• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.84-84
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• 2008

A multidimensional ZnO light-emitting diode LEDstructure comprising film/nanorods/substrate was fabricated on a p-type Si substrate using metal organic chemical vapor deposition at relatively low growth temperature. The filmlike top layer used for the metal contact was continuously formed on the ZnO nanorods by varying the growth conditions and the resulting structure allowed us to utilize the nanorods with intense emission as an active layer. We investigated the performance of the resulting multidimensional LED. An extremely high breakdown voltage and low reverse leakage current as well as typical rectification behavior were observed in the I-V characteristics.

• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• 대한기계학회논문집B
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• 제32권12호
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• pp.915-923
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• 2008

The performance experiments for a microchannel printed circuit heat exchanger (PCHE) of high-performance and high-efficiency on the two technologies of micro photo-etching and diffusion bonding were performed in this study. The microchannel PCHE were experimentally investigated for Reynolds number in ranges of 100 $\sim$ 700 under various flow conditions in the hot side and the cold side. The inlet temperatures of the hot side were conducted in range of $40^{\circ}C\;{\sim}\;50^{\circ}C$ while that of the cold-side were fixed at $20^{\circ}C$. In the flow pattern, the counter flow was provided 6.8% and 10 $\sim$ 15% higher average heat transfer rate and heat transfer performance than the parallel flow, respectively. The average heat transfer rate, heat transfer performance and pressure drop increases with increasing Reynolds number in all the experiment. The increasing of inlet temperature in the experiment range has not an effect on the heat transfer performance while the pressure drop decrease slightly with that of inlet temperature. The experimental correlations to the heat transfer coefficient and pressure drop factor as a function of the Reynolds number have been suggested for the microchannel PCHE.

• 마이크로전자및패키징학회지
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• 제9권1호
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• pp.49-52
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• 2002

본 연구를 통하여 저온 반도체 공정용 정전퍽(ESC)을 테이프캐스팅 공정에 의하여 스테인레스스틸에 소다붕규산염유리가 도포된 형태로 제작할 수 있음을 입증하였다. 스테인레스스틸 기판위의 유리 도포층은 125 $\mu\textrm{m}$의 두께로 제작되었다. 유리 도포층의 접합력은 매우 우수하여 $300^{\circ}C$이상의 온도변화에서도 균열이나 층간갈라짐 현상이 발생하지 않았다. 정전 고착압력은 전반적으로 이론적 관계인 전압의 제곱에 비례하는 경향을 보였으나, 고온과 고인가전압에서는 이 관계에서 벗어나는 것으로 나타났다. 이러한 이탈현상은 고온과 고인가전압에서 전기비저항의 감소에 따른 누설전류의 증가에 기인한다.

• 설비공학논문집
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• 제21권9호
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• pp.475-482
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• 2009

The objectives of this paper are to study the characteristics of heat transfer and pressure drop of the zigzag channel PCHE using diffusion bonding technology by numerical analysis. PCHE of five types are designed, which are zigzag channel angle 180$^{\circ}$, 160$^{\circ}$, 140$^{\circ}$, 120$^{\circ}$ and 100$^{\circ}$. The zigzag PCHE was numerically investigated for Reynolds number in a range of 150$\sim$800. The temperatures of the hot side were performed at 80$^{\circ}$ while that of the cold side was conducted at 20$^{\circ}C$. The results show that the performance of heat transfer rate for zigzag channel 100$^{\circ}$ increases about 11.5% compared to that of zigzag channel 180$^{\circ}$. On the other hand, the performance of pressure drop for zigzag channel 100$^{\circ}$ is remarkably higher than that of zigzag channel 180$^{\circ}$, about 2.4 times.

• 한국재료학회지
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• 제14권5호
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• pp.315-321
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• 2004

The void evolution in direct bonding process of $Si/Si_3$$N_4$ ∥ $SiO_2$/Si silicon wafer pairs has been investigated with an infrared camera. The voids that formed in the premating process grew in the conventional furnace annealing process at a temperature of $600^{\circ}C$. The voids are never shrunken even with the additional annealing process at the higher temperatures. We observed that the voids became smaller and disappeared with sequential scanning by our newly proposed fast linear annealing(FLA). FLA irradiates the focused line-shape halogen light on the surface while wafer moves from one edge to the other. We also propose the void shrinking mechanism in FLA with the finite differential method (FDM). Our results imply that we may eliminate the voids and enhance the yield for the direct bonding of wafer pairs by employing FLA.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 G
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• pp.3313-3315
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• 1999

Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera respectively. A bond characteristic on the interface was analyzed by using IT- IR. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si $OH{\cdots}(HOH{\cdots}HOH{\cdots}HOH){\cdots}OH-Si$. The bond strength depends on the HF pre-treatment condition before pre- bonding (Min:$2.4kgf/crn^2{\sim}Max:14.9kgf/crn^2$)

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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• pp.142-146
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• 2005

패턴화된 ITO (indium tin oxide)/Glass 기판 위에 정공수송층인 PEDOT:PSS [poly(3,4-othylenedioxythiophene):poly(styrene sulfolnate)]와 발광층인 MEH-PPV [poly(2-methoxy-5-(2-ethyhexoxy)-1,4phenylenvinylene)]를 사용하여 ITO/PEDOT:PSS/MEH-PPV/AI 구조를 갖는 고분자 유기 발광다이오드 (polymer light emitting diode: PLED)를 제작하였다. PLED 제작시 MEH-PPV 의 농도를 ($0.1\;wt\%\;{\~}\;0.9\;wt\%$) 변수로 하여 박막의 표면 거칠기와 박막 층의 마찰재수(friction coefficient) 측정을 통하여 농도에 따른 특성 변화를 조사하였다. MEH-PP 의 농도를 $0.1\;wt\%$ 에서 $0.9\;wt\%$ 로 증가함에 따라 발광 층의 RMS (root mean square)같은 1.72 nm 에서 1.00 nm 로 감소하여 거칠기가 개선되는 경향을 보여 주었다. 그러나 박막간의 마찰계수는 0.048 에서 0.035 로 감소하여 박막간의 접합상태가 나빠지는 현상을 나타내었다. 소자의 전기, 광학적 특성의 경우 MEH-PPV 농도가 $0.5\;{\~}\;0.9\;wt\%$ 범위에서 약 0.35 mA (at 9V)의 전류밀도를 나타내었으며, 최대 휘도는 $0.5\;wt\%$ 농도에서 $409\;cd/m^2$의 값을 나타내었다.

• 한국항공우주학회지
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• 제50권1호
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• pp.31-38
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• 2022

위성용 TR모듈이 지상용 또는 항공용 TR모듈과 다른 점은 높은 레벨의 진동, 충격과 같은 발사환경과 우주방사능, 진공, 온도 변화와 같은 궤도환경 고려가 필요하다는 것이다. 따라서 지상용 또는 항공용 요구사양과는 다른 전기적, 구조적 조건을 요구한다. 이에 따라 서론에서는 발사환경, 궤도환경에 대해서 서술하고, 본문에서는 위성용 TR모듈에서 GaN의 활용과 요구되는 조건을 충족하기 위한 설계 과정을 기술한다. 특히, 부품선정부터 Derating&RF Budget 설계, 공정설계, 열해석까지 각각 단계에서 고려할 설계요소에 대해서 서술한다.