• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.65-68
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• 2007

저온 플라즈마 기술을 이용하면 오스테나이트계 스테인리스강의 내식성과 표면경도를 동시에 증가 시킬 수 있다. 여러 가지 처리방법 중 질탄화와 2-step 공정으로 처리한 AISI304L강의 표면을 분석하였다. 처리한 모든 시편의 표면은 expanded austenite(${\gamma}_N$)이 형성되었고, 표면 경도도 모재보다 약 4배 이상 증가 하였다. 저온플라즈마 질탄화 공정의 경우 경화층의 두께가 최대 15 ${\mu}m$밖에 형성되지 않았지만 2-step공정의 경우 질탄화 공정보다 짧은 시간으로 약 2배의 경화층을 얻을 수 있었다. 두 가지 공정 모두 온도와 시간이 증가할수록 경화층의 두께가 두꺼워졌지만, 과도하게 높은 온도와 긴 공정시간은 석출물을 형성 시켰다. 석출물이 형성되지 않은 시편의 경우 내식성이 증가하였다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• The Transactions of the Korean Institute of Power Electronics
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• v.16 no.6
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• pp.554-560
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• 2011

Single-frequency induction heating equipment caused by a hardening heat treatment process of the double investment in the issue and allow the heat treatment process in order to shorten the time from one process to work simultaneously on two kinds of processes that allow Simultaneous Dual Frequency(SDF) drive scheme technology are described. In this paper, we propose a dual way to drive a simultaneous dual-frequency drive scheme has been implemented. Through simulations and experiments, we can obtain the validity of the proposed inverter for dual-frequency control and power control.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Composites Research
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• v.24 no.5
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• pp.23-28
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• 2011

In this paper, the bonding strengths of co-cured T800 carbon/epoxy composite-aluminum single lap joints with and without additional pressures were investigated using the pressure information induced by the fiber tension during a filament winding process. The specimens of all the tests were fabricated by an autoclave vacuum bag de-gassing molding being controlled forming pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa including vacuum). A special device which can act uniform additional pressures on the joining part of the single lap joint specimen was designed to measure the bonding strengths of composite-aluminum liners of type III hydrogen pressure vessel fabricated by a filament winding process. After the three different additional pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa) were applied to the specimens the effect of the additional pressures on the bonding strengths of the co-cured single-lap joints were evaluated.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.5
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• pp.475-484
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• 2020

Individual curing process of each layer in two resin composites can be caused the separation between two layers. In this study, co-curing process for two resin composites is suggested to improve the inter-layer bonding. Glass fiber reinforced composites with phenolic and epoxy resins were manufactured by co-curing process, and several types of glass/phenolic composites were considered to confirm the application on two resin composites. Experiments for smoke resistance, scratch resistance and flexural strength were carried out to verify requirements corresponding to thermal and mechanical environments. It was validated that two resin composites with phenolic resin impregnated prepreg exhibits good thermal and mechanical characteristics, and it can serve as highly effective composite structures in aerospace and many industry areas.

• Composites Research
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• v.31 no.4
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• pp.139-144
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• 2018

Long Fiber-reinforced composites have advantages of excellent production efficiency and formability of complex shapes compared to conventional continuous fiber reinforced composite materials. However, if we need to make complicated composite shapes or to assemble parts made of different materials, a variety of joining methods are needed. In general, long fiber prepreg sheet (LFPS) contains mold release agent to facilitate demolding after thermoforming. Therefore, mechanical fastening is required in addition to the adhesive bonding to get proper joining strength. In this study, we proposed a stainless steel insert for co-cure bonding which cures LFPS and bonds the stainless steel insert through thermoforming process. The wing of the insert which is spread during the thermoforming process induces adhesion and mechanical wedging effect and serves as a hook to resist the pulling force. The burn-out method was used to confirm the unfolded state of the stainless steel insert wings inserted into the composite material. The static pull-out test was performed to quantitatively evaluate the joining strength. From these experimental results, the condition which guarantees the most appropriate joining strength was derived.

• Journal of Korea Foundry Society
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• v.28 no.1
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• pp.41-44
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• 2008

레오다이캐스팅 공정은 용탕상태의 원소재로부터 최종형상에 가장 가까운 정형제품(near-net shape)을 원하는 기계적 성질과 동시에 경제적으로 생산할 수 있는 제조방법으로 개발되어 왔다. 본 논문에서는 전자교반 시스템을 이용하여 결정립이 제어된 반용융 상태의 소재를 수직형 다이캐스팅기를 사용하여 리어파트(rear parts) 자동차 부품을 성형실험 하였다. 성형된 시제품들은 성형조건에 따른 조직 및 인장강도를 관찰하였으며, 시효경화 시간에 따른 T6 최적 열처리 조건을 조사하였다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.12
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• pp.975-986
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• 2013

This paper dealt with the fabrication and performance evaluation of the electronics housing made of lightweight composite materials, aiming at the enhancement of satellite mass savings by replacing conventional aluminum alloy widely used for satellite avionics with lightweight composite material. For this purpose, a fabrication process was designed to overcome low machinability of CFRP and to minimize the post-treatment. The composite housing with grid-stiffened and monolithic frame was made using co-curing method. Its performance was also evaluated regarding endurance, stiffness, thermal conductivity, electrical grounding, EMI protection and radiation shielding. The composite housing can provide the considerable mass savings over the aluminum housing with same dimension.