• Textile Coloration and Finishing
• /
• v.22 no.1
• /
• pp.77-82
• /
• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• Journal of the Korean institute of surface engineering
• /
• v.50 no.1
• /
• pp.24-28
• /
• 2017

The electrodeposition of Ni-Co alloy from a sulfamate bath was investigated. The cobalt content in the Ni-Co deposits is more influenced by the temperature or stirring effect than the current density in the process parameters. As cobalt contents in the Ni-Co deposited layer increased from 0 wt.% up to 43 wt.%, hardness value of the layer rised from 400 Hv up to 700 Hv and crystal orientation (111) increased. However, (200) and crystal size significantly reduced. The tensile and yield strength also increased, while the modulus of elasticity showed the maximum value of $10.4N/mm^2$ at 29 wt.%.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.3
• /
• pp.242-250
• /
• 2003

Electrodeposition of Ni was carried out on copper substrate from Ni Sulfamate bath by DC and high frequency pulse current. During the electroplating, bath temperature was steady $60^{\circ}C$ , agitation was applied. Morphology and surface roughness of electrodeposits was investigated with the AFM. Crystalline structure of electrodeposits was investigated with XRD. Also, surface electric resistivity was investigated with 4-point probe. The result of crystalline structure by X-ray diffractometer, in the case of DC, <200> direction was dominant growing direction. But in the case of PC, the ratio of <200> direction vs. other direction decreased. As the pulse frequency increased, the enhanced properties of deposits were shown. With increasing frequency, the degree of surface properties increased DC more than that of PC, eg surface morphology, roughness and the degree of compactness of grains. With increasing duty cycle, the surface properties such as the degree of the morphology, roughness and electroconductivity was deteriorated.

• Journal of Welding and Joining
• /
• v.35 no.3
• /
• pp.1-6
• /
• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.708-711
• /
• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Proceedings of the KIEE Conference
• /
• 2000.07c
• /
• pp.2266-2268
• /
• 2000

본 논문에서는 스캐닝 미러의 일종으로, 광저장 장치의 픽업헤드용으로 미세회전을 하면서 레이저 빔을 편향시키는 용도로 사용되는 미러를 제작하고 구동실험을 하였다. 제작된 미러의 크기는 $2400{\times}2400{\times}64{\mu}m^3$이고, 빔 스프링은 $500{\times}9.6{\times}64{\mu}m^3$이다. 니켈 전해 도금으로 29${\mu}m$ 높이의 구동 전극을 제작하였고(세가지 모델: 공기통로가 없는 전극, 공기통로와 간격이 각각 200${\mu}m$인 전극, 공기통로와 간격이 각각 100${\mu}m$인 전극), 미러판과 전극을 조립하여(미러판과 전극 사이의 간격은 각각 29${\mu}m$, 26${\mu}m$, 26${\mu}m$) 구동실험을 하였다. 공진 주파수의 계산간은 576Hz, 측정값은 3개의 미러에서 모두 568Hz이었다. 전극과 미러판의 간격이 최대 접근거리 18${\mu}m$가 되도록 미세 회전을 시켰을 때, 공기통로가 없는 전극에서는 공진 주파수가 524Hz, 공기통로가 200${\mu}m$인 전극에서는 544Hz로 각각 감쇠되었고, 공기통로가 100${\mu}m$인 전극에서는 그대로 568Hz이었다.

• Proceedings of the KIEE Conference
• /
• 2005.07c
• /
• pp.2377-2379
• /
• 2005

본 논문은 유연한 영상표시 장치에 응용될 수 있는 중공음극방전 소사(hollow cathode discharge device)를 마이크로머시닝기술로 제작하고 시험한 결과를 보여준다. 중공음극방전은 평판음극방전에 비해서 전류밀도가 큰 장점이 있다. 방전 소자는 유연한 구조의 양극과 음극, 그리고 그 사이의 절연층으로 구성되어 있으면 소자의 크기는 $20mm{\times}10mm$이다. 방전이 일어나는 영역은 관통 구멍으로서 $7{\times}11$개가 배열되어 있고, 구멍의 직경은 $70{\mu}m$이다. 실리콘 기판 위에 SU-8 몰드를 형성한 후 니켈 전기도금으로 음극을 제작한다. 그 위에 폴리이미드를 스핀코팅하여 절연층을 이루고, 열증착으로 알루미늄 양극을 제작한 후, 실리콘과 SU-8을 제거하여 방전 소자를 완성한다. 진공챔버내 아르곤 가스 분위기에서 소자의 두 전극 간 전압을 변화시켜 가면서 전류-전압 특성을 측정하였고, 방전상태를 관찰하였다. 챔버 내의 절대압력이 260mmHg이고 인가전압이 230V 정도일 때 안정 방전이 관찰되었다

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.5 no.1
• /
• pp.1-7
• /
• 1995

The exposure levels of chromium and nickel for chromeplating workers were evaluated. Chromium and nickel concentrations in urine and serum from 82 exposed workers and 69 controls, who were not exposed occupationally to metals, were analyzed by flameless atomic absorption spectrophotometry. The results were as follows: 1. Chromium concentrations in urine of exposed group and control were $3.49{\pm}1.83g/g$ of creatinine, $5.59{\pm}2.83g/g$ of creatinine, and in serum were $0.69{\pm}0.30g/l$, $2.31{\pm}1.16g/l$ respectively. There were significant difference of concentrations for chromium in urine and serum by group respectively. 2. Nickel concentrations in urine of exposed group and control were $0.92{\pm}0.23g/g$ of creatinine, $2.20{\pm}1.93g/g$ of creatinine, and serum concentrations were $0.52{\pm}0.34g/l$, $1.41{\pm}0.74g/l$ respectively. There were significant difference of concentrations for nickel in serum by groups statistically. 3. Chromium and nickel concentrations in urine and serum of exposed groups were not significant by workplaces(grinding, electroplants, packaging).

• Journal of the Korean institute of surface engineering
• /
• v.47 no.5
• /
• pp.215-220
• /
• 2014

Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{\cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.

• Korean Journal of Metals and Materials
• /
• v.48 no.1
• /
• pp.90-100
• /
• 2010

Micro-conductive patterns were microfabricated on an insulating substrate ($SiO_2$) surface by a selective electroless nickel plating process in order to investigate the formation of seed layers. To fabricate micro-conductive patterns, a thin layer of metal (Cu.Cr) was deposited in the desired micropattern using laser-induced forward transfer (LIFT). and above this layer, a second layer was plated by selective electroless plating. The LIFT process. which was carried out in multi-scan mode, was used to fabricate micro-conductive patterns via electroless nickel plating. This method helps to improve the deposition process for forming seed patterns on the insulating substrate surface and the electrical conductivity of the resulting patterns. This study analyzes the effect of seed pattern formation by LIFT and key parameters in electroless nickel plating during micro-conductive pattern fabrication. The effects of the process variables on the cross-sectional shape and surface quality of the deposited patterns are examined using field emission scanning electron microscopy (FE-SEM) and an optical microscope.