, S. C., "Structural Design and Analysis of 1U Standardized STEP Cube Lab for On-Orbit Verification of Fundamental Space Technologies", International Journal of Materials, Mechanics and Manufacturing, Vol. 2 No. 3, 2014, pp. 239-244.   DOI
2 Steinberg, D. S., Vibration Analysis for Electronic Equipment, Wiley-Interscience Publication, New York, 2000
3 Kim, Y. K, and Hwang, D. S., "PBGA Packaging Reliability Assessments under Random Vibrations for Space Applications", Microelectronics Reliability, Vol. 55 No. 1, 2015, pp. 172-179.   DOI
4 Lee, S. S., Park, T. W., Seo, J. H., Han S. W., and Kim, S. H., "Structural Vibration Analysis of Electronic Equipment for Satellite under Launch Environment", Key Engineering Materials, Vols. 270-273, 2004, pp. 1440-1445.   DOI
5 Yu, D., Al-Yafawi, A., Nguyen, T. T., Park S., and Chung, S., "High Cycle Fatigue Life Prediction for Pb-free BGA under Random Vibration Loading", Microelectronics Reliability, Vol. 51, 2011, pp. 649-656   DOI
6 Mathew, S., Das, D., Osterman, M., and Pecht, M., "Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads", Journal of the Institute of Environmental Sciences and Technology, Vol. 50 No. 1, 2007, pp. 86-97
7 Cinar, Y., Jang, J., Jang, G., Kim, S., and Jang, J., "Effect of Solder Pads on the Fatigue Life of FBGA Memory Modules under Harmonic Excitation by using A Global-local Modeling Technique", Microelectronics Reliability, Vol. 53, 2013, pp. 2043-2051   DOI
8 http://www.dfrsolutions.com/
9 G. Caswell, "17 Equations That Changed the World-There's More Than That!!! Part-1", http://www.dfrsolutions.com/hubfs/17-Equations-that-Changed-the-World-Part-II.pdf?t=1493389984552
10 Joint IPC/JEDEC Standards(IPC/JEDEC-9704A): Printed Circuit Assembly Strain Gage Test Guideline
11 IPC Standards(IPC-9701A), Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
12 IPC Standards(IPC-SM-785), Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
13 Qi, H., Plaza, G., Ganesan, S., Osterman, M., and Pecht, M., "Reliability Assessment on Insertion Mount Assembly under Vibration Conditions," Proceedings of 57th IEEE Electronic Components and Technology Conference, 2007, pp. 407-414
14 Lau, J. H., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, D. Love, Menis, I., and Sullivan, B., "Reliability Testing and Data Analysis of Lead-Free Solder Joints for High-density Packages," Soldering & Surface Mount Technology, Vol. 16 No. 2, 2004, pp. 46-68.   DOI