• Title/Summary/Keyword: 나노 압입

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Errors of Surface Image Due to the Different Tip of Nano-Indenter (나노인덴터 압입팁의 특성에 따른 표면 이미지 오차 연구)

  • Kim, Soo-In;Lee, Chan-Mi;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.18 no.5
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    • pp.346-351
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    • 2009
  • Due to the decrease of line width and increase of the integration level of the device, it is expected that 'Bottom-up' method will replace currently used 'Top-down' method. Researches about 'Bottom-up' device production such as Nanowires and Nanobelts are widely held on. To utilize these technologies in devices, properties of matter should be exactly measured. Nano-indenters are used to measure the properties of nano-scale structures. Additionally, Nano-indenters provide AFM(Atomic Force Microscopy) function to get the image of the surface and get physical properties for exact position of nano-structure using this image. However, nano-indenter tips have relatively much bigger size than ordinary AFM probes, there occurs considerable error in surface image by Nano-Indenter. Accordingly, this research used 50nm Berkovich tip and 1um $90^{\circ}$ Conical tip, which are commonly used in Nano-Indenter. To find out the surface characteristics for each kind of tip, we indented the surface of thin layer by each tip and compared surface image and indentation depth. Then, we got image of 100nm-size structure by surface scanning using Nano-Indenter and compared it with surface image gained by current AFM technology. We calculated the errors between two images and compared it with theoretical error.

Influence of Indenter Tip Geometry and Poisson's Ratio on Load-Displacement Curve in Instrumented Indentation Test (계장화 압입시험의 하중-변위 곡선에 미치는 선단 형상 및 푸아송비의 영향)

  • Lee, Jin Haeng
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.943-951
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    • 2014
  • The tip geometries of the pyramidal and conical indenters used for micro/nano-indentation tests are not sharp. They are inevitably rounded because of their manufacturability and wear. In many indentation studies, the tip geometries of the pyramidal indenters are simply assumed to be spherical, and the theoretical solution for spherical indentation is simply applied to the geometry at a shallow indentation depth. This assumption, however, has two problems. First, the accuracy of the theoretical solution depends on the material properties and indenter shape. Second, the actual shapes of pyramidal indenter tips are not perfectly spherical. Hence, we consider the effects of these two problems on indentation tests via finite element analysis. We first show the relationship between the Poisson's ratio and load-displacement curve for spherical indentation, and suggest improved solutions. Then, using a possible geometry for a Berkovich indenter tip, we analyze the characteristics of the load-displacement curve with respect to the indentation depth.

Cracking Threshold Analysis for Nanoindetation Using 3D Finite-Element Method (3차원 유한요소법을 이용한 나노압입에 의한 균열발생 하한계 해석)

  • Koo, Jae-Mean
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.3
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    • pp.304-310
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    • 2004
  • In this paper, cracking threshold for nanoindentation is analyzed by using 3D finited-element method. The analysis by maximum principal stress criterion can obtain the reliable results for determining to crack initiation location and load. Because the ratio of maximum principal stress to indentation depth for Victors indentation is smaller than flat-plane-column indentation and cracking for Victors indentation occurs from the inner part of specimen difficult to measure crack length, the nanoindentation facture test for flat-plane-column indentation is more effective.

고체역학에서의 분자동역학 연구

  • 김성엽;전석기;임세영
    • Journal of the KSME
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    • v.44 no.3
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    • pp.46-54
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    • 2004
  • 이 글에서는 독자의 이해를 돕기 위해, 비교적 쉽게 전산모사 할 수 있는 균열진동해석, 나노압입 해석, 나노리소그래피 해석 등 세 가지에 대한 분자동역학 해석 결과를 소개한다.

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정전기력을 이용한 나노 힘 표준기

  • 김민석;최인묵;박연규;강대임
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.125-125
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    • 2004
  • 최근에 급속히 발달하고 있는 나노 기술(NT)파 생명공학 기술(BT)로 인해 미세한 영역에서의 역학적 측정이 중요시되고 있다. 질량, 힘, 온도, 압력 등의 기본적인 물리량들의 정확한 측정이 거시세계와 마찬가지로 나노 물질의 제조, 현상의 규명에 필수적인 요건이기 때문이다. 이중에서 미세 힘측정은 나노 압입 시험, 탄소나노튜브의 기계적 특성측정, MEMS 구조물의 특성평가, 근육 세포의 근력측정, DNA나 생체 분자력 측정 등 광범위하게 사용되고 있다.(중략)

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Elastic Properties Evaluation of Thin Films on Flexible Substrates with Consideration of Contact Morphology in Nanoindentation (나노압입시험에서의 접촉형상 보정을 통한 유연소자 박막의 탄성특성 평가)

  • Kim, Won Jun;Hwang, Gyeong-Seok;Kim, Ju-Young;Kim, Young-Cheon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.83-88
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    • 2020
  • The evolution of smartphones has led to numerous researches in the mechanical behavior of flexible devices. Due to the nano-size of the thin flexible film, nanoindentation is widely used to evaluate its mechanical behaviors, such as elastic modulus, and hardness. However, the commonly used Oliver-Pharr method is not suited for analyzing the indentation force-depth curves of hard films on soft substrates, as the effects of soft substrate is not considered theoretically. In this study, the elastic modulus of the thin film was evaluated with references to other reported models which include the substrate effect, and with calibration of the indentation depth for the pile-ups between the indenter and test surface. We fabricated test samples by deposition of amorphous metal film on polyimide and silicon wafers for verification of modified models.

Stress Conversion Factor on Penetration Depth of Knoop Indentation for Assessment of Nano Residual Stress (나노 잔류응력 측정을 위한 비등방 압입자의 깊이별 응력환산계수 분석)

  • Kim, Won Jun;Kim, Yeong Jin;Kim, Young-Cheon
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.95-100
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    • 2019
  • Nanoindentation has been widely used for evaluating mechanical properties of nano-devices, from MEMS to packaging modules. Residual stress is also estimated from indentation tests, especially the Knoop indenter which is used for the determination of residual stress directionality. According to previous researches, the ratio of the two stress conversion factors of Knoop indentation is a constant at approximately 0.34. However, the ratio is supported by insufficient quantitative analyses, and only a few experimental results with indentation depth variation. Hence, a barrier for in-field application exists. In this research, the ratio of two conversion factors with variation in indentation depth using finite elements method has been attempted at. The magnitudes of each conversion factors were computed at uniaxial stress state from the modelled theoretical Knoop indenter and specimen. A model to estimate two stress conversion factor of the long and short axis of Knoop indenter at various indentation depths is proposed and analyzed.

The Measurement Errors of Elastic Modulus and Hardness due to the Different Indentation Speed (압입속도의 변화에 따른 탄성계수와 경도의 오차 연구)

  • Lee, Kyu-Young;Lee, Chan-Bin;Kim, Soo-In;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.19 no.5
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    • pp.360-364
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    • 2010
  • Most research groups used two analysis methods (spectroscopy and nanotribology) to measure the mechanical properties of nano-materials: NMR (Nuclear Magnetic Resonance), IR (Infrared Spectroscopy), Raman Spectroscopy as the spectroscopy method and AFM (Atomic Force MicroScope), EFM (Electrostatic Force Microscope), KFM (Kelvin Force Microscope), Nanoindenter as the nanotribological one. Among these, the nano-indentation technique particularly has been recognized as a powerful method to measure the elastic modulus and the hardness. However, this technique are prone to considerable measurement errors with pressure conditions during measurement. In this paper, we measured the change of elastic modulus and hardness of an Al single crystal with the change of load, hold, and unload time, respectively. We found that elastic modulus and hardness significantly depend on load, hold, and unload time, etc. As the indent time was shortened, the elastic modulus value decreased while the hardness value increased. In addition, we found that elastic modulus value was more sensitive to indent load, hold, and unload time than the hardness value. We speculate that measurement errors of the elastic modulus and the hardness originate from the residual stress during indenting test. From our results, the elastic modulus was more susceptible to the residual stress than the hardness. Thus, we find that the residual stress should be controlled for the minimum measurement errors during the indenting test.

Structural Phase Transformations in Semiconductor Material Induced by Nanoindentation (나노압입에 의한 반도체 소재의 구조상전이 해석)

  • Kim, D.E.;Oh, S.I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.77-80
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    • 2006
  • Structural phase transformations of silicon during nanoindentation were investigated in detail at the atomic level. The molecular dynamics simulations of nanoindentation on the (100), (110) and (111) surface of single crystalline silicon were simulated, and this supported the theoretical prediction of the anisotropic behavior of structural phase transformations. Simulations showed that microscopic aspects of phase transformation varied according to the crystallographic orientation of the contact surface and were directly linked to the slip system.

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