• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.99-102
• /
• 2000

Via for achieving reliable fabrication of MCM-D substrate was formed on the photosensitive BCB layer. MCM-D substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in photosensitive BCB layer, the process of BCB and plasme etch using $C_2$F$_{6}$ gas were evaluated. The thickness of BCB after soft bake was shrunk down to 60% of the original. AES analysis was done on two vias, one is etched in $C_2$F$_{6}$ gas and the other is non etched. On via etched in $C_2$F$_{6}$, native C was detected and the amount of native C was reduced after Ar sputter. On via non etched in $C_2$F$_{6}$, organic C was detected and amount of organic C was reduced a little after Ar sputter. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable via.ble via.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.8
• /
• pp.3735-3740
• /
• 2012

In this paper, the performance of power generation for the energy harvesting block with a combination of piezoelectric technology and electromagnetic technology among various energy harvesting technologies was investigated. The goal of this study is to evaluate on the applicability of our developed energy harvesting block into the field of urban & housing. First, we carried out a finite element vibration analysis and evaluated the performance of power generation for the multi-layer energy harvester at laboratory scale. Second, we described the features of our developed prototype module that includes amplification technologies to improve power density per module and evaluated the performance of power generation for the energy harvesting block in a variety of ways. Finally, we suggested the direction for the improvement of the energy harvesting block module.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.1
• /
• pp.19-25
• /
• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.61-68
• /
• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.

• Proceedings of the Korea Water Resources Association Conference
• /
• 2008.05a
• /
• pp.2179-2183
• /
• 2008

지금까지 분포형 모형 개발에 대한 많은 노력이 있음에도 불구하고 여러 제약사항들에 의해 잠재력을 보여주는 정도로 활용되어 왔으나, 최근 급속도로 발전하는 컴퓨터의 계산능력, DEM 등 디지털정보의 구축이 진행되어 오고 있고, GIS 및 인공위성 영상기법의 발달로 공간적인 비균질성을 고려하여 유출과정에서 운동역학적인 이론을 기반으로 물의 흐름을 수리학적으로 추적해 나가는 물리적기반의 분포형 유출모형의 활용도가 높아지고 있다. 본 모형개발에 있어 이론적 배경이 된 모형은 1998년부터 일본 교토대학 방재연구소 코지리 연구실에서 개발 중인 Hydro-BEAM으로 유역 물순환의 건전성을 평가하기 위하여 장기간의 유역 내 유량, 수질을 시계열 및 공간적으로 파악하여 유역의 영향평가를 위해 개발된 물리적 기반의 격자구조를 가진 분포형 장기유출 모형이다. 유출량 계산은 유역내 수평 유출량산정 모듈로서 평면 분포형의 격자형을, 연직 분포형으로는 $A{\sim}B$층의 수평유출량은 하천으로 유입하고, C층은 하천유량에 영향을 미치지 않는 지하수층으로 가정하는 다층모형을 이용해서 A층, 지표 및 하도흐름은 운동파 법(kinematic wave)으로, $B{\sim}C$층의 유출량은 선형저류법으로 계산하는 모형이다. 본 연구에서는 격자흐름방향을 4방향에서 8방향으로 개선하였고, 모형의 각종 수문매개변수들을 GIS와 연계하여 직접 입력할 수 있도록 하였으며, 물리적기반의 침투과정을 모의할 수 있도록 Green & Ampt모듈을 추가하고, 향후 레이더 강우 및 수치예보강우의 홍수유출예측을 염두에 두고 격자강우량을 활용할 수 있도록 하는 등 홍수유출해석을 위한 분포형 강우-유출모형으로 개선 하였고, 이를 남강댐유역에 적용해 봄으로써 모형의 적용성을 검토해 보고자 하였다. 홍수기동안의 지표흐름과 지표하 흐름의 시간적 변화와 공간적 분포를 모의할 수 있었으며, 전처리과정으로서 ArcGIS 혹은 ArcView등의 GIS 프로그램을 이용하여 모형에 필요한 ASCII형태의 입력 매개 변수 자료들을 가공하였다. 또한 후처리과정으로서 모형의 수행결과인 유역내의 유출량 분포 등을 GIS상에서 나타낼 수 있도록 ASCII형태로 출력하도록 구성하였다. 남강댐유역을 대상으로 유역을 500m의 정방형 격자로 분할하고 수계망을 통하여 유역 출구까지 운동파이론에 의해 추적 계산하였으며, 수문곡선 비교결과 재현성 높은 결과를 보여주었다. 모형의 정확성 및 실용성에 대한 보다 정확한 평가를 위해서는 향후 다양한 강우 사상 혹은 다양한 크기의 유역에 대한 유출량의 재현성 및 매개변수 등에 검증이 이루어져야 할 것이다.

• Journal of KIISE:Software and Applications
• /
• v.30 no.10
• /
• pp.904-911
• /
• 2003

In this paper, we propose an effective method for the distinction between machine-printed and handwritten Korean address images. It is important to know whether an input image is handwritten or machine-printed, because methods for handwritten image are quite different from those of machine-printed image in such applications as address reading, form processing, FAX routing, and so on. Our method consists of three blocks: valid connected components grouping, feature extraction, and classification. Features related to width and position of groups of valid connected components are used for the classification based on a neural network. The experiment done with live Korean address images has demonstrated the superiority of the proposed method. The correct classification rate for 3,147 testing images was about 98.85%.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.39 no.2
• /
• pp.146-156
• /
• 2002

In this paper, a new virtual-straight line parameter determination methodology and fast time domain simulation technique for non-uniform interconnects are presented and verified. Time domain signal response of interconnects circuit considering the characteristic of non-linear transistor is performed by using model order reduction method. Since model order reduction method is peformed by using per unit length parameters, virtual- straight line parameters for non-uniform interconnects are determined. Its method is integrated into Berkeley SPICE and shown that time domain signal responses using proposed method have a good agreement with the results of conventional circuit simulator HSPICE. The proposed method can be efficiently employed in the high-performance VLSI circuit design since it can provide a fast and accurate time domain signal response of complicated multi - layer interconnects.

• Land and Housing Review
• /
• v.3 no.2
• /
• pp.187-193
• /
• 2012

A technology that newly attract attention in the area of energy-related study is the energy harvesting(or scavenging) technology. In this paper, the performance of power generation for the energy harvesting block with a combination of piezoelectric technology and electromagnetic technology among various energy harvesting technologies was investigated. The goal of this study is to evaluate on the applicability of our developed energy harvesting block into the field of urban & housing. First, we evaluated the performance of power generation for the multi-layer energy harvester at laboratory scale. Second, we described the features of our developed prototype module that includes amplification technologies to improve power density per module and evaluated the performance of power generation for the energy harvesting block in a variety of ways. From the test results, the developed product increased the performance of power generation up to 255% or 505% compared to the existing product and its superiority were shown. Finally, we suggested the direction for the improvement of the energy harvesting block module.

• Journal of IKEEE
• /
• v.26 no.3
• /
• pp.456-461
• /
• 2022

In this paper, a two-stage single-ended power amplifier (PA) with broadband gain characteristics was presented by utilizing a radio frequency (RF) transformer (TF), which is essential for a differential amplifier. The bandwidth of a PA can be improved by designing TF to have broadband characteristics and then applying it to the inter-stage matching network (IMN) of a PA. For broadband gain characteristics while maintaining the performance and area of the existing PA, an IMN was implemented on an monolithic microwave integrated circuit (MMIC) and a multi-layer printed circuit board (PCB), and the simulation results were compared. As a result of simulating the PA module designed using InGaP/GaAs HBT model, it has been confirmed that the PA employing the proposed design method has an improved fractional bandwidth of 19.8% at a center frequency of 3.3GHz, while the conventional PA showed that of 11.2%.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.3
• /
• pp.67-72
• /
• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.