• Explosives and Blasting
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• v.41 no.3
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• pp.38-61
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• 2023

An Excavation Damaged Zone(EDZ) caused by blasting impact changes rock properties, in situ stress distribution, etc., and its effects are noticeable at around a radioactive waste repository located at deep underground. In particular, the increase in permeability due to the formation of cracks may significantly increase the amount of groundwater inflow and the possibility of radioactive nuclide outflow. In this study, FLAC2D and FLAC3D were used to analyze the mechanical and thermal behaviors for three categories: a)No EDZ, b)Uniform EDZ, and c)Random EDZ. It was found that the tunnel displacement in the Random EDZ case was 423% higher than that in the No EDZ case and was 16% higher than that in the Uniform EDZ case. Tunnel inflow in the Random EDZ was also 17.3% and 10.8% higher than that in the No EDZ and the Uniform EDZ case, respectively. The permeability around the tunnel was increased by up to 10 times in the corner of the tunnel wall and roof due to the stress redistribution after excavation. From the computer simulation, it was found that the permeability around the tunnel wall was partially increased but the overall tunnel inflow was decreased with increase of stress ratio. Mechanical analysis using FLAC 3D showed similar results. Slight difference between 2D and 3D could be explained with the development of plastic zone during the advance of tunnel excavation in 3D.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.1
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• pp.11-20
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• 1994

GaAs and AlGaAs epi-layers were grown on semi-insulating (100) GaAs substrate by molecular beam epitaxy (MBE) and their electrical and optical properties have been investigated by several measurements. In undoped GaAs, the p-type GaAs layers with the good surface morphology were obtained under the growth conditions of the substrate temperatures ranging from 570 to $585^{\circ}C$ and the $As_4$/Ga ratios from 17 to 22. In the samples with the growth rates of the ranges of $0.9~1.1 {\mu}m/h$, the impurity concentrations were in the ranges of $1.5{\times}10^{14}~5.6{\times}10^{14}cm^{-3}$ with the Hall mobilities of $590~410cm^2/V-s$. In the Si-doped GaAs, the n-type GaAs layers with low electro trap, only two hole deep levels were observed with uniform doping profiles (<1%). AlGaAs layers with good surface morphology and crystallinity were grown under an optimum condition of the substrate temperature, $600^{\circ}C $. 8 deep level defects were observed between 0.17~0.85eV in undoped AlGaAs layers.

• Journal of the Korean Vacuum Society
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• v.6 no.4
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• pp.337-342
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• 1997

We have investigated Mossbauer effect and emission properties of the Fe-doped GaAs grown by liquid phase epitaxy (LPE). The powder type of isotope $^{57}Fe$ was used as a dopant source in LPE-GaAs. From the analysis of Mossbauer effect the value of isomer shift, 0.303$\pm$0.018 mm/sec, is calculated at low temperature. This means that charge state of Fe ion in GaAs is 3+. The results of double crystal x-ray rocking curve (DCRC) and low temperature photoluminescence (PL) show the crystal quality of the epitaxial layers are good. Unusual luminescence peaks from the Fe-GaAs epitaxial layers appeared at emission energy of 0.99 eV and 1.15 eV. We attribute these emissions to Fe-acceptor related two deep radiative centers.

• Korean Journal of Materials Research
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• v.8 no.7
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• pp.591-595
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• 1998

In this work, the freestanding GaN single crystalline substrates without cracks were grown by hydride vapor phase epitaxy (HVPE) and its some properties were investigated. The GaN substrate, having a current maximum size of 350 $\mu\textrm{m}$-thickness and 100$\textrm{mm}^2$ area, were obtained by HVPE growth of thick film GaN on sapphire substrate and subsequent mechanical removal of the sapphire substrate. A lattice constant of $C_o$= 5.18486 $\AA$ and a FWHM of DCXRD was 650 arcsec for the single crystalline GaN substrate. The low temperature PL spectrum consist of three excitonic emission and a deep D- A pair recombination at 1.8eV. The Raman E, (high) mode frequency was 567$cm^{-1}$ which was the same as that of strain free bulk single crystals. The Hall mobility and carrier concentration was 283$cm^3$<\ulcornerTEX>/ V.sand 1.1$\times$$10^{18}cm^{-3}$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.338-338
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• 2010

지난 20여년 동안 반도체 레이저 다이오드는 주로 CD (DVD) 픽업용 (파장: 640 nm 이하) 및 통신용 (파장 1550 nm) 광원 분야에서 집중적으로 개발되어 왔다. 그러나 기술의 개발과 더불어 파장조절이 비교적 자유로워지고 광출력이 증대 되면서 기존의 레이저 고유의 영역까지 그 응용분야기 확대되고 있고, 이에 따라 고출력 반도체 레이저 다이오드의 시장 규모도 꾸준히 증가되고 있는 상황이다. 고출력 반도체 레이저 다이오드는 발진 파장 및 광출력에 따라 다양한 분야에 응용되고 있으며, 특히 발진파장이 808 nm 인 고출력 레이저 다이오드의 경우 재료가공, 펌핑용 광원 (DPSSL, 광섬유 레이저), 의료, 피부미용 (점 제거), 레이저 다이오드 디스플레이 등 가장 다양한 응용분야를 가진 광원 중의 하나라고 할 수 있다. MBE(Molecular Beam Epitaxy)로 성장된 InAlAs 에피층 (epi-layer)을 사용하여 고출력을 갚는 레이저 다이오드를 제작함에 있어서, 에피층은 결함 (defect)이 없는 우수한 단결정이 요구되지만, 실제 결정 성장 과정에서는 성장온도와 Al 조성비 등의 성장 조건의 변화에 따라 전기적 광학적 특성 및 신뢰성에 큰 영향을 받는 것으로 보고되고 있다. 이에 본 연구에서는 DLTS (Deep Level Transient Spectroscopy) 방법을 이용하여 InAlAs 양자점 에피층의 깊은 준위 거동을 조사하였다. DLTS 측정 결과, 0.3eV 부근의 point defect과 0.57 ~ 0.70 eV 영역의 trap이 조사되었으며, 이는 갈륨 (Ga) vacancy와 산소 원자의 복합체에 기인한 결함으로 분석된다.

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.526-531
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• 1998

A hydride vapor phase epitaxy (HVPE) method was performed to grow the $10~240\mu{m}$ thick GaN films on (111) spinel $MgAl_2O_4$ substrate. The GaN films on $MgAl_2O_4$ substrate revealed a photoluminescence (PL) characteristics of the impurity doped GaN by the out-diffusion and auto-doping of Mg from $MgAl_2O_4$ substrate during GaN growth. The PL spectrum measured at 10K consists of free and bound excitons related recombination transitions and impurity-related donor-acceptor pair recombination and its phonon replicas. However, the deep-level related yellow band emission was not observed. The peak energy of neutral donor bound excitonic emission and the frequency of Raman $E_2$ mode were exponentially decreased with increasing the GaN thicknesses. and the frequency of E, Raman mode was shifted with the relation of $\Delta$$\omega$=3.93$\sigma$($cm^{-1}$/GPa), where l1 (GPa) is the residual strain in the GaN epilayers.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.209.1-209.1
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• 2013

GaP는 가시광선 발광다이오드을 얻을 수 있는 적절한 재료중의 하나로 해당영역의 파장에 대하여 높은 양자효율을 얻을 수 있고, 깊은 준위 재결합이 없기 때문에 GaP 녹색 및 As 첨가한 GaAsP 적색 LED 에 적용할 수 있습니다. 또한, 상온에서 2.2 eV 에 해당하는 넓은 에너지 밴드갭을 가지고 있으므로, 소음이 없는 자외선 검출기에도 적합합니다. 이 물질에 대한 소자들은 기존에 GaP 기판을 사용하였습니다. 최근, GaP 와 격자상수가 비슷한 Si 기판을 활용하여 그 위에 성장하는 방법에 대한 관심이 많아졌습니다. Si는 물리적 및 화학적으로 안정하고 딱딱한 소재이며 대면적 기판을 쉽게 얻을 수 있어 전자 기기 및 대규모 집적 회로의 좋은 소재입니다. Si 와 대조적으로 GaP은 깨지기 쉬운 재료이며 GaP 기판은 Si와 같은 대면적 기판을 얻을 수 없습니다. 이러한 문제의 한 가지 해결책은 Si 기판위에 GaP 층의 성장입니다. GaP 과 Si의 조합은 현재의 광전소자 들에 더하여 더 많은 응용프로그램들을 가능하게 할 것입니다. 그러나, Si 기판위에 GaP 성장 시 삼차원적 성장 및 역위상 경계면과 같은 문제점들이 발생하므로 질이 높고 균일한 결정의 GaP 를 얻기가 어렵습니다. 따라서, Si 에 GaP 의 성장시 초기 단계를 제어하는 성장 기술이 필요합니다. 본 연구에서는, 유기금속화학증착법을 이용하여 Si 기판위에 양질의 GaP를 얻을 수 있는 최적의 성장조건을 얻고자 합니다. 실험 조건은 Si에 GaP의 에피택셜 성장의 초기 단계에 영향을 주는 V/III 비율, 성장압력, 기판방향 등을 가변하는 조건으로 진행하였습니다. V/III 비율은 100~6400, 성장 압력은 76~380 Torr로 진행하였고, Si 기판은 just(001)과 2~6도 기울어진 (001) 기판을 사용하였습니다.

• Journal of IKEEE
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• v.26 no.1
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• pp.50-55
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• 2022

SiC is a power semiconductor with a wide bandgap, high insulation failure strength, and thermal conductivity, but many deep-level defects. Defects that appear in SiC can be divided into two categories, defects that appear in physical properties and interface traps that appear at interfaces. In this paper, Z_1/2 trap concentration 0 ~ 9×10¹⁴ cm^-3 reported at room temperature (300 K) is applied to SiC substrates and epi layer to investigate turn-on characteristics. As the trap concentration increased, the current density, Shockley-read-Hall (SRH), and Auger recombination decreased, and Ron increased by about 550% from 0.004 to 0.022 mohm.

• Korean Journal of Materials Research
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• v.34 no.2
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• pp.111-115
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• 2024

Silicon carbide (SiC) has emerged as a promising material for next-generation power semiconductor materials, due to its high thermal conductivity and high critical electric field (~3 MV/cm) with a wide bandgap of 3.3 eV. This permits SiC devices to operate at lower on-resistance and higher breakdown voltage. However, to improve device performance, advanced research is still needed to reduce point defects in the SiC epitaxial layer. This work investigated the electrical characteristics and defect properties using DLTS analysis. Four deep level defects generated by the implantation process and during epitaxial layer growth were detected. Trap parameters such as energy level, capture-cross section, trap density were obtained from an Arrhenius plot. To investigate the impact of defects on the device, a 2D TCAD simulation was conducted using the same device structure, and the extracted defect parameters were added to confirm electrical characteristics. The degradation of device performance such as an increase in on-resistance by adding trap parameters was confirmed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.11
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• pp.1-8
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• 2011

One of the most important parameters that limit maximum output power of transistor is breakdown. InAlAs/InGaAs/GaAs Metamorphic HEMTs (MHEMTs) have some advantages, especially for cost, compared with InP-based ones. However, GaAs-based MHEMTs and InP-based HEMTs are limited by lower breakdown voltage for output power even though they have good microwave and millimeter-wave frequency performance with lower minimum noise figure. In this paper, InAlAs/$In_xGa_{1-x}As$/GaAs MHEMTs are simulated and analyzed for breakdown. The parameters affecting breakdown are investigated in the fabricated 0.1-${\mu}m$ ${\Gamma}$-gate MHEMT device having the modulation-doped $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ heterostructure on the GaAs wafer using the hydrodynamic transport model of a 2D commercial device simulator. The impact ionization and gate field effect in the fabricated device including deep-level traps are analyzed for breakdown. In addition, Indium mole-fraction-dependent impact ionization rates are proposed empirically for $In_{0.52}Al_{0.48}As/In_xGa_{1-x}As$/GaAs MHEMTs.