• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.5-8
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• 2002

The use of the co-cured joining method for composite structures is attractive due to several benefits. However, since the design stress level in cyclic loads is often smaller than the joint strength obtained from the static tensile load test, it is important to establish proper fatigue design criteria. Although some researchers have reported on co-cured joints, there are only a few papers published on the fatigue characteristics of co-cured joints. In this paper, the effect of bond parameters on the fatigue characteristics of a steel-composite co-cured double lap joint under cyclic tensile loads was experimentally investigated. We considered the surface roughness of the steel adherend and the stacking sequence of the composite adherend as bond parameters. A fatigue failure mechanism of the co-cured double lap joint was explained systematically by investigating the surfaces of failed specimens.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.83-87
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• 2004

In this work, the cure cycle of co-cured metal/composite structure was investigated to decrease fabricating thermal residual stresses between the metal and the composite material. DSC (Differential scanning calorimetry) experiment and static lap shear test of co-cured aluminum/composite double lap joint as well as the curvature experiment of co-cured steel/composite strip were performed to investigate the effect of curing cycle on the thermal residual stress of co-cured hybrid structures. From the experiments, it was found that post curing method after abrupt cooling of co-cured aluminum/composite hybrid structure at certain point of degree of cure during curing process could eliminate fabricating the thermal residual stresses.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.5
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• pp.475-484
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• 2020

Individual curing process of each layer in two resin composites can be caused the separation between two layers. In this study, co-curing process for two resin composites is suggested to improve the inter-layer bonding. Glass fiber reinforced composites with phenolic and epoxy resins were manufactured by co-curing process, and several types of glass/phenolic composites were considered to confirm the application on two resin composites. Experiments for smoke resistance, scratch resistance and flexural strength were carried out to verify requirements corresponding to thermal and mechanical environments. It was validated that two resin composites with phenolic resin impregnated prepreg exhibits good thermal and mechanical characteristics, and it can serve as highly effective composite structures in aerospace and many industry areas.

• Composites Research
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• v.31 no.1
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• pp.17-22
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• 2018

Long Fiber Prepreg Sheet (LFPS) has the advantages of excellent production efficiency and formability for complex shapes compared to conventional continuous fiber reinforced composites. When fibrous composites are used with different materials, joining method is important because strength of the joining part determines the strength of the hybrid structure. In this study, the adhesive joint strengths of co-cured LFPS and aluminum were evaluated under various surface treatment conditions and environmental conditions (temperature and moisture conditions). Mechanical abrasion and plasma exposure were used for the surface treatment. The adhesive joints experienced various surface treatments were tested by using single lap joint specimens. Adhesive strengths under various conditions were compared and the most appropriate condition was determined.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.65-68
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• 2007

저온 플라즈마 기술을 이용하면 오스테나이트계 스테인리스강의 내식성과 표면경도를 동시에 증가 시킬 수 있다. 여러 가지 처리방법 중 질탄화와 2-step 공정으로 처리한 AISI304L강의 표면을 분석하였다. 처리한 모든 시편의 표면은 expanded austenite(${\gamma}_N$)이 형성되었고, 표면 경도도 모재보다 약 4배 이상 증가 하였다. 저온플라즈마 질탄화 공정의 경우 경화층의 두께가 최대 15 ${\mu}m$밖에 형성되지 않았지만 2-step공정의 경우 질탄화 공정보다 짧은 시간으로 약 2배의 경화층을 얻을 수 있었다. 두 가지 공정 모두 온도와 시간이 증가할수록 경화층의 두께가 두꺼워졌지만, 과도하게 높은 온도와 긴 공정시간은 석출물을 형성 시켰다. 석출물이 형성되지 않은 시편의 경우 내식성이 증가하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1313-1314
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• 2013

• Journal of Periodontal and Implant Science
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• v.33 no.3
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• pp.331-340
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• 2003

본 연구의 목적은 인간의 동맥경화증에서 Porphyromonas gingivalis (P. gingivalis)와 인체 열충격단백 60의 T-세포 및 교차성 B-세포 epitope를 규명하고 수립된 T-세포주의 T-세포 주요조직적합체 양상을 파악하려는 데 있다. P. gingivalis 열충격단백-반응성 T 세포주와 환자의 혈청을 이용하여 P. gingivalis 열충격단백60 분자를 구성하는 104개의 중복성 합성 펩타이드의 T-세포 epitope과 B-세포 epitope을 규명하였다. 인체 열충격단백60에 대한 B-세포 epitope도 같은 방법으로 파악하였다. P. gingivalis, P. gingivalis 열충격단백60 또는 인체 열충격단백60에 대한 IgG 항체는 모든 동맥경화증 환자에서 상승하였다. P. gingivalis 열충격단백60의 3, 15, 24, 33, 45, 53, 64, 84, 88, 99번 펩타이드가 주요한 T-세포 epitope였고 이것들은 T-세포 및 B-세포 공동 epitope이기도 했다. 또한 인체 열충격단백60 교차반응 B-세포 epitope은 15, 29, 53, 56, 69, 74번 펩타이드로 판명되었다. 대부분 환자의 주요조직적합체는 $HLA-DRB1^{\ast}1504$와 $HLA-DZB1^{\ast}0603$으로 나타났다. 결론적으로 P. gingivalis 열충격단백60은 제 2급 주요조직적합제-제한적으로 분해되고 전달되었으며 이 단백질이 공통적인 T-세포 및 B-세포 epitope를 가지면서 동시에 인체 열충격단백60과 교차성 B-세포 epitope을 가지면서 동맥경화증의 면역조절기능에 관여한다고 볼 수 있다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.